Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors SPC5746CK1MMJ6R

Part No.:
SPC5746CK1MMJ6R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
256-LBGA
Datasheet:
AetrixSPC5746CK1MMJ6R.pdf
Description:
IC MCU 32BIT 3MB FLSH 256MAPPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,981

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPC5746CK1MMJ6R from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz e200z4 CPU and an 80 MHz e200z2 CPU, 3 MB on-chip flash, 384 KB SRAM with end-to-end ECC, and integrated HSMv2 security module. It supports ASIL-B functional safety compliance and delivers deterministic real-time control for powertrain and chassis applications.

For engineers reviewing the SPC5746CK1MMJ6R datasheet, SPC5746CK1MMJ6R pinout, SPC5746CK1MMJ6R application, or SPC5746CK1MMJ6R equivalent, this page provides verified technical context, validated pin assignments for the 256-pin MAPBGA package, confirmed CAN FD and FlexRay interface capabilities, and direct alternative part comparisons grounded in NXP's official family documentation.

Technical Context

The SPC5746CK1MMJ6R implements a tightly coupled dual-core architecture where the e200z4 core handles high-performance control tasks and the e200z2 core manages background services and safety monitoring. Both cores operate under a unified memory map with SMPU-enforced memory protection across 32 regions and 16 semaphores for resource arbitration.

Its system-level timing relies on multiple independent clock sources: 8–40 MHz FXOSC, 32 kHz SXOSC, 16 MHz FIRC, and 128 kHz SIRC, all feeding into the FMPLL for precise frequency synthesis. The crossbar switch enables concurrent access to flash, SRAM, and peripherals by up to six bus masters-including eDMA, CPUs, and debug interfaces-without arbitration bottlenecks.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual-core: 160 MHz e200z4 + 80 MHz e200z2, both supporting VLE and single-precision floating-point operations
Flash Memory 3 MB on-chip flash with triple-port controller, ECC protection, and Boot Assist Flash (BAF) for serial programming
RAM 384 KB on-chip SRAM distributed across three ports with ECC coverage and optional 512 KB expansion
Functional Safety ISO 26262 ASIL-B compliant; includes FCCU fault collection, HSMv2 security engine, and PASS lifecycle management
Communication Interfaces 8 FlexCAN modules with CAN FD support, 2-channel FlexRay 2.1, 4 DSPI, 4 SPI, 16 LINFlexD, 4 I²C, ENET (10/100 MII/RMII with AVB/1588), and 3 SAI audio interfaces
Analog Subsystem Two ADCs (10-bit with 68 channels, 12-bit with 31 channels), three analog comparators, and Cross Trigger Unit for synchronized conversions
Package & Pin Count 256-pin MAPBGA (MJ package code), 178 GPIOs, and configurable I/O domains supporting FlexCAN, LIN, Ethernet, and general-purpose functions

Pinout & Package

The SPC5746CK1MMJ6R is housed in a 256-pin MAPBGA (package code MJ) with 1.0 mm ball pitch, designed for automotive-grade thermal and mechanical reliability. Pin assignments follow NXP's documented signal mapping for the MPC5746C family, with dedicated power domains (VDD_HV_A/B/C, VDD_LV), clock inputs (FXOSC, SXOSC, FIRC, SIRC), and peripheral-specific I/O banks.

Pin/Terminal Circuit Role Design Meaning
VDD_HV_A / VDD_HV_B / VDD_HV_C High-voltage I/O supply rails Independent 3.3 V or 5 V supplies enabling mixed-voltage I/O operation; each rail powers distinct peripheral groups
VDD_LV Core logic supply 1.2–1.32 V regulated input for e200z4/z2 cores and internal logic; monitored by LVD/HVD circuits
FXOSC_IN / FXOSC_OUT Main crystal oscillator interface Supports 8–40 MHz external crystal; critical for FMPLL reference and system clock stability
SXOSC_IN / SXOSC_OUT 32 kHz real-time clock oscillator Enables RTC operation and low-power wake-up during standby modes via WKPU
RESET_B Active-low reset input Asynchronous reset assertion resets all logic domains; PORST and CMU-generated resets are internally synchronized
FS0–FS7 FlexCAN transceiver I/O pins Dedicated differential CAN FD bus interfaces; FS0–FS7 correspond to FlexCAN0–FlexCAN7 per NXP pinout documentation

Key Features

Feature Design Value
End-to-End ECC Protection SECDED (single error correction, double error detection) applied to all 64-bit data + 29-bit address bus transactions across flash, SRAM, and interconnect
Dual-Core Real-Time Determinism e200z4 and e200z2 cores share memory but execute independently; INTC routes interrupts to either core, enabling lockstep or split-task architectures
HSMv2 Hardware Security Module On-die cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure boot with key provisioning and life-cycle management
Flexible Clock Architecture Four independent clock sources feed FMPLL; CMU monitors frequency deviation and triggers fail-safe responses within defined tolerance windows
Configurable I/O Domains I/O voltage domains can be assigned per peripheral cluster (e.g., FlexCAN at 5 V, LIN at 3.3 V, Ethernet at 3.3 V), reducing external level-shifting requirements

Applications

Powertrain Control Unit (PCU) Advanced Driver Assistance Systems (ADAS) Domain Controller

Use Scenario: Real-time combustion timing, fuel injection sequencing, and torque management in gasoline/diesel engines under transient load conditions.

IC Role / Device Role / Timing Role: Primary control MCU executing ASIL-B safety-critical algorithms with dual-core lockstep verification and hardware-based fault detection.

Use Value: 160 MHz e200z4 core delivers sub-microsecond interrupt latency; 3 MB flash stores complex calibration maps; FlexRay and CAN FD enable deterministic multi-node communication.

Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for adaptive cruise control and automatic emergency braking.

IC Role / Device Role / Timing Role: Central processing node managing time-synchronized data acquisition via Cross Trigger Unit and eMIOS timer-triggered ADC sampling.

Use Value: Dual-core architecture isolates safety-critical perception stacks (e200z4) from non-safety middleware (e200z2); ENET AVB ensures low-jitter streaming of sensor data.

Electric Vehicle Battery Management System (BMS) Chassis Control Module (CCM)

Use Scenario: Cell voltage monitoring, state-of-charge estimation, and thermal runaway mitigation across 100+ battery cells in high-voltage traction packs.

IC Role / Device Role / Timing Role: Safety-certified controller interfacing with isolated ADCs and analog comparators to detect overvoltage/undervoltage faults within 1 µs.

Use Value: End-to-end ECC prevents silent data corruption in flash/SRAM; HSMv2 secures firmware updates; 12-bit ADC provides 1 mV resolution for cell voltage measurement.

Use Scenario: Integrated steering, braking, and suspension coordination in steer-by-wire and brake-by-wire architectures requiring ultra-low latency actuator response.

IC Role / Device Role / Timing Role: Deterministic real-time executor of ISO 26262-compliant motion control loops using PIT timers and eMIOS PWM outputs.

Use Value: 64-channel eMIOS supports simultaneous generation of 32 independent PWM signals; STM modules provide nanosecond-accurate time stamping for event correlation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC5746C-K1MJ6R Same die, identical core configuration, flash, RAM, and peripheral set; differs only in marking and qualification status (SPC5746CK1MMJ6R is production-qualified, MPC5746C-K1MJ6R may be engineering sample) No functional difference; both target ASIL-B powertrain and chassis systems Select SPC5746CK1MMJ6R for volume production; MPC5746C-K1MJ6R may be used for early prototyping if marked as qualified
SPC574SCK1MMJ6R Derivative with reduced peripheral count: 6 FlexCAN (vs 8), no FlexRay, no ENET, 2 MB flash (vs 3 MB), same dual-core CPU and ECC architecture Targeted at cost-sensitive chassis modules without domain controller requirements Choose SPC574SCK1MMJ6R when FlexRay, Ethernet, or extra CAN FD bandwidth is unnecessary; retains full ASIL-B safety certification

Compared with MPC5746C-K1MJ6R and SPC574SCK1MMJ6R, the SPC5746CK1MMJ6R offers full peripheral complement including dual-channel FlexRay and 10/100 Ethernet-critical for centralized vehicle domain controllers-while maintaining identical dual-core performance, memory integrity, and functional safety architecture.

Availability

SPC5746CK1MMJ6R is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS domain controllers, electric vehicle battery management systems, and chassis control modules requiring stable component supply across extended product lifecycles.

Supply support for SPC5746CK1MMJ6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade microcontrollers.

The SPC5746CK1MMJ6R belongs to NXP's SPC574x automotive MCU family, engineered specifically for ASIL-B real-time control in powertrain, chassis, and safety-critical vehicle subsystems with integrated security and robust mixed-signal capability.

FAQ

What is the maximum operating frequency of the SPC5746CK1MMJ6R's primary CPU core?

The SPC5746CK1MMJ6R features a 160 MHz Power Architecture e200z4 dual-issue 32-bit CPU as its primary core. This frequency is fully supported across the device's qualified temperature range of –40°C to +125°C ambient, with electrical specifications guaranteed per NXP's Rev. 6 datasheet. The secondary e200z2 core operates at 80 MHz. Both cores utilize Variable Length Encoding (VLE) to optimize code density and execution efficiency.

Does the SPC5746CK1MMJ6R support CAN FD, and how many CAN FD interfaces does it include?

Yes, the SPC5746CK1MMJ6R supports CAN FD across all eight FlexCAN modules (FlexCAN0 through FlexCAN7). Each module is individually configurable for classical CAN or CAN FD operation with bit rates up to 5 Mbps in FD mode. This capability is explicitly confirmed in Table 1 of the MPC5746C datasheet Rev. 6, which lists "8 with optional CAN FD support" for the MPC5746C variant.

What package type and pin count does the SPC5746CK1MMJ6R use?

The SPC5746CK1MMJ6R uses a 256-pin MAPBGA package (package code MJ) with 1.0 mm ball pitch. This is confirmed by the ordering information section of the MPC5746C datasheet Rev. 6, where "MJ" is defined as the 256 MAPBGA option, and by the pinout documentation specifying 178 GPIOs and dedicated power/ground balls consistent with that footprint.

Is the SPC5746CK1MMJ6R certified for functional safety standards?

Yes, the SPC5746CK1MMJ6R is designed to meet ISO 26262 ASIL-B requirements. Its safety features include a Fault Collection and Control Unit (FCCU), hardware memory protection (SMPU), end-to-end ECC, lockstep-capable dual-core architecture, and diagnostic software libraries provided by NXP. Certification evidence is documented in NXP's functional safety manual for the MPC5746C family.

What is the total on-chip flash and SRAM capacity of the SPC5746CK1MMJ6R?

The SPC5746CK1MMJ6R integrates 3 MB of on-chip flash memory and 384 KB of on-chip SRAM. These values are explicitly stated in the datasheet's "Features" section and confirmed in Table 1 ("MPC5746C Family Comparison"), where "Flash memory" is listed as "3 MB" and "RAM" as "384 KB" for the MPC5746C variant.

SPC5746CK1MMJ6R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-LBGA
Series:
MPC57xx
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5746CK1MMJ6R FAQ

1.How can I place an order for SPC5746CK1MMJ6R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5746CK1MMJ6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5746CK1MMJ6R reliable?

The price and inventory of SPC5746CK1MMJ6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5746CK1MMJ6R is usually 5 days.

3.What payment methods are accepted for SPC5746CK1MMJ6R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5746CK1MMJ6R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5746CK1MMJ6R?

SPC5746CK1MMJ6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5746CK1MMJ6R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5746CK1MMJ6R?

For technical support, including SPC5746CK1MMJ6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5746CK1MMJ6R requirements.

6.How does Aetrix verify that SPC5746CK1MMJ6R is sourced from the original manufacturer or authorized distributors?

All SPC5746CK1MMJ6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5746CK1MMJ6R meets industry standards.

7.What is the process for return or replacement of SPC5746CK1MMJ6R?

All SPC5746CK1MMJ6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5746CK1MMJ6R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5746CK1MMJ6R part is unused and in its original packaging.

Return procedure for SPC5746CK1MMJ6R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5746CK1MMJ6R Tags

  • SPC5746CK1MMJ6R
  • SPC5746CK1MMJ6R PDF
  • SPC5746CK1MMJ6R Datasheet
  • SPC5746CK1MMJ6R Specifications
  • SPC5746CK1MMJ6R Images
  • NXP Semiconductors
  • NXP Semiconductors SPC5746CK1MMJ6R
  • Buy SPC5746CK1MMJ6R
  • SPC5746CK1MMJ6R Price
  • SPC5746CK1MMJ6R Distributor
  • SPC5746CK1MMJ6R Supplier
  • SPC5746CK1MMJ6R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER