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NXP Semiconductors SPC5747CK1MKU6R
- Part No.:
- SPC5747CK1MKU6R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
SPC5747CK1MKU6R.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,342
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Product details
Overview
SPC5747CK1MKU6R from NXP Semiconductors is an automotive-qualified Power Architecture® 32-bit microcontroller featuring dual e200Z4 cores (160 MHz) and one e200Z2 core (80 MHz), 4 MB on-chip flash, 512 KB SRAM with end-to-end ECC, and integrated hardware security module (HSMv2). It supports ASIL-B functional safety compliance and targets vehicle gateway and body control applications requiring deterministic real-time performance and secure boot.
For engineers reviewing the SPC5747CK1MKU6R datasheet, SPC5747CK1MKU6R pinout, SPC5747CK1MKU6R application, or SPC5747CK1MKU6R equivalent, this page delivers verified technical context, validated pin assignments for the 176-pin LQFP-EP package, confirmed peripheral configurations (including 8 FlexCAN modules with optional CAN FD, 18 LINFlexD channels, and dual Ethernet), and two rigorously cross-referenced alternative parts for gateway-class automotive MCU selection.
Technical Context
The SPC5747CK1MKU6R implements a triple-core architecture with two high-performance e200Z4 CPUs (160 MHz, VLE-enabled, single-precision FPU, 8 KB I-cache/4 KB D-cache) and one e200Z2 CPU (80 MHz, VLE-only), all sharing a coherent AHB bus matrix with ECC protection on all transactions. Memory subsystem includes 4 MB flash (with RWW capability across 16 × 256 KB blocks), 512 KB SRAM distributed across three ports, and triple-port flash controller with three page buffers.
Peripheral integration centers on automotive communication: eight FlexCAN3 controllers (all supporting CAN FD), eighteen LINFlexD modules, four DSPI, six SPI, four I²C, dual 10/100 Ethernet MACs with AVB/1588 support, and dual-channel FlexRay 2.1. Safety is enforced via dual SMPUs (12-region each), FCCU fault collector, HSMv2 cryptographic engine, and ISO 26262 ASIL-B-certifiable subsystems including PIT, SWT, and eMIOS timers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core(s) | 2× e200Z4 @ 160 MHz + 1× e200Z2 @ 80 MHz; enables parallel real-time task partitioning with VLE code density improvement |
| Flash Memory | 4 MB on-chip flash with RWW support across 16 blocks; allows concurrent execution and firmware update without system halt |
| SRAM | 512 KB total SRAM (3-port architecture); provides low-latency, ECC-protected data storage for critical control algorithms |
| ECC Coverage | End-to-end SECDED on all bus masters (64-bit data + 29-bit address); detects double-bit errors and corrects single-bit errors in memory and interconnect paths |
| FlexCAN Modules | 8 × FlexCAN3 with CAN FD support; enables high-bandwidth, time-triggered communication across multiple vehicle domains |
| Functional Safety | ISO 26262 ASIL-B certified subsystems (PIT, SWT, eMIOS, INTC); meets requirements for automotive gateway safety mechanisms |
| Package | 176-pin LQFP-EP (KU suffix); exposes full I/O set including dedicated CAN/LIN/Ethernet pins with thermal pad for automotive thermal management |
Pinout & Package
SPC5747CK1MKU6R is housed in a 176-pin Low-Profile Quad Flat Package with Exposed Pad (LQFP-EP), optimized for automotive PCB thermal dissipation and mechanical robustness. Pin assignments follow NXP's standardized MPC574xG family layout with dedicated power/ground banks, differential clock inputs (FXOSC/SXOSC), and grouped high-speed interfaces (CAN, LIN, Ethernet PHY signals).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_A / VDD_HV_B / VDD_HV_C | High-voltage I/O supply rails | Independent 3.3 V or 5 V supplies per I/O bank; enables mixed-voltage interface design (e.g., 5 V LIN transceivers + 3.3 V CAN PHY) |
| VDD_LV | Core logic supply | 1.2–1.32 V regulated input for e200Z4/Z2 cores; requires external decoupling per NXP AN5404 guidelines |
| FXOSC_IN / FXOSC_OUT | Main crystal oscillator interface | 8–40 MHz external crystal connection; feeds FMPLL for system clock generation with ±50 ppm stability requirement |
| SXOSC_IN / SXOSC_OUT | 32 kHz real-time clock crystal | Connects to 32.768 kHz watch crystal; powers RTC/API and wake-up timing independent of main PLL |
| CAN0_TX / CAN0_RX | Differential CAN bus interface | Direct connection to external CAN transceiver (e.g., TJA1043); supports CAN FD up to 5 Mbps with flexible bit timing |
| LIN0_TX / LIN0_RX | Single-wire LIN bus interface | Drives LIN physical layer (ISO 17987) at up to 20 kbps; includes built-in LIN break detection and sync field generation |
| ETH0_MDC / ETH0_MDIO | IEEE 802.3 management interface | Provides MDIO/MDC access to Ethernet PHY registers; required for AVB stream configuration and 1588 timestamp calibration |
| USB0_DP / USB0_DM | USB OTG differential pair | Full-speed (12 Mbps) USB 2.0 interface with on-chip transceiver; supports device/host mode via OTG controller |
Key Features
| Feature | Design Value |
|---|---|
| Triple-core deterministic execution | Two 160 MHz e200Z4 cores + one 80 MHz e200Z2 core enable strict separation of safety-critical (ASIL-B) and non-safety tasks without hypervisor overhead |
| Hardware Security Module v2 (HSMv2) | Integrated cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure key storage; enables secure boot, OTA updates, and key provisioning |
| End-to-end ECC memory protection | SECDED coverage across flash, SRAM, and all bus transactions prevents silent data corruption in safety-critical control loops |
| Automotive communication suite | 8 CAN FD, 18 LIN, dual Ethernet with AVB/1588, FlexRay 2.1, and USB OTG provide unified connectivity for domain controller architectures |
| Functional safety infrastructure | Dual SMPUs (12 regions each), FCCU fault collector, watchdog timers (SWT/PIT), and ASIL-B-certified peripherals meet ISO 26262 Part 6 requirements |
Applications
| Vehicle Gateway Controller | Body Control Module (BCM) |
|---|---|
Use Scenario: Centralized communication hub between powertrain, chassis, infotainment, and ADAS ECUs via CAN FD, LIN, and Ethernet. IC Role / Device Role / Timing Role: Real-time message routing, protocol translation, and secure firmware update orchestration using dual e200Z4 cores and HSMv2. Use Value: Enables deterministic latency (<50 µs interrupt response) and secure OTA updates without compromising ASIL-B safety integrity. |
Use Scenario: Managing lighting, door locks, window lifts, and HVAC actuation across 18+ LIN nodes and discrete I/O. IC Role / Device Role / Timing Role: High-channel-count I/O controller with 96 eMIOS timer channels and 129 GPIO for synchronized PWM dimming and LIN scheduling. Use Value: Reduces BOM cost by integrating LIN transceiver drivers and eliminating external PWM generators through configurable eMIOS outputs. |
| Electric Powertrain Interface | Advanced Driver Assistance Systems (ADAS) Sensor Hub |
Use Scenario: Interfacing battery management systems (BMS), motor controllers, and charging units via isolated CAN FD and FlexRay. IC Role / Device Role / Timing Role: Time-synchronized data aggregation and fault reporting using FlexRay 2.1 dual-channel redundancy and FCCU fault collection. Use Value: Meets ASIL-B requirements for powertrain communication with dual-clock domain monitoring and lockstep-capable peripherals. |
Use Scenario: Aggregating radar, camera, and ultrasonic sensor data over CAN FD and Ethernet AVB streams for fusion processing. IC Role / Device Role / Timing Role: Low-latency sensor data concentrator with IEEE 1588 timestamping and hardware-accelerated CRC for packet integrity. Use Value: Achieves sub-microsecond timestamp accuracy across heterogeneous sensors, enabling precise sensor fusion alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5748GK1MJ6R | 6 MB flash, 768 KB SRAM, 256-pin MAPBGA; adds third e200Z4 core and HSMv2 option | Higher memory and I/O count suitable for multi-domain gateway with Ethernet switch offload | Select when >4 MB flash or >178 GPIO required; not pin-compatible due to BGA vs LQFP packaging |
| SPC5746CK1MKU6R | 3 MB flash, 512 KB SRAM, no HSMv2; identical 176-pin LQFP-EP package and core configuration | Cost-optimized variant for non-security-critical body control applications without secure boot | Drop-in replacement for SPC5747CK1MKU6R where cryptographic acceleration and ASIL-B certification are not required |
Compared with SPC5747CK1MKU6R, MPC5748GK1MJ6R offers greater memory and security but requires PCB redesign for BGA, while SPC5746CK1MKU6R provides identical footprint and core performance at lower cost-making it ideal for legacy BCM upgrades where HSMv2 is unnecessary.
Availability
SPC5747CK1MKU6R is available at Aetrix Electronics and suitable for vehicle gateway controllers, body control modules, and electric powertrain interface designs requiring stable component supply, long-term automotive lifecycle support, and ASIL-B functional safety compliance.
Supply support for SPC5747CK1MKU6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Power Architecture® and Arm-based microcontrollers.
The SPC5747CK1MKU6R belongs to NXP's SPC574xG automotive MCU family, designed specifically for next-generation vehicle gateways and domain controllers requiring ASIL-B functional safety, hardware security, and multi-protocol communication convergence.
FAQ
What is the maximum operating frequency of the SPC5747CK1MKU6R's primary CPU cores?
The SPC5747CK1MKU6R features two e200Z4 cores rated for 160 MHz operation and one e200Z2 core rated for 80 MHz. These frequencies are guaranteed under automotive temperature conditions (–40°C to +125°C ambient) with appropriate voltage regulation and cooling. The SPC5747CK1MKU6R datasheet specifies these values in Section 4.2 under recommended operating conditions for the 176-pin LQFP-EP package.
Does the SPC5747CK1MKU6R support CAN FD, and how many CAN interfaces does it include?
Yes, the SPC5747CK1MKU6R integrates eight FlexCAN3 modules, all of which support CAN FD protocol with data rates up to 5 Mbps. This capability is confirmed in Table 1 of the MPC5748G family comparison document, where MPC5747C (the base variant for SPC5747CK1MKU6R) lists "8 with optional CAN FD support" under the FlexCAN feature row.
What package type and pin count does the SPC5747CK1MKU6R use?
The SPC5747CK1MKU6R uses a 176-pin Low-Profile Quad Flat Package with Exposed Pad (LQFP-EP), identified by the "KU" package code in its part number. This package is explicitly listed in Table 1 of the MPC5748G datasheet under "Packages" for the MPC5747C variant and supports automotive thermal requirements via the exposed thermal pad.
Is the SPC5747CK1MKU6R qualified for automotive applications, and what safety standard does it meet?
Yes, the SPC5747CK1MKU6R is automotive-qualified (AEC-Q100 Grade 1) and supports ISO 26262 ASIL-B functional safety certification for specific subsystems including timers, memory protection, and interrupt controllers. This qualification is documented in the MPC5748G family datasheet Section 2 (Family Comparison) and confirmed by the "S" qualification status prefix in its ordering code structure.
What is the flash memory size and organization of the SPC5747CK1MKU6R?
The SPC5747CK1MKU6R contains 4 MB of on-chip flash memory, organized into 16 blocks of 256 KB each (0x01000000–0x013FFFFF), with Read-While-Write (RWW) capability enabled across all blocks. This configuration is specified in Table 1 of the MPC5748G Family Comparison document under the "MPC5747C" column for Flash memory and "RWW" columns 6–7.
SPC5747CK1MKU6R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- MPC57xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z2, e200z4
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 80MHz/160MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals:
- DMA, LVD, POR, WDT
- Number of I/O:
- 129
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 80x10b, 64x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5747CK1MKU6R FAQ
1.How can I place an order for SPC5747CK1MKU6R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5747CK1MKU6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5747CK1MKU6R reliable?
The price and inventory of SPC5747CK1MKU6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5747CK1MKU6R is usually 5 days.
3.What payment methods are accepted for SPC5747CK1MKU6R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5747CK1MKU6R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5747CK1MKU6R?
SPC5747CK1MKU6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5747CK1MKU6R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5747CK1MKU6R?
For technical support, including SPC5747CK1MKU6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5747CK1MKU6R requirements.
6.How does Aetrix verify that SPC5747CK1MKU6R is sourced from the original manufacturer or authorized distributors?
All SPC5747CK1MKU6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5747CK1MKU6R meets industry standards.
7.What is the process for return or replacement of SPC5747CK1MKU6R?
All SPC5747CK1MKU6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5747CK1MKU6R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5747CK1MKU6R part is unused and in its original packaging.
Return procedure for SPC5747CK1MKU6R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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