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NXP Semiconductors SPC5747CK1MMJ6
- Part No.:
- SPC5747CK1MMJ6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 256-LBGA
- Datasheet:
-
SPC5747CK1MMJ6.pdf
- Description:
- IC MCU 32BIT 4MB FLSH 256MAPPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,207
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Product details
Overview
SPC5747CK1MMJ6 from NXP Semiconductors is an automotive-qualified Power Architecture® microcontroller featuring dual 160 MHz e200z4 cores and one 80 MHz e200z2 core, 4 MB on-chip flash, 512 KB SRAM with end-to-end ECC, and integrated FlexCAN, LIN, DSPI, and Ethernet interfaces. It targets vehicle gateway and body control modules requiring ASIL-B functional safety compliance and secure boot via HSMv2.
For engineers reviewing the SPC5747CK1MMJ6 datasheet, SPC5747CK1MMJ6 pinout, SPC5747CK1MMJ6 application, or SPC5747CK1MMJ6 equivalent, this page delivers verified technical context, package mapping to 256-pin MAPBGA (MJ), validated pin functions, real-world use scenarios in automotive networking, and two confirmed alternative parts with documented functional and packaging differences.
Technical Context
The SPC5747CK1MMJ6 implements a triple-core architecture with two high-performance e200z4 CPUs (160 MHz) supporting single-precision floating-point and VLE encoding, plus one e200z2 CPU (80 MHz) for dedicated real-time tasks. All cores share a unified memory map backed by 4 MB flash and 512 KB SRAM, both protected by SECDED ECC across all bus transactions.
Its peripheral set includes eight FlexCAN modules (CAN FD-capable), 18 LINFlexD channels, four DSPI controllers, six SPI interfaces, and dual Ethernet MACs with AVB/1588 support - all accessible via multiple crossbar switches enabling concurrent access from any bus master without arbitration bottlenecks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 2× e200z4 @ 160 MHz + 1× e200z2 @ 80 MHz; enables parallel execution of safety-critical and non-safety tasks |
| Flash Memory | 4 MB on-chip flash with 3-port controller and RWW capability; supports concurrent read/erase/program operations |
| SRAM | 512 KB on-chip SRAM across three ports with ECC; provides deterministic latency for real-time buffers and stack storage |
| ECC Protection | End-to-end SECDED (64-bit data + 29-bit address); corrects single-bit errors and detects double-bit faults across all memory and bus transactions |
| FlexCAN Channels | 8 CAN FD-capable controllers; enables high-bandwidth communication with legacy CAN and next-gen automotive networks |
| Package | 256-pin MAPBGA (MJ); 15 mm × 15 mm footprint with 0.8 mm pitch, optimized for automotive PCB thermal management |
| Functional Safety | ISO 26262 ASIL-B certified per core and peripheral cluster; includes FCCU fault collection and HSMv2 security module |
Pinout & Package
SPC5747CK1MMJ6 uses a 256-pin MAPBGA (MJ) package with 0.8 mm ball pitch and 15 mm × 15 mm body size. Thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_A / VDD_HV_B / VDD_HV_C | High-voltage I/O supply inputs | Independent 3.3 V or 5 V supplies for I/O banks; enable mixed-voltage interface design with configurable voltage domains |
| VDD_LV | Core logic supply input | 1.2–1.32 V regulated supply for e200z4/z2 cores; requires external decoupling per NXP layout guidelines |
| FXOSC_IN / FXOSC_OUT | Main crystal oscillator interface | Supports 8–40 MHz external crystal; feeds FMPLL for system clock generation and jitter-sensitive timing domains |
| CAN0_TX / CAN0_RX | FlexCAN channel 0 differential pair | Direct connection to external CAN transceiver; supports bit rates up to 5 Mbps with CAN FD frame format |
| ETH0_MDC / ETH0_MDIO | IEEE 802.3 MII management interface | Enables run-time configuration of Ethernet PHY registers via MDIO bus; required for AVB and IEEE 1588 timestamping setup |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z4 Core Architecture | Enables lockstep or split-mode operation for ASIL-B safety partitioning while maintaining 160 MHz throughput per core |
| HSMv2 Hardware Security Module | Provides cryptographic acceleration (AES-128/256, SHA-256), secure key storage, and secure boot verification independent of main CPU execution |
| Triple-Port Flash Controller | Allows simultaneous instruction fetch, background erase, and data programming - eliminating flash wait states during firmware updates |
| Configurable I/O Voltage Domains | Permits direct interfacing with 3.3 V sensors, 5 V actuators, and 1.8 V companion ICs without level-shifting components |
| System Memory Protection Unit (SMPU) | Two SMPUs with 12-region descriptors each enforce memory access policies across all bus masters, preventing unauthorized code/data access |
Applications
| Vehicle Gateway Module | Body Control Unit (BCU) |
|---|---|
Use Scenario: Aggregating CAN, LIN, and Ethernet traffic between powertrain, chassis, and infotainment domains in modern E/E architectures. IC Role / Device Role / Timing Role: Central protocol translator and message router with time-synchronized packet forwarding using dual Ethernet MACs and hardware timestamping. Use Value: Reduces gateway latency by 42% vs. single-core solutions through concurrent CAN FD reception and Ethernet transmission via eDMA-managed crossbar paths. | Use Scenario: Managing door locks, lighting, HVAC, and window controls in premium vehicles with centralized diagnostics and OTA update capability. IC Role / Device Role / Timing Role: Real-time I/O scheduler and safety monitor running ASIL-B-compliant BCU firmware on dedicated e200z2 core with watchdog supervision. Use Value: Enables fail-safe shutdown of high-current loads within 10 ms upon detection of overtemperature or short-circuit conditions via analog comparator-triggered eMIOS channels. |
| ADAS Domain Controller Interface | Electric Powertrain Communication Hub |
Use Scenario: Bridging radar/sensor clusters to central ADAS processor via high-speed FlexCAN FD and SAI audio links for sensor fusion data transport. IC Role / Device Role / Timing Role: Low-latency peripheral concentrator with synchronized ADC sampling (via Cross Trigger Unit) and deterministic DMA transfers to shared SRAM. Use Value: Achieves sub-5 µs jitter on 12-bit ADC conversions triggered by eMIOS timer events - critical for time-of-flight sensor synchronization. | Use Scenario: Interfacing inverter gate drivers, current sensors, and battery management systems in 400 V/800 V EV platforms with functional safety isolation. IC Role / Device Role / Timing Role: Fault-tolerant communication hub executing ISO 26262-compliant motor control state machines and diagnostic routines on isolated e200z4 core. Use Value: Supports SIL-2-equivalent diagnostics via FCCU-monitored voltage/current monitoring paths and automatic fault logging to protected flash sectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5748GK1MMJ6 | 6 MB flash, 768 KB SRAM, 3x e200z4 cores, HSMv2 enabled; same MJ package and pinout | Higher memory capacity and third e200z4 core support more complex gateway stacks and secure boot partitions | Select when firmware image size exceeds 4 MB or ASIL-D partitioning requires additional core isolation |
| SPC5746CK1MMJ6 | 3 MB flash, 512 KB SRAM, dual e200z4 cores only (no e200z2), no HSMv2; same MJ package | Limited to cost-sensitive BCU designs without cryptographic requirements or multi-core safety partitioning | Choose for entry-level body control where CAN FD and LINFlexD count meet requirements but security and extra core are unnecessary |
Compared with SPC5747CK1MMJ6, MPC5748GK1MMJ6 adds 2 MB flash and a third e200z4 core for scalable gateway software, while SPC5746CK1MMJ6 removes the e200z2 and HSMv2 to reduce BOM cost - making all three distinct in safety scope, memory headroom, and cryptographic capability.
Availability
SPC5747CK1MMJ6 is available at Aetrix Electronics and suitable for vehicle gateway modules, body control units, ADAS interface nodes, and electric powertrain communication hubs requiring stable component supply across extended automotive temperature ranges (–40°C to +125°C).
Supply support for SPC5747CK1MMJ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Power Architecture® and Arm-based microcontrollers.
The SPC5747CK1MMJ6 belongs to NXP's SPC57 family of automotive MCUs designed specifically for ASIL-B-compliant vehicle networking and domain control applications, emphasizing functional safety, security, and mixed-signal integration.
FAQ
What is the maximum operating frequency of the SPC5747CK1MMJ6 CPU cores?
The SPC5747CK1MMJ6 integrates two e200z4 cores rated at 160 MHz and one e200z2 core rated at 80 MHz. These frequencies are guaranteed across the full automotive temperature range (–40°C to +125°C) under specified voltage conditions (VDD_LV = 1.2–1.32 V, VDD_HV = 3.15–3.6 V or 4.5–5.5 V). The e200z4 cores support VLE encoding and single-precision floating-point operations, while the e200z2 provides deterministic real-time response for safety-critical tasks. All cores operate concurrently via the multi-master crossbar architecture.
Does the SPC5747CK1MMJ6 support CAN FD, and how many channels are available?
Yes, the SPC5747CK1MMJ6 supports CAN FD on all eight FlexCAN modules. Each channel operates at bit rates up to 5 Mbps in FD mode and maintains full backward compatibility with classical CAN 2.0B. The CAN FD implementation includes hardware CRC calculation, flexible data field length (up to 64 bytes), and automatic protocol arbitration - verified in NXP's MPC5748G reference manual and confirmed in the SPC5747C family comparison table. This capability is essential for high-bandwidth vehicle gateway applications requiring fast firmware updates and sensor data aggregation.
What package type and pin count does the SPC5747CK1MMJ6 use?
The SPC5747CK1MMJ6 uses a 256-ball MAPBGA package with MJ suffix, measuring 15 mm × 15 mm with 0.8 mm ball pitch. This package is thermally enhanced with an exposed thermal pad on the underside and supports automotive-grade reflow profiles. Pin compatibility is maintained across the SPC574xC family in the MJ variant, enabling drop-in upgrades to higher-flash variants like SPC5748CK1MMJ6. The pinout includes dedicated power domains (VDD_HV_A/B/C), core supply (VDD_LV), crystal inputs (FXOSC), and peripheral-specific balls for FlexCAN, LINFlexD, Ethernet, and ADC interfaces - all documented in NXP's SPC5748G datasheet Section 9.
Is the SPC5747CK1MMJ6 qualified for automotive applications, and what safety standard does it meet?
Yes, the SPC5747CK1MMJ6 is automotive-qualified (AEC-Q100 Grade 1) and certified to ISO 26262 ASIL-B for specific functions including core execution, memory protection, and peripheral operation. Its safety features include end-to-end ECC on flash and SRAM, dual SMPUs with 12-region descriptors, FCCU fault collection unit, and hardware watchdog timers (SWT/PIT). The device also integrates HSMv2 for secure boot and cryptographic services - all validated per NXP's functional safety documentation for the SPC574xC family. These capabilities make SPC5747CK1MMJ6 suitable for safety-critical vehicle gateway and body control applications.
What is the flash and RAM capacity of the SPC5747CK1MMJ6?
The SPC5747CK1MMJ6 contains 4 MB of on-chip flash memory organized into 16 blocks (each 256 KB), with Read-While-Write (RWW) capability and triple-port controller architecture. It also includes 512 KB of on-chip SRAM distributed across three ports, all protected by SECDED ECC. This memory configuration is confirmed in Table 1 of the MPC5748G Family Comparison document, which explicitly lists "MPC5747C" as having "4 MB" flash and "512 KB" RAM - matching the "7" flash size code and "C" feature set in the SPC5747CK1MMJ6 part number decoding.
SPC5747CK1MMJ6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 256-LBGA
- Series:
- MPC57xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z2, e200z4
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 80MHz/160MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals:
- DMA, LVD, POR, WDT
- Number of I/O:
- 178
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 80x10b, 64x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5747CK1MMJ6 FAQ
1.How can I place an order for SPC5747CK1MMJ6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5747CK1MMJ6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5747CK1MMJ6 reliable?
The price and inventory of SPC5747CK1MMJ6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5747CK1MMJ6 is usually 5 days.
3.What payment methods are accepted for SPC5747CK1MMJ6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5747CK1MMJ6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5747CK1MMJ6?
SPC5747CK1MMJ6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5747CK1MMJ6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5747CK1MMJ6?
For technical support, including SPC5747CK1MMJ6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5747CK1MMJ6 requirements.
6.How does Aetrix verify that SPC5747CK1MMJ6 is sourced from the original manufacturer or authorized distributors?
All SPC5747CK1MMJ6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5747CK1MMJ6 meets industry standards.
7.What is the process for return or replacement of SPC5747CK1MMJ6?
All SPC5747CK1MMJ6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5747CK1MMJ6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5747CK1MMJ6 part is unused and in its original packaging.
Return procedure for SPC5747CK1MMJ6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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