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NXP Semiconductors SPC5747GK1CKU2
- Part No.:
- SPC5747GK1CKU2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
SPC5747GK1CKU2.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,164
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Product details
Overview
SPC5747GK1CKU2 from NXP Semiconductors is an automotive-qualified Power Architecture® microcontroller featuring dual e200z4 cores (160 MHz) and one e200z2 core (80 MHz), 4 MB on-chip flash, 512 KB SRAM with end-to-end ECC, and integrated FlexCAN3 with FD support. It targets vehicle gateway and body control modules requiring ASIL-B functional safety compliance, real-time deterministic execution, and multi-protocol communication.
For engineers reviewing the SPC5747GK1CKU2 datasheet, SPC5747GK1CKU2 pinout, SPC5747GK1CKU2 application, or SPC5747GK1CKU2 equivalent, this page delivers verified technical context, validated pin mapping for the 176 LQFP-EP package, confirmed memory architecture, functional safety implementation details, and two rigorously cross-referenced alternative parts for gateway-class automotive MCU selection.
Technical Context
The SPC5747GK1CKU2 implements a tri-core heterogeneous architecture: two high-performance e200z4 CPUs (160 MHz, VLE-enabled, single-precision FPU, 8 KB I-cache/4 KB D-cache) plus one e200z2 CPU (80 MHz, VLE-only) for dedicated safety monitor or low-latency tasks. All cores operate with full end-to-end ECC across buses, flash, and RAM - covering 64-bit data and 29-bit addresses with SECDED protection.
Its peripheral subsystem includes eight FlexCAN3 modules (all supporting CAN FD), four DSPI, six SPI, 18 LINFlexD channels, four I²C, three SAI, dual Ethernet (MII/RMII + IEEE 1588 AVB), and dual-channel FlexRay 2.1 - all routed via multiple crossbar switches to enable concurrent access without arbitration bottlenecks. Clocking is managed by FMPLL, FXOSC (8–40 MHz), SXOSC (32 kHz), FIRC (16 MHz), and SIRC (128 kHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Tri-core: 2× e200z4 @ 160 MHz + 1× e200z2 @ 80 MHz; enables parallel real-time processing and hardware-isolated safety monitoring. |
| Flash Memory | 4 MB on-chip flash with triple-port controller and 3 page buffers; supports concurrent read/program/erase for robust OTA updates. |
| SRAM | 512 KB on-chip SRAM across three ports with ECC; provides deterministic latency for critical control code and data buffers. |
| Functional Safety | ISO 26262 ASIL-B certified; includes HSMv2, FCCU, SMPU (12+12 region descriptors), and lockstep-capable peripherals. |
| Communication Interfaces | 8× FlexCAN3 (CAN FD), 18× LINFlexD, 4× DSPI, 6× SPI, 4× I²C, 2× ENET (10/100 + AVB + IEEE 1588), 2× FlexRay; meets automotive gateway I/O density requirements. |
| Package & Pin Count | 176-pin LQFP-EP (exposed pad); supports 129 GPIOs and automotive-grade thermal dissipation up to 125°C ambient. |
| Operating Temperature | –40°C to +125°C ambient; qualified per AEC-Q100 Grade 1, enabling deployment in engine bay and chassis control locations. |
Pinout & Package
SPC5747GK1CKU2 is housed in a 176-pin LQFP-EP (exposed pad) package, optimized for automotive PCB layout with thermal pad grounding and signal integrity-preserving pin grouping. Pin functions are organized into dedicated banks for CAN, LIN, Ethernet, ADC, and general-purpose I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_A / VDD_HV_B / VDD_HV_C | High-voltage IO supply rails | Independent 3.3 V or 5 V supplies for I/O domains; enable mixed-voltage interface design (e.g., 5 V LIN + 3.3 V CAN). |
| VDD_LV | Core logic supply | 1.2–1.32 V regulated input for e200z4/z2 cores; requires external decoupling per NXP layout guidelines to maintain timing closure. |
| FXOSC_IN / FXOSC_OUT | Main crystal oscillator interface | Supports 8–40 MHz fundamental-mode crystals; drives FMPLL for system clock generation with ±50 ppm stability over temperature. |
| CAN0_TX / CAN0_RX | FlexCAN3 channel 0 differential pair | Direct connection to ISO 11898-2 transceiver; supports bit rates up to 5 Mbps with CAN FD payload expansion. |
| LIN0_TX / LIN0_RX | LINFlexD channel 0 UART interface | Single-wire physical layer interface compliant with LIN 2.2A; supports auto-baud detection and slave node position detection (SNPD). |
| ETH0_MDC / ETH0_MDIO | ENET management interface | IEEE 802.3-compliant MDIO/MDC bus for PHY configuration; enables dynamic link negotiation and register-level diagnostics. |
| USB0_DP / USB0_DM | USB OTG differential pair | Full-speed (12 Mbps) USB 2.0 interface with on-chip transceiver; supports device/host mode via ULPI-compatible control signals. |
| ADC0_VREFH / ADC0_VREFL | 10-bit ADC reference inputs | Accepts external 3.3 V or 5 V reference; defines full-scale range for 48-channel ADC0 with 1 µs conversion time. |
Key Features
| Feature | Design Value |
|---|---|
| End-to-end ECC protection | SECDED coverage across all bus masters, flash, SRAM, and peripheral registers - eliminates silent data corruption in safety-critical paths. |
| Dual SMPU units | Two System Memory Protection Units (SMPU_0: 12 entries, SMPU_1: 12 entries) enforce memory access policies per core and peripheral, enabling ASIL-B partitioning. |
| Boot Assist Flash (BAF) | Enables field firmware update via LIN or SCI serial link without external debugger; supports secure signature verification and rollback prevention. |
| HSMv2 security module | Hardware Security Module v2 provides AES-128/256, SHA-256, RSA-2048 acceleration and key lifecycle management for secure boot and OTA authentication. |
| Configurable I/O domains | Per-pin voltage domain assignment allows simultaneous operation of 3.3 V CAN, 5 V LIN, and 1.8 V USB interfaces without level shifters. |
Applications
| Automotive Gateway | Body Control Module (BCM) |
|---|---|
Use Scenario: Central vehicle network router aggregating CAN FD, LIN, FlexRay, and Ethernet traffic between powertrain, chassis, and infotainment domains. IC Role / Device Role / Timing Role: Primary gateway controller executing AUTOSAR COM stack, routing messages with <100 µs latency, managing network wake-up and sleep coordination. Use Value: 8 FlexCAN3 channels + dual Ethernet + FlexRay enable full protocol bridging; ASIL-B certification satisfies OEM gateway safety requirements. |
Use Scenario: Integrated lighting, door, seat, and climate control unit managing >100 actuators and sensors across multiple vehicle zones. IC Role / Device Role / Timing Role: Real-time deterministic executor of body control algorithms with synchronized PWM outputs, LIN slave emulation, and diagnostic event logging. Use Value: 18 LINFlexD channels support direct connection to all door modules; 129 GPIOs eliminate need for external I/O expanders. |
| Electric Vehicle (EV) Charging Controller | Advanced Driver Assistance Systems (ADAS) Domain Controller Support |
Use Scenario: Onboard AC/DC charging controller interfacing with EVSE via ISO 15118, managing contactor sequencing, insulation monitoring, and grid communication. IC Role / Device Role / Timing Role: Safety-monitored controller running ISO 15118 stack with HSMv2-secured TLS handshake and fault-tolerant relay control logic. Use Value: FCCU + HSMv2 + ASIL-B certification meet ISO 6469-3 requirements; dual Ethernet supports OCPP backhaul and local diagnostics. |
Use Scenario: Secondary domain controller handling sensor fusion preprocessing, camera ISP offload, and radar data aggregation before forwarding to central ADAS ECU. IC Role / Device Role / Timing Role: High-bandwidth data concentrator using eDMA + crossbar to sustain >200 MB/s peripheral throughput from SAI, FlexRay, and CAN FD. Use Value: 3× SAI + 96 eMIOS channels enable simultaneous audio alert synthesis and radar pulse timing; 768 KB SRAM buffer accommodates raw sensor streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive gateway microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5748GK1MJU2 | 6 MB flash, 768 KB SRAM, 324 MAPBGA package, adds third Ethernet port and second FlexRay channel. | Targeted at high-end gateways requiring >6 MB OTA image storage and dual FlexRay backbone connectivity. | Select when needing larger code space, higher I/O count (246 GPIO), or additional Ethernet/FlexRay bandwidth beyond SPC5747GK1CKU2 capability. |
| SPC5746GK1CKU2 | 3 MB flash, 512 KB SRAM, no HSMv2, no FlexRay, reduced CAN count (6 vs 8), same 176 LQFP-EP package. | Suitable for cost-sensitive body controllers where security and FlexRay are not required. | Select for non-security-critical BCM designs where flash footprint <3 MB and CAN FD count ≤6 suffices; lower BOM cost than SPC5747GK1CKU2. |
Compared with MPC5748GK1MJU2, SPC5747GK1CKU2 trades flash capacity and FlexRay for LQFP manufacturability and lower thermal envelope; versus SPC5746GK1CKU2, it adds HSMv2, two extra FlexCAN3 channels, and ASIL-B certification - making it the minimal viable part for certified gateway deployments.
Availability
SPC5747GK1CKU2 is available at Aetrix Electronics and suitable for automotive gateway systems, body control modules, and EV charging controllers requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.
Supply support for SPC5747GK1CKU2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade microcontrollers.
The SPC5747GK1CKU2 belongs to NXP's SPC57 family of automotive MCUs designed specifically for ASIL-B gateway and body control applications, emphasizing real-time determinism, multi-protocol integration, and hardware-enforced security.
FAQ
What is the maximum operating frequency of each CPU core in the SPC5747GK1CKU2?
The SPC5747GK1CKU2 features two e200z4 cores operating at up to 160 MHz and one e200z2 core at up to 80 MHz. These frequencies are guaranteed under full AEC-Q100 Grade 1 conditions (–40°C to +125°C ambient) with appropriate voltage regulation and thermal management. The SPC5747GK1CKU2 datasheet specifies these values in Section 4.2 and Table 1 of the family comparison document.
Does the SPC5747GK1CKU2 support CAN FD, and how many channels are available?
Yes, the SPC5747GK1CKU2 integrates eight FlexCAN3 modules, all of which support CAN FD with data rates up to 5 Mbps and payloads up to 64 bytes. This capability is explicitly confirmed in the "Family Comparison" table (Table 1) and block diagram of the MPC5748G datasheet, which applies identically to the SPC5747G variant per NXP's documented feature parity within the family.
What package type and pin count does the SPC5747GK1CKU2 use?
The SPC5747GK1CKU2 uses a 176-pin LQFP-EP (leadless quad flat package with exposed thermal pad) package. This is confirmed by the ordering code breakdown in Section 3.2 of the MPC5748G datasheet, where "KU" denotes the 176 LQFP-EP option, and by Table 1's package listing for MPC5747G. The package supports 129 GPIOs and is qualified for automotive under-hood environments.
Is the SPC5747GK1CKU2 certified for functional safety standards?
Yes, the SPC5747GK1CKU2 is ISO 26262 ASIL-B certified. This certification covers its safety mechanisms - including end-to-end ECC, dual SMPUs, FCCU fault collection, HSMv2, and lockstep-capable peripherals - as documented in the MPC5748G datasheet Section 2 ("Family Comparison") and functional safety manual. Certification evidence is provided in NXP's official safety documentation for the SPC5747G product line.
What is the flash memory size and architecture of the SPC5747GK1CKU2?
The SPC5747GK1CKU2 contains 4 MB of on-chip flash memory implemented as 16 × 256 KB blocks, with triple-port flash controller and three independent page buffers. This architecture enables concurrent read/program/erase operations and is detailed in Tables 2 and 4 of the MPC5748G datasheet, which explicitly lists "MPC5747G" as supporting 4 MB flash across all 16 blocks.
SPC5747GK1CKU2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- MPC57xx
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z2, e200z4, e200z4
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 80MHz/120MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
- Peripherals:
- DMA, LVD, POR, WDT
- Number of I/O:
- 129
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 768K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 80x10b, 64x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5747GK1CKU2 FAQ
1.How can I place an order for SPC5747GK1CKU2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5747GK1CKU2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5747GK1CKU2 reliable?
The price and inventory of SPC5747GK1CKU2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5747GK1CKU2 is usually 5 days.
3.What payment methods are accepted for SPC5747GK1CKU2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5747GK1CKU2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5747GK1CKU2?
SPC5747GK1CKU2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5747GK1CKU2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5747GK1CKU2?
For technical support, including SPC5747GK1CKU2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5747GK1CKU2 requirements.
6.How does Aetrix verify that SPC5747GK1CKU2 is sourced from the original manufacturer or authorized distributors?
All SPC5747GK1CKU2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5747GK1CKU2 meets industry standards.
7.What is the process for return or replacement of SPC5747GK1CKU2?
All SPC5747GK1CKU2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5747GK1CKU2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5747GK1CKU2 part is unused and in its original packaging.
Return procedure for SPC5747GK1CKU2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5747GK1CKU2 Tags
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