NXP Semiconductors SPC5747GK1MMJ6

Overview

SPC5747GK1MMJ6 from NXP Semiconductors is an automotive-qualified Power Architecture® microcontroller featuring dual 160 MHz e200z4 cores and one 80 MHz e200z2 core, 4 MB on-chip flash, 512 KB SRAM with end-to-end ECC, and integrated FlexCAN3 with FD support. It delivers ASIL-B–certifiable functional safety for vehicle gateway and body control applications requiring deterministic real-time performance, secure boot, and multi-protocol connectivity.

For engineers reviewing the SPC5747GK1MMJ6 datasheet, SPC5747GK1MMJ6 pinout, SPC5747GK1MMJ6 application, or SPC5747GK1MMJ6 equivalent, this page provides verified technical context, validated pin mapping for the 256 MAPBGA package, confirmed memory architecture, safety-critical peripheral timing behavior, and direct alternative part comparisons grounded in NXP's official family documentation.

Technical Context

The SPC5747GK1MMJ6 implements a triple-core heterogeneous architecture: two high-performance e200z4 cores (160 MHz) with single-precision floating-point units, instruction/data caches (8 KB/4 KB), and Variable Length Encoding (VLE); plus one e200z2 core (80 MHz) optimized for control tasks. All cores operate under unified end-to-end ECC protection covering 64-bit data and 29-bit addresses across bus transactions.

Its peripheral subsystem includes eight FlexCAN3 modules (all supporting CAN FD), four DSPI, six SPI, 18 LINFlexD channels, four I²C interfaces, dual ADCs (10-bit + 12-bit), three analog comparators, and a 96-channel eMIOS subsystem. Clocking is managed via FMPLL, 8–40 MHz FXOSC, 32 kHz SXOSC, and internal FIRC/SIRC oscillators - all monitored by the Clock Monitor Unit (CMU).

Key Specifications

Pinout & Package

SPC5747GK1MMJ6 is housed in a 256-ball MAPBGA (package code MJ) with 0.8 mm pitch, thermal pad, and JEDEC-standard footprint. Pin assignment follows NXP's documented ball map for MPC5747G derivatives, validated against the official datasheet Figure 9-1 (Pinout for 256 MAPBGA).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with SPC5747GK1MMJ6, MPC5748GK1MMJ6 offers 2 MB more flash and 256 KB more SRAM for larger AUTOSAR stacks or OTA update partitions, while SPC5746GK1MMJ6 reduces cost and complexity by removing HSMv2 and halving flash - making it optimal for entry-level BCMs.

Availability

SPC5747GK1MMJ6 is available at Aetrix Electronics and suitable for automotive gateway systems, body control modules, electric powertrain interfaces, and ADAS sensor hubs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for SPC5747GK1MMJ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade microcontrollers.

The SPC5747GK1MMJ6 belongs to NXP's SPC57xx automotive MCU family, designed specifically for ASIL-B–compliant vehicle networking, gateway, and domain controller applications demanding high integration, real-time determinism, and robust security.

FAQ

What is the maximum operating frequency of each CPU core in the SPC5747GK1MMJ6?

The SPC5747GK1MMJ6 integrates two e200z4 cores rated at 160 MHz and one e200z2 core rated at 80 MHz. These frequencies are guaranteed across the full –40°C to +125°C ambient temperature range per AEC-Q100 Grade 0 qualification. The e200z4 cores include single-precision floating-point units and VLE instruction encoding to improve code density and throughput.

Does the SPC5747GK1MMJ6 support CAN FD, and how many CAN interfaces does it have?

Yes, the SPC5747GK1MMJ6 supports CAN FD on all eight FlexCAN3 modules. Each module operates independently with programmable bit rates up to 5 Mbps in FD mode and includes built-in message RAM, error counters, and loopback self-test capability. This enables high-bandwidth communication for modern vehicle architectures without requiring external CAN FD controllers.

What is the flash memory size and architecture of the SPC5747GK1MMJ6?

The SPC5747GK1MMJ6 contains 4 MB of on-chip flash memory organized into 16 blocks of 256 KB each, with support for Read-While-Write (RWW) operation. It uses a triple-port flash controller with three dedicated page buffers, allowing concurrent program/erase/read operations - critical for safe over-the-air (OTA) firmware updates without system interruption.

Is the SPC5747GK1MMJ6 qualified for automotive use, and what safety standard does it meet?

Yes, the SPC5747GK1MMJ6 is AEC-Q100 Grade 0 qualified (–40°C to +125°C) and ISO 26262 ASIL-B certifiable. Its safety features include end-to-end ECC on all memory and bus paths, two System Memory Protection Units (SMPUs) with 12-region granularity, Fault Collection and Control Unit (FCCU), and hardware watchdog timers - all documented in NXP's safety manual for the MPC5747G family.

What package type and pin count does the SPC5747GK1MMJ6 use?

The SPC5747GK1MMJ6 uses a 256-ball MAPBGA package (package code MJ) with 0.8 mm ball pitch and an exposed thermal pad. This package is pin-compatible with other members of the MPC5747x/MPC5748x family in the same footprint, including MPC5748GK1MMJ6 and SPC5746GK1MMJ6, enabling scalable design reuse across performance tiers.