NXP Semiconductors SPC5748GTK1MMJ6R

Overview

SPC5748GTK1MMJ6R from NXP Semiconductors is a 160 MHz dual-core Power Architecture® microcontroller with two e200Z4 CPUs (160 MHz), one e200Z2 CPU (80 MHz), 6 MB on-chip flash, 768 KB SRAM, and end-to-end ECC for safety-critical automotive gateway applications. It integrates eight FlexCAN3 modules with CAN FD support, dual Ethernet with AVB/1588, and HSMv2 security.

For engineers reviewing the SPC5748GTK1MMJ6R datasheet, SPC5748GTK1MMJ6R pinout, SPC5748GTK1MMJ6R application, or SPC5748GTK1MMJ6R equivalent, this page delivers verified technical context, functional safety (ISO 26262 ASIL-compliant) architecture, real-time deterministic timing, and automotive-grade thermal performance up to 125°C ambient.

Technical Context

The SPC5748GTK1MMJ6R implements a triple-core heterogeneous architecture: two high-performance e200Z4 cores (160 MHz, VLE, single-precision FPU, 8 KB I-cache/4 KB D-cache) and one e200Z2 core (80 MHz, VLE) for dedicated control tasks. All cores operate with full end-to-end ECC (SECDED) across 64-bit data + 29-bit address paths.

Its memory subsystem includes a 3-port flash controller supporting 6 MB array with EEE emulation, three independent RAM ports totaling 768 KB SRAM, and dual SMPUs (16-region granularity). Peripheral interconnect uses multiple crossbar switches enabling concurrent access to flash, RAM, and peripherals by all bus masters including eDMA (32-channel), INTC, and BCTU.

Key Specifications

Pinout & Package

SPC5748GTK1MMJ6R is housed in a 256-ball MAPBGA (package code MJ), 15 mm × 15 mm, 0.8 mm pitch, thermally enhanced with exposed die paddle. Pinout conforms to NXP's MPC5748G family layout per Document Number MPC5748G Rev. 6, Section 9.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with MPC5746G and SPC5777MK0MMJ9, the SPC5748GTK1MMJ6R uniquely balances 6 MB flash, dual Ethernet AVB, eight CAN FD channels, and HSMv2 in a thermally optimized 256-BGA package-making it the optimal fit for production automotive gateways requiring ISO 26262 ASIL-B compliance without over-provisioning.

Availability

SPC5748GTK1MMJ6R is available at Aetrix Electronics and suitable for automotive gateway systems, body control modules, and ADAS domain controllers requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.

Supply support for SPC5748GTK1MMJ6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Power Architecture® and functional safety.

The SPC5748GTK1MMJ6R belongs to NXP's SPC57xx automotive MCU family, designed specifically for ASIL-B-certified vehicle networking and domain control applications requiring real-time determinism, multi-protocol support, and embedded security.

FAQ

What is the maximum operating frequency of the SPC5748GTK1MMJ6R CPU cores?

The SPC5748GTK1MMJ6R features two e200Z4 cores operating at up to 160 MHz and one e200Z2 core at up to 80 MHz. These frequencies are validated under full ASIL-B conditions at –40°C to +125°C ambient temperature, with junction temperature up to +150°C. The SPC5748GTK1MMJ6R achieves this performance using variable length encoding (VLE) and on-chip cache (8 KB instruction / 4 KB data per e200Z4 core).

Does the SPC5748GTK1MMJ6R support CAN FD, and how many channels are available?

Yes, the SPC5748GTK1MMJ6R integrates eight FlexCAN3 modules, all supporting CAN FD per ISO 11898-1:2015 at data rates up to 5 Mbps. Each channel is independently configurable for bit timing, message filtering, and RAM-based message buffers. This capability is explicitly confirmed in the MPC5748G Data Sheet Rev. 6, Section 2 (Family Comparison) and Figure 1 (Block Diagram).

What safety certifications apply to the SPC5748GTK1MMJ6R?

The SPC5748GTK1MMJ6R supports ISO 26262 ASIL-B certification for specific functions including memory protection (dual SMPU), fault collection (FCCU), and built-in self-test (STCU with MBIST/LBIST). It includes hardware mechanisms such as end-to-end ECC, register protection, and clock monitoring (CMU) required for ASIL-B development. Full certification documentation is provided in NXP's SPC5748G Functional Safety Manual.

What package type and thermal specifications does the SPC5748GTK1MMJ6R use?

The SPC5748GTK1MMJ6R uses a 256-ball MAPBGA package (code MJ), 15 mm × 15 mm, 0.8 mm pitch, with an exposed thermal pad. It is qualified for –40°C to +125°C ambient operation (Grade 1), with maximum junction temperature of +150°C. Thermal attributes-including θJA and θJC-are specified in Section 7 of the MPC5748G Data Sheet Rev. 6.

How much on-chip memory does the SPC5748GTK1MMJ6R provide?

The SPC5748GTK1MMJ6R provides 6 MB of on-chip flash memory with triple-port controller and EEPROM emulation (EEE), plus 768 KB of SRAM distributed across three independent ports (256 KB × 3). This memory architecture is confirmed in Table 1 (Family Comparison) and Section 6.3 (Memory Interfaces) of the MPC5748G Data Sheet Rev. 6.