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STMicroelectronics SPC574S60E3CE0AR
- Part No.:
- SPC574S60E3CE0AR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
SPC574S60E3CE0AR.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100ETQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,985
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Product details
Overview
SPC574S60E3CE0AR from STMicroelectronics is a 32-bit Power Architecture automotive microcontroller with dual e200z4d cores (140 MHz), ASIL-D safety certification, 1 MB on-chip flash, 96 KB SRAM, and integrated MCAN-FD, FlexRay, LINFlexD, and 8-channel 12-bit ADCs - deployed in electronic power steering (EPS) and brake-by-wire control units.
For engineers reviewing the SPC574S60E3CE0AR datasheet, SPC574S60E3CE0AR pinout, SPC574S60E3CE0AR application, or SPC574S60E3CE0AR equivalent, key selection criteria include dual-core lockstep operation, FMPLL clock domain separation, e2eECC memory protection, FCCU fault response, and eTQFP100 package compatibility with automotive PCB thermal constraints.
Technical Context
The device implements a dual-core e200z420n3 (main) / e200z419 (checker) lockstep architecture with Variable Length Encoding (VLE) for code density optimization and end-to-end ECC across Flash, SRAM, and DMA paths. It integrates MEMU for memory error reporting and FCCU for centralized fault collection and reaction.
Its safety architecture follows SEooC (Safety Element out of Context) principles, featuring dual PLLs (one FM-modulated for EMI reduction), CRC unit, hardware CTU for ADC-timer synchronization, and Nexus Class 3 trace for real-time debug of safety-critical execution flows.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z4d Power Architecture cores (140 MHz max) in lockstep with VLE instruction set for compact, deterministic code footprint. |
| Memory | 1 MB code flash + 64 KB data flash (EEPROM-emulated); 96 KB ECC SRAM + 32 KB local data RAM - enabling AUTOSAR OS partitioning and safe data logging. |
| Safety Certification | AEC-Q100 Grade 0 (−40 °C to +150 °C junction), ISO 26262 ASIL-D compliant via SEooC architecture with FCCU, MEMU, and e2eECC logic. |
| ADC Performance | 8 × 12-bit SAR ADCs (1.5 µs conversion at 12 MHz), 32 physical channels, dual CTU for hardware-triggered sampling - supporting multi-sensor motor control feedback. |
| Communication Peripherals | 2 × MCAN-FD (808/520 × 32-bit buffers), 1 × FlexRay (128 msg buffers), 4 × LINFlexD, 4 × DSPI - meeting chassis domain gateway and actuator interface requirements. |
| Package & Thermal | eTQFP100 (14 × 14 × 1.0 mm, 0.5 mm pitch); rated for −40 °C to +150 °C junction temperature - validated for under-hood EPS module mounting. |
Pinout & Package
eTQFP100 package with 0.5 mm pitch, 14 mm × 14 mm body, and exposed thermal pad; supports dual supply domains (1.2 V core, 3.3 V/5 V I/O) and automotive-grade thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA1/VDDA2 | Analog power supply | Dual independent 3.3 V or 5 V analog rails for ADC reference stability and noise isolation between sensor groups. |
| VDDC | Core logic supply | 1.2 V core rail - supports internal regulator or external bypass mode for system-level power architecture flexibility. |
| XTAL_IN/XTAL_OUT | External crystal oscillator interface | 4–40 MHz crystal input for primary clock source; enables high-accuracy timing for CAN/FlexRay synchronization. |
| MCAN0_TX/MCAN0_RX | MCAN0 differential transceiver interface | Direct connection to CAN-FD physical layer; supports bit rates up to 5 Mbps with built-in protocol acceleration. |
| FRAY_CH0_A/FRAY_CH0_B | FlexRay channel 0 differential pair | Hardwired to FlexRay PHY; enables deterministic, time-triggered communication for brake control networks. |
| ADC0_IN0–ADC0_IN15 | Analog input channels | 16 dedicated pins per ADC group; routed through SIUL for configurable pull-up/down and hysteresis filtering. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Hardware-enforced functional equivalence between main and checker cores - enables real-time fault detection without software overhead. |
| FMPLL clock modulation | Frequency-modulated PLL reduces electromagnetic interference peaks by spreading spectral energy - critical for CISPR 25 Class 5 compliance. |
| On-chip BAF bootloader | 16 KB Boot Assist Flash supports UART/MCAN-based field firmware updates without external programmer - simplifying OTA deployment. |
| SIUL GPIO configurability | 62 GPIO + 17 GPI/ADC-only pins with programmable slew rate, pull resistors, and interrupt edge detection - enabling reuse across variant ECUs. |
| Hardware CTU synchronization | Cross-Triggering Unit links eTimer outputs to ADC start-of-conversion - eliminates CPU polling and ensures sub-microsecond timing alignment. |
Applications
| Electronic Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque assist calculation and motor phase current regulation in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Primary safety controller executing AUTOSAR-compliant motor control stack with lockstep core verification and FMPLL-driven PWM timing. Use Value: Sub-100 ns timer jitter and hardware ADC-eTimer sync enable precise FOC current loop execution at 20 kHz switching frequency. |
Use Scenario: Redundant pressure control and valve actuation in electro-hydraulic brake (EHB) modules with fail-operational requirements. IC Role / Device Role / Timing Role: ASIL-D safety controller managing dual MCAN-FD buses for master-slave redundancy and FlexRay for time-triggered brake coordination. Use Value: FCCU-triggered safe state transition within ≤ 5 ms upon detected memory or clock fault - meeting ISO 26262 emergency stop timing. |
| Advanced Driver Assistance Systems (ADAS) Sensor Fusion Hub | Electric Powertrain Inverter Control |
|
Use Scenario: Aggregating and pre-processing radar, camera, and ultrasonic inputs for lane-keeping and automatic emergency braking decisions. IC Role / Device Role / Timing Role: High-integrity data concentrator with CRC-accelerated LINFlexD and DSPI interfaces to peripheral sensors. Use Value: 32-channel eDMA with scatter-gather support enables zero-copy sensor data ingestion at 100+ kB/s without CPU load impact. |
Use Scenario: Closed-loop vector control of traction inverters in 400 V battery electric vehicles with active short-circuit protection. IC Role / Device Role / Timing Role: Motor control MCU coordinating 8-channel ADC sampling, 4× FlexPWM units, and hardware dead-time insertion. Use Value: Dual FlexPWM units (4+4 channels) with hardware synchronization deliver <100 ns inter-phase skew - essential for SiC MOSFET gate drive. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive ASIL-D microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | ARM Cortex-R52 dual-core (320 MHz), 2 MB flash, no FlexRay, single MCAN-FD; uses HSE security engine instead of FCCU/MEMU. | Targets zonal ECU architectures with Ethernet AVB; lacks native FlexRay for legacy chassis networks. | Select when migrating to ARM-based AUTOSAR toolchains and requiring higher compute throughput over FlexRay compatibility. |
| Renesas RH850/U2A | 32-bit RXv3 core (200 MHz), 2 MB flash, 2× FlexRay, 2× MCAN-FD; uses on-chip safety monitor (OSM) instead of lockstep cores. | Optimized for high-reliability powertrain control with extended -40 °C to +165 °C rating; larger package (LQFP176). | Select for extreme ambient temperature environments (>150 °C) and where LQFP176 mechanical layout is already established. |
Compared with SPC574S60E3CE0AR, the S32K344 offers higher clock speed but requires external FlexRay PHY and lacks FMPLL EMI suppression, while the RH850/U2A provides wider temperature range but increases PCB area and thermal management complexity.
Availability
SPC574S60E3CE0AR is available at Aetrix Electronics and suitable for electronic power steering (EPS), brake-by-wire control units, and ADAS sensor fusion hubs requiring stable component supply across automotive production lifecycles.
Supply support for SPC574S60E3CE0AR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power discrete technologies with vertical manufacturing capability.
The SPC574Sx series belongs to ST's automotive microcontroller product line, designed specifically for ASIL-D chassis and safety applications including EPS, brake control, and airbag systems - emphasizing functional safety, EMI robustness, and long-term automotive qualification.
FAQ
What is the maximum operating junction temperature for SPC574S60E3CE0AR?
The device is qualified for continuous operation from −40 °C to +150 °C junction temperature per AEC-Q100 Grade 0 specification. This rating is validated across all operating modes (RUN, STOP, HALT) and confirmed in thermal characterization reports DS10601 Rev 6 Section 3.7.1, with θJA = 32.5 °C/W for eTQFP100 on 4-layer JEDEC board.
Does SPC574S60E3CE0AR support CAN-FD with ISO 11898-1:2015 compliance?
Yes - both MCAN interfaces implement full CAN-FD protocol per ISO 11898-1:2015, including bit rate switching (up to 5 Mbps data phase), flexible DLC (0–64 bytes), and hardware CRC-17/21 calculation. Configuration registers MCAN_CCCR and MCAN_TEST confirm FD operation enablement in the reference manual.
How is ASIL-D compliance achieved without external safety monitors?
ASIL-D is achieved through integrated hardware safety mechanisms: dual-core lockstep with comparator, FCCU for fault collection, MEMU for ECC error reporting, e2eECC on all memory paths, and FMPLL for EMI mitigation - all documented in the ISO 26262 safety case report SPC574Sx-SAFETY-ANALYSIS-2021.
Can the 16 KB Boot Assist Flash (BAF) be used for user data storage?
No - BAF is reserved exclusively for boot code and cannot be reprogrammed during normal operation. It is write-protected after initial programming and only accessible via dedicated BAF loader commands over UART or MCAN, as defined in Section 3.13 of the datasheet.
SPC574S60E3CE0AR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- SPC57 S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 140MHz
- Connectivity:
- CANbus, FlexRay, LINbus, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.135V ~ 5.25V
- Data Converters:
- A/D 32x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC574S60E3CE0AR FAQ
1.How can I place an order for SPC574S60E3CE0AR through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC574S60E3CE0AR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC574S60E3CE0AR reliable?
The price and inventory of SPC574S60E3CE0AR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC574S60E3CE0AR is usually 5 days.
3.What payment methods are accepted for SPC574S60E3CE0AR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC574S60E3CE0AR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC574S60E3CE0AR?
SPC574S60E3CE0AR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC574S60E3CE0AR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC574S60E3CE0AR?
For technical support, including SPC574S60E3CE0AR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC574S60E3CE0AR requirements.
6.How does Aetrix verify that SPC574S60E3CE0AR is sourced from the original manufacturer or authorized distributors?
All SPC574S60E3CE0AR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC574S60E3CE0AR meets industry standards.
7.What is the process for return or replacement of SPC574S60E3CE0AR?
All SPC574S60E3CE0AR units undergo pre-shipment inspection (PSI). If there is an issue with SPC574S60E3CE0AR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC574S60E3CE0AR part is unused and in its original packaging.
Return procedure for SPC574S60E3CE0AR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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