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STMicroelectronics SPC574S60E3CE0AY
- Part No.:
- SPC574S60E3CE0AY
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
SPC574S60E3CE0AY.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100ETQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,236
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Product details
Overview
SPC574S60E3CE0AY from STMicroelectronics is a 32-bit Power Architecture automotive microcontroller with dual e200z4d cores (140 MHz), ASIL-D safety certification, 1 MB on-chip flash, 96 KB SRAM, and integrated MCAN/CAN-FD, FlexRay, LINFlexD, and 8-channel 12-bit SAR ADCs - deployed in electric power steering (EPS) and brake-by-wire control units.
For engineers reviewing the SPC574S60E3CE0AY datasheet, SPC574S60E3CE0AY pinout, SPC574S60E3CE0AY application, or SPC574S60E3CE0AY equivalent, this page delivers verified functional identity, validated pin roles, confirmed safety architecture (FCCU/MEMU/e2eECC), and real-world automotive use context - not generic MCU descriptions.
Technical Context
The device implements a lockstep dual-core safety architecture: main e200z420n3 core and checker e200z419 core, both executing identical instructions with cycle-accurate comparison. It uses FMPLL-based clock generation with independent domains for peripherals and computational shell, enabling deterministic timing for AUTOSAR-compliant real-time tasks.
Safety logic includes FCCU for fault collection and reaction, MEMU for memory error reporting across Flash/SRAM/DMA RAM, and end-to-end ECC for data path integrity. The AMBA crossbar switch supports concurrent access by four masters (CPU instruction/data, DMA, FlexRay) to five slave resources including Flash controller and RAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z420n3 main + e200z419 checker cores in lockstep, Power Architecture VLE instruction set |
| Max Core Frequency | 140 MHz - enables sub-10 µs interrupt latency critical for ASIL-D motor control loops |
| Flash Memory | 1 MB code flash + 64 KB data flash - supports EEPROM emulation and read-while-write operation |
| RAM | 96 KB system SRAM + 32 KB local data RAM - ECC-protected for safety-critical variable storage |
| ADC | 8 × 12-bit SAR converters, 1.5 µs conversion at 12 MHz - supports simultaneous sampling across 32 physical channels |
| Safety Certification | AEC-Q100 Grade 0 (−40 °C to +150 °C), ISO 26262 ASIL-D compliant SEooC - validated for chassis/safety ECU deployment |
| Communication Interfaces | 2× MCAN (CAN-FD), 1× FlexRay (128 buffers), 4× LINFlexD, 4× DSPI - full redundancy support for distributed vehicle networks |
Pinout & Package
eTQFP100 package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad; 100-pin layout optimized for automotive PCB routing and thermal dissipation under high junction temperature conditions (−40 °C to +150 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_3V3 / VDDA_5V | Analog supply input | Dual-domain 3.3 V or 5 V supply for ADC reference and analog front-end - enables flexible sensor interface voltage scaling |
| VDDC | Core logic supply | 1.2 V core supply (internal regulator or external bypass) - supports low-power operation with dynamic voltage scaling |
| MCAN0_TX / MCAN0_RX | CAN-FD physical interface | Differential CAN transceiver pins supporting FD data rates up to 5 Mbit/s - routed to external PHY for robust bus communication |
| FLEXRAY_CH0_A / FLEXRAY_CH0_B | FlexRay channel 0 differential pair | High-speed deterministic network interface for time-triggered chassis control - supports 10 Mbit/s with 128 message buffers |
| ADC0_IN0–ADC0_IN15 | Analog input channels | 16 dedicated inputs per ADC group - used for torque sensor, position feedback, and current sensing in EPS systems |
| NEXUS_TDI / NEXUS_TDO | Nexus Class 3 debug trace | IEEE-ISTO 5001-2003 compliant trace port with 4 MDO pins - enables real-time instruction/data trace for ASIL-D software validation |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-D Safety Architecture | Integrated FCCU, MEMU, and e2eECC logic - enables single-chip compliance without external safety monitors |
| Dual-Core Lockstep Execution | Main + checker cores with cycle-accurate comparison - detects transient faults in CPU pipeline or register file |
| Flexible Clock Generation | Dual FMPLL with frequency modulation - reduces EMI in sensitive automotive environments while maintaining timing precision |
| Hardware Cross-Triggering (CTU) | Two CTUs synchronize ADC conversions with eTimer events - eliminates software jitter in motor phase current sampling |
| Bootloader Support | On-chip CAN/UART bootstrap loader with BAF - enables field firmware updates over existing vehicle networks without JTAG |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control Unit |
|---|---|
|
Use Scenario: Real-time torque assist calculation and motor current control in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing AUTOSAR MCAL drivers, managing 3-phase inverter PWM via FlexPWM, and sampling motor phase currents via synchronized ADC+CTU. Use Value: Sub-5 µs loop closure enabled by 140 MHz dual-core execution and hardware-accelerated PWM synchronization - meets ISO 26262 timing constraints for steering actuation. |
Use Scenario: Closed-loop pressure control and valve actuation in electro-hydraulic brake (EHB) systems. IC Role / Device Role / Timing Role: Safety-critical master controller interfacing with hydraulic pressure sensors, solenoid drivers, and redundant CAN/FlexRay buses. Use Value: Dual MCAN interfaces with CAN-FD and FlexRay channel 0 provide deterministic fail-operational communication - satisfies ASIL-D bus redundancy requirements. |
| Active Suspension Controller | ADAS Domain Controller Interface |
|
Use Scenario: High-frequency damper force modulation using piezoelectric or MR fluid actuators. IC Role / Device Role / Timing Role: Real-time sensor fusion hub processing accelerometer, wheel speed, and suspension displacement signals via 8-channel ADC and eTimer capture. Use Value: 1.5 µs ADC conversion time and dual CTUs enable 10 kHz sampling of suspension dynamics - critical for adaptive damping response. |
Use Scenario: Gateway and preprocessing node between radar/LiDAR sensors and central ADAS domain controller. IC Role / Device Role / Timing Role: Time-synchronized data aggregation unit using SENT interfaces for sensor streaming and LINFlexD for legacy module communication. Use Value: 2× SENT (3 channels each) + 4× LINFlexD support multi-sensor time-stamping with <1 µs jitter - ensures coherent sensor fusion input. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive ASIL-D microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | ARM Cortex-R52 dual-core, 320 MHz max, 2 MB flash, no FlexRay | Lacks FlexRay but adds Ethernet TSN and higher compute throughput - better suited for zonal controllers than chassis actuators | Select when Ethernet backbone integration or higher floating-point performance outweighs FlexRay requirement |
| Renesas RH850/U2A | 32-bit RXv3 core, 400 MHz, 4 MB flash, ASIL-D, no MCAN-FD | Supports CAN FD only via external transceiver; superior analog integration (16-bit ADC, 12-bit DAC) but larger footprint | Prefer for high-precision sensor conditioning where 16-bit ADC resolution is mandatory |
Compared with SPC574S60E3CE0AY, the S32K344 offers higher compute headroom and Ethernet readiness but sacrifices native FlexRay for chassis-level determinism; the RH850/U2A provides deeper analog integration and higher clock speed but requires external CAN-FD PHY and occupies more board area.
Availability
SPC574S60E3CE0AY is available at Aetrix Electronics and suitable for electric power steering (EPS), brake-by-wire, active suspension, and ADAS interface applications requiring stable component supply across extended automotive lifecycles.
Supply support for SPC574S60E3CE0AY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power solutions with vertical manufacturing capabilities and ISO/TS 16949-certified processes.
This device belongs to the SPC574Sx automotive microcontroller family, designed specifically for ASIL-D chassis and safety applications - emphasizing functional safety, real-time determinism, and mixed-signal integration in harsh-temperature environments.
FAQ
What is the maximum junction temperature rating for SPC574S60E3CE0AY?
The device is rated for −40 °C to +150 °C junction temperature and qualified per AEC-Q100 Grade 0. This specification is validated through accelerated life testing and thermal characterization across all operating modes, including full-core load with peripheral activation at 140 MHz. Thermal derating curves are provided in Section 3.7 of DS10601 Rev 6.
Does SPC574S60E3CE0AY support CAN-FD natively without external transceivers?
Yes - it integrates two MCAN controllers with full CAN-FD protocol stack, supporting data rates up to 5 Mbit/s and payloads up to 64 bytes. However, physical layer signaling requires external CAN-FD transceivers (e.g., TJA1044G); the MCU provides only digital TX/RX signals compliant with ISO 11898-1:2015.
How is ASIL-D compliance achieved without external safety components?
ASIL-D compliance is achieved through on-die safety mechanisms: lockstep dual-core execution with comparator, FCCU for fault collection, MEMU for memory error reporting, e2eECC for data paths, and hardware CRC units. These are validated per ISO 26262 Part 5 Annex D and documented in ST's SEooC safety case (AN5155).
What boot options does SPC574S60E3CE0AY support out-of-reset?
It supports three boot sources: internal Flash (default), UART bootloader via LINFlexD, and CAN bootloader via MCAN. The Boot Assist Flash (BAF) contains immutable startup code that validates Flash integrity before execution and enables field firmware updates without JTAG or external programmers.
SPC574S60E3CE0AY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- SPC57 S
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 140MHz
- Connectivity:
- CANbus, FlexRay, LINbus, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, WDT
- Number of I/O:
- 64
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.135V ~ 5.25V
- Data Converters:
- A/D 32x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC574S60E3CE0AY FAQ
1.How can I place an order for SPC574S60E3CE0AY through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC574S60E3CE0AY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC574S60E3CE0AY reliable?
The price and inventory of SPC574S60E3CE0AY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC574S60E3CE0AY is usually 5 days.
3.What payment methods are accepted for SPC574S60E3CE0AY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC574S60E3CE0AY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC574S60E3CE0AY?
SPC574S60E3CE0AY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC574S60E3CE0AY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC574S60E3CE0AY?
For technical support, including SPC574S60E3CE0AY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC574S60E3CE0AY requirements.
6.How does Aetrix verify that SPC574S60E3CE0AY is sourced from the original manufacturer or authorized distributors?
All SPC574S60E3CE0AY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC574S60E3CE0AY meets industry standards.
7.What is the process for return or replacement of SPC574S60E3CE0AY?
All SPC574S60E3CE0AY units undergo pre-shipment inspection (PSI). If there is an issue with SPC574S60E3CE0AY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC574S60E3CE0AY part is unused and in its original packaging.
Return procedure for SPC574S60E3CE0AY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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