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STMicroelectronics SPC574S64E3CEFAR

Part No.:
SPC574S64E3CEFAR
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
100-TQFP Exposed Pad
Datasheet:
AetrixSPC574S64E3CEFAR.pdf
Description:
IC MCU 32BIT 1.5MB FLSH 100ETQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,884

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Product details

Overview

SPC574S64E3CEFAR from STMicroelectronics is a 32-bit Power Architecture automotive microcontroller with dual e200z4d cores (140 MHz), ASIL-D safety certification, 1.5 MB on-chip flash + 64 KB data flash, 128 KB RAM, and integrated MCAN-FD, FlexRay, LINFlexD, and 8-channel 12-bit SAR ADCs - deployed in electric power steering (EPS) and brake-by-wire control units.

For engineers reviewing the SPC574S64E3CEFAR datasheet, SPC574S64E3CEFAR pinout, SPC574S64E3CEFAR application, or SPC574S64E3CEFAR equivalent, this page delivers verified technical context, safety architecture details, real-world automotive use cases, and validated alternative options for chassis and safety domain controller selection.

Technical Context

The SPC574S64E3CEFAR implements a lockstep dual-core e200z4d CPU (main + checker) with Variable Length Encoding (VLE), floating-point support, and end-to-end ECC across instruction cache (8 KB), data cache (4 KB), local data RAM (32 KB), and system SRAM (96 KB). It uses two independent FM-PLLs to isolate computational and peripheral clock domains.

Safety is enforced via FCCU, MEMU, and dedicated hardware units: CRC engine, CTU for ADC/timer synchronization, and BIST-enabled self-test logic. The device supports AUTOSAR-compliant STM/PIT timers, Nexus Class 3 trace, and dual MCAN interfaces with 808/520 × 32-bit message RAM and CAN-FD protocol compliance.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Dual e200z4d Power Architecture cores in lockstep (main + checker), VLE-enabled, 140 MHz max frequency - enables ASIL-D decomposition per ISO 26262.
Memory 1.5 MB code flash + 64 KB data flash (EEPROM emulation); 128 KB RAM (96 KB system SRAM + 32 KB local data RAM) - supports real-time firmware updates and safety-critical data logging.
ADC 8 × 12-bit SAR ADCs with 1.5 µs conversion time at 12 MHz, up to 32 physical channels, dual CTU - meets high-resolution sensor acquisition requirements in EPS torque feedback loops.
Communication 2 × MCAN (CAN-FD), 4 × LINFlexD, 4 × DSPI, 1 × FlexRay (2-channel, 128 MB), 2 × SENT (3 ch each) - provides redundant, time-triggered bus access for chassis domain integration.
Safety Features FCCU, MEMU, e2eECC, CRC unit, CMU, SWT with time window, SMPU (8 regions), and BIST - fulfills ASIL-D SEooC requirements without external safety monitors.
Operating Range Junction temperature −40 °C to +150 °C; 3.3 V or 5 V IO/ADC supply (dual independent domains); internal 1.2 V core regulator - qualified for under-hood automotive deployment.

Pinout & Package

eTQFP100 package (14 mm × 14 mm, 0.5 mm pitch), thermally enhanced for automotive under-hood operation. Pin assignments validated per STMicroelectronics DS10601 Rev 6, Section 2.1–2.2.

Pin/Terminal Circuit Role Design Meaning
VDDA / VSSA Analog power/ground Independent 3.3 V or 5 V analog supply domain for ADC reference stability and noise isolation.
VDDIO / VSSIO Digital I/O power/ground Separate 3.3 V or 5 V rail for GPIOs - enables mixed-voltage interface with sensors and actuators.
CLKIN / CLKOUT External crystal oscillator interface Supports 4–40 MHz XOSC for primary clock source with failover to 16 MHz IRCOSC - critical for clock monitoring unit (CMU) redundancy.
MCAN0_TX / MCAN0_RX MCAN0 differential transceiver pins Direct connection to CAN-FD physical layer; supports bit rates up to 5 Mbps with built-in protocol acceleration.
AD0[0:15] ADC input channel group 16 dedicated analog inputs routed to ADC0; supports simultaneous sampling via CTU trigger - used for motor phase current sensing.
NEXUS_TDI / TDO / TCK / TMS Nexus Class 3 debug interface Full real-time trace capability (instruction + data) for AUTOSAR stack validation and runtime fault analysis.

Key Features

Feature Design Value
ASIL-D SEooC Safety Architecture Hardware-enforced fault collection (FCCU), memory error reporting (MEMU), and lockstep core execution eliminate need for external safety monitor in EPS/brake ECU designs.
On-chip Flash with EEPROM Emulation 64 KB data flash configured as wear-leveling EEPROM replacement - enables secure calibration storage and OTA update rollback without external NVM.
Motor Control Peripherals 4 × eTimer (6 ch each) + 4 × FlexPWM (2 × 4-ch for FOC, 2 × 2-ch for SWG) with hardware sync - supports dual-motor control (e.g., EPS + active suspension) in single chip.
Dual FM-PLL Clock System Independent PLL0 (peripheral domain) and PLL1 (computation shell) with frequency modulation - reduces EMI in safety-critical signal paths while maintaining timing determinism.
Flexible Power Scheme Internal 1.2 V core regulator with bypass mode + dual IO/analog rails - simplifies PCB layout and supports legacy 5 V sensor interfacing alongside modern 3.3 V digital subsystems.

Applications

Electric Power Steering (EPS) Brake-by-Wire Actuation

Use Scenario: Real-time torque assist calculation, motor position/speed feedback, and fail-safe torque reduction during fault conditions.

IC Role / Device Role / Timing Role: Primary chassis domain controller executing AUTOSAR-compliant motor control stack with <100 µs loop latency.

Use Value: Dual-core lockstep + e2eECC ensures deterministic execution and memory integrity - meeting ASIL-D diagnostic coverage targets for torque path monitoring.

Use Scenario: Closed-loop pressure control of hydraulic modulators, wheel speed sensor fusion, and emergency brake intervention coordination.

IC Role / Device Role / Timing Role: Safety-critical actuator controller with dual MCAN-FD interfaces for redundancy and FlexRay for time-triggered brake command arbitration.

Use Value: Integrated FCCU and MEMU enable autonomous fault response (e.g., valve de-energization) within <5 ms - satisfying ISO 26262 ASIL-D reaction time requirements.

Active Suspension Control Chassis Domain Gateway

Use Scenario: High-frequency damper force computation using accelerometer and wheel travel sensor inputs, synchronized via CTU-triggered ADC sampling.

IC Role / Device Role / Timing Role: Real-time motion control processor with 8-channel ADC, eTimer-based PWM generation, and SENT interface for smart sensor communication.

Use Value: 1.5 µs ADC conversion + hardware CTU sync achieves sub-50 µs sensor-to-actuator latency - essential for road disturbance rejection bandwidth >10 Hz.

Use Scenario: Aggregation and routing of chassis sensor data (wheel speed, yaw rate, lateral acceleration) between CAN-FD, FlexRay, and LIN networks.

IC Role / Device Role / Timing Role: Time-synchronized gateway with dual MCAN, FlexRay, and 4 LINFlexD modules - manages cross-bus message scheduling per AUTOSAR COM stack.

Use Value: On-chip XBAR crossbar switch enables concurrent access to Flash, SRAM, and peripherals - sustaining >200 kmsg/s throughput across 3+ buses without arbitration delay.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive chassis and safety controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 ARM Cortex-M7 dual-core (320 MHz), 8 MB flash, no integrated FlexRay, AURIX-style safety but non-lockstep core architecture. Lacks native FlexRay support; requires external PHY and software-managed time-triggered scheduling - increases integration effort for brake-by-wire. Preferred when ARM ecosystem tooling and higher compute headroom outweigh need for hardware FlexRay and lockstep assurance.
Infineon AURIX TC397 Tri-core TriCore (300 MHz), 16 MB flash, integrated SafeTcore, but only 1 FlexRay channel and no SENT interface. Higher flash density suits complex ADAS fusion stacks, but missing second FlexRay channel limits multi-ECU brake domain scalability. Best for centralized chassis controllers where FlexRay bandwidth demand exceeds single-channel capacity and SENT is not required.

Compared with SPC574S64E3CEFAR, the S32K344 offers greater raw performance but lacks hardware FlexRay and lockstep enforcement, while the TC397 provides larger memory and SafeTcore but omits SENT and second FlexRay - making the SPC574S64E3CEFAR uniquely balanced for mid-tier ASIL-D chassis ECUs requiring full bus coverage and proven safety hardware.

Availability

SPC574S64E3CEFAR is available at Aetrix Electronics and suitable for electric power steering (EPS), brake-by-wire actuation, active suspension control, and chassis domain gateway applications requiring stable component supply across automotive production lifecycles.

Supply support for SPC574S64E3CEFAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, with R&D and manufacturing facilities across Europe, Asia, and the Americas.

The SPC574S series belongs to ST's automotive microcontroller portfolio designed specifically for ASIL-D chassis and safety applications - emphasizing hardware-enforced functional safety, multi-bus integration, and thermal robustness for under-hood deployment.

FAQ

What is the maximum junction temperature rating for SPC574S64E3CEFAR?

The SPC574S64E3CEFAR is rated for continuous operation from −40 °C to +150 °C junction temperature, validated per AEC-Q100 Grade 0 testing. This rating enables direct mounting in high-heat zones such as EPS motor housings or brake caliper control modules without derating.

Does SPC574S64E3CEFAR support CAN-FD on both MCAN interfaces?

Yes, both MCAN0 and MCAN1 interfaces support CAN-FD protocol with bit rates up to 5 Mbps, configurable message RAM (808 × 32-bit for MCAN0, 520 × 32-bit for MCAN1), and hardware timestamping - enabling time-synchronized dual-bus communication in brake-by-wire systems.

How is ASIL-D compliance achieved without external safety components?

ASIL-D compliance is achieved through integrated hardware safety mechanisms: lockstep dual-core execution, FCCU for fault collection, MEMU for memory error reporting, e2eECC on all critical memories, and BIST-enabled self-test - eliminating need for external safety monitors per ISO 26262 SEooC requirements.

What boot options does SPC574S64E3CEFAR support?

The device supports UART- and MCAN-based on-chip bootloader via Boot Assist Flash (BAF), enabling field firmware updates without JTAG. It also supports XIP (execute-in-place) from flash and secure boot with OTP key storage - critical for OTA update integrity in production vehicles.

SPC574S64E3CEFAR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
100-TQFP Exposed Pad
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
140MHz
Connectivity:
CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
64
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3.135V ~ 5.25V
Data Converters:
-
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC574S64E3CEFAR FAQ

1.How can I place an order for SPC574S64E3CEFAR through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC574S64E3CEFAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC574S64E3CEFAR reliable?

The price and inventory of SPC574S64E3CEFAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC574S64E3CEFAR is usually 5 days.

3.What payment methods are accepted for SPC574S64E3CEFAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC574S64E3CEFAR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC574S64E3CEFAR?

SPC574S64E3CEFAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC574S64E3CEFAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC574S64E3CEFAR?

For technical support, including SPC574S64E3CEFAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC574S64E3CEFAR requirements.

6.How does Aetrix verify that SPC574S64E3CEFAR is sourced from the original manufacturer or authorized distributors?

All SPC574S64E3CEFAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC574S64E3CEFAR meets industry standards.

7.What is the process for return or replacement of SPC574S64E3CEFAR?

All SPC574S64E3CEFAR units undergo pre-shipment inspection (PSI). If there is an issue with SPC574S64E3CEFAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC574S64E3CEFAR part is unused and in its original packaging.

Return procedure for SPC574S64E3CEFAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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