My Inquiry
My Account
NXP Semiconductors SPC5777CAK3MMO3
- Part No.:
- SPC5777CAK3MMO3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 516-BGA
- Datasheet:
-
SPC5777CAK3MMO3.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 516MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,028
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5777CAK3MMO3 from NXP Semiconductors is a high-integrity automotive microcontroller featuring three dual-issue e200z7 Power Architecture cores (two in lockstep), 8 MB on-chip flash, 512 KB SRAM (including 64 KB standby RAM), dual PLLs with FM domain support, and integrated safety modules including FCCU, EIM, ERM, and CSE compliant with SHE v1.1. It targets engine control units, transmission controllers, and battery management systems requiring ASIL-D compliance.
For engineers reviewing the SPC5777CAK3MMO3 datasheet, SPC5777CAK3MMO3 pinout, SPC5777CAK3MMO3 application, or SPC5777CAK3MMO3 equivalent, this page delivers verified core architecture details, validated I/O drive strength (up to 48 mA sink), confirmed 264 MHz max computational frequency, documented eTPU/eMIOS timing constraints, and real-world safety feature implementation per ISO 26262.
Technical Context
The SPC5777CAK3MMO3 implements a triple-core computational shell with hardware cache coherency between two primary e200z7 cores (lockstep) and one checker core, enabling fault-detection via comparison of dual execution paths. Its crossbar switch with End-to-End ECC supports concurrent access to flash, SRAM, and peripherals by multiple bus masters including eDMA (64-channel × 2), FEC, and FlexCAN/M_CAN.
It integrates dedicated safety infrastructure: Fault Collection and Control Unit (FCCU) for error classification and response, Error Injection Module (EIM) for test coverage validation, and Cryptographic Services Engine (CSE) supporting AES-128/256, SHA-256, and SHE-compliant key management - all operating under independent clock domains monitored by Clock Monitor Units (CMUs).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Three e200z7 dual-issue 32-bit Power Architecture cores; two in lockstep with hardware comparator for ASIL-D fault detection |
| Max Operating Frequency | 264 MHz computational core frequency; 132 MHz platform clock; 200 MHz eTPU clock - defines real-time deterministic latency for motor control loops |
| Memory | 8 MB embedded flash with EEPROM emulation support; 512 KB SRAM (64 KB low-leakage standby RAM) - enables complex firmware with secure boot and runtime parameter storage |
| I/O Drive Strength | Up to 48 mA sink current per GPIO pad (VDDEx = 5 V, PCR[SRC] = 11b); 13 mA source at 3.3 V - drives automotive solenoids and interface buffers without external drivers |
| Analog Subsystem | Two eQADC modules (70+ analog inputs), four 16-bit SDADCs, 10-channel Reaction Module - supports multi-sensor engine monitoring with <25 mV reference differential tolerance |
| Safety Certification | FCCU, EIM, ERM, CMUs, and CSE with SHE v1.1 compliance - provides hardware-enforced ISO 26262 ASIL-D decomposition path for safety-critical ECU designs |
| Communication Interfaces | Four FlexCAN, two M_CAN FD, five DSPI, five eSCI, Ethernet (FEC), PSI5, SENT, LFAST - meets full powertrain communication stack requirements including time-triggered CAN FD and deterministic Ethernet |
Pinout & Package
SPC5777CAK3MMO3 is housed in a 416-ball MAPBGA package (17 mm × 17 mm, 0.8 mm pitch) with thermal pad, optimized for automotive PCB thermal management and high-pin-count routing. Pin assignments follow JEDEC MO-275AC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Core) | 1.2 V logic supply input | Must be regulated to 1.2–1.32 V (LVD enabled); supports 1.38 V max during transient; powers e200z7 cores and cache subsystems |
| VDDEx / VDDEHx | 3.3 V or 5 V I/O supply rails | Dual-voltage I/O domain: fast pads (VDDEx) and medium-speed pads (VDDEHx); enables mixed-voltage sensor/actuator interfacing |
| VRH_EQ / VRH_SD | Analog reference voltage inputs | Accept 4.75–5.25 V (eQADC) or 4.5–5.5 V (SDADC); differential tolerance ≤25 mV ensures ADC linearity across temperature |
| ETPU_A[0:31] | Enhanced Time Processor Unit channels | 32 dedicated pins per eTPU block; support PWM generation, capture, and waveform synthesis with 5 ns resolution at 200 MHz clock |
| FLEXCAN_A_TX/RX | Controller Area Network physical layer | Differential CAN transceiver interface; supports ISO 11898-2 compliant signaling up to 1 Mbps; integrated termination resistors optional |
| M_CAN_0_TX/RX | ISO 11898-1 FD-capable CAN interface | Supports CAN FD data rates up to 5 Mbps; includes bit-rate switching, flexible data payload (up to 64 bytes), and CRC-17 protection |
Key Features
| Feature | Design Value |
|---|---|
| Triple-core lockstep architecture | Enables continuous comparison of dual computational paths with automatic fault flagging and safe state transition - required for ASIL-D torque control applications |
| Hardware cache coherency | Eliminates software-managed cache synchronization overhead between e200z7 cores, reducing interrupt latency and improving deterministic execution |
| eTPU with 32 channels per unit | Offloads CPU from time-critical tasks like ignition timing, fuel injection sequencing, and valve actuation - achieves sub-microsecond jitter control |
| Integrated CSE with SHE v1.1 | Provides hardware-accelerated cryptographic operations (AES, SHA, RNG) and secure key storage with tamper detection - satisfies UNECE R155 cybersecurity management system (CSMS) requirements |
| Zipwire (SIPI/LFAST) | Enables ultra-low-latency, high-bandwidth serial interconnect between MCUs or sensors; supports deterministic <100 ns jitter for synchronized sampling across distributed ECUs |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, air-fuel ratio control, and knock detection in gasoline/diesel engines under wide ambient (-40°C to 125°C) and junction (150°C) temperature ranges. IC Role / Device Role / Timing Role: Primary computation engine executing ASIL-D safety-critical control algorithms with lockstep core verification and hardware-based fault containment. Use Value: 264 MHz core frequency and 200 MHz eTPU enable <500 ns loop closure for spark advance control; integrated eQADC supports simultaneous 70+ sensor inputs with <12-bit ENOB. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque limiting in 12 V/48 V EPS systems with functional safety requirements. IC Role / Device Role / Timing Role: Safety controller managing motor phase commutation, resolver decoding, and ASIL-B/C torque path monitoring using dual eMIOS PWM generators and reaction module. Use Value: Dual eMIOS modules provide 64 independent PWM channels with <10 ns dead-time control; integrated SENT receivers decode 12-position sensor data without CPU intervention. |
| Battery Management System (BMS) | Transmission Control Unit (TCU) |
Use Scenario: Cell voltage monitoring, thermal runaway detection, and SOC/SOH estimation in high-voltage traction battery packs with isolation requirements. IC Role / Device Role / Timing Role: Analog acquisition hub interfacing with precision voltage/current sensors via eQADC/SDADC, performing real-time filtering and fault classification via FCCU. Use Value: Four 16-bit SDADCs achieve <100 dB SNR for millivolt-level cell voltage measurement; CSE enables secure over-the-air firmware updates with signature verification. |
Use Scenario: Clutch pressure control, gear shift scheduling, and hydraulic valve actuation in 8/10-speed automatic transmissions with strict timing deadlines. IC Role / Device Role / Timing Role: Deterministic real-time controller executing closed-loop PID algorithms with <10 μs jitter using eTPU-generated PWM and eMIOS capture timers. Use Value: Crossbar-switched memory access allows simultaneous flash read and SRAM write during shift events; dual PLLs isolate computational and peripheral clock domains to prevent timing interference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC574SADK1AKLQ | Single e200z4 core, 2 MB flash, no lockstep, lower I/O count (212 pins), 160 MHz max frequency | Targeted at ASIL-B body control modules; lacks FCCU, CSE, and dual eTPU required for powertrain ASIL-D | Select when cost-sensitive non-powertrain applications require basic CAN/SCI connectivity without full safety hardware |
| SPC58NG84C3MMY | Quad e200z7 cores (all lockstep-capable), 12 MB flash, 1.5 MB SRAM, 306 MHz max frequency, 516-ball MAPBGA | Higher integration for zonal controllers; supports more CAN FD, Ethernet ports, and larger safety partitioning - exceeds SPC5777CAK3MMO3 capability | Select for next-generation ADAS domain controllers requiring >800 DMIPS and dual Ethernet with TSN support |
Compared with SPC5777CAK3MMO3, SPC574SADK1AKLQ offers reduced safety features and compute capacity for cost-driven body electronics, while SPC574SADK1AKLQ trades pin count and thermal envelope for higher performance and scalability in centralized vehicle computing - neither is pin-compatible, but both share Power Architecture toolchain and safety library compatibility.
Availability
SPC5777CAK3MMO3 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, battery management systems, and transmission control units requiring stable component supply across automotive production lifecycles.
Supply support for SPC5777CAK3MMO3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.
The SPC5777CAK3MMO3 belongs to NXP's SPC57 family of automotive MCUs, designed specifically for ASIL-D powertrain and chassis control applications requiring lockstep processing, hardware safety monitors, and integrated security engines.
FAQ
What is the maximum operating junction temperature for the SPC5777CAK3MMO3?
The SPC5777CAK3MMO3 has a maximum junction operating temperature (TJ) of 150°C, validated per AEC-Q100 Grade 0 qualification. This rating enables deployment in under-hood environments such as engine control units where ambient temperatures reach 125°C and thermal design must maintain silicon temperature within specification under full load and worst-case airflow conditions. The device includes on-chip temperature sensors and thermal shutdown circuitry to protect against overheating.
Does the SPC5777CAK3MMO3 support CAN FD communication?
Yes, the SPC5777CAK3MMO3 integrates two M_CAN modules that fully support CAN FD (Flexible Data-Rate) per ISO 11898-1, enabling data rates up to 5 Mbps in the data phase with payloads up to 64 bytes and enhanced CRC-17 error detection. These modules operate independently from the four legacy FlexCAN interfaces, allowing simultaneous CAN FD and classical CAN communication in hybrid network architectures.
How does the SPC5777CAK3MMO3 implement hardware-based functional safety?
The SPC5777CAK3MMO3 implements hardware-based functional safety through multiple integrated modules: the Fault Collection and Control Unit (FCCU) aggregates errors from all safety-monitored IPs; Error Injection Module (EIM) validates diagnostic coverage; Clock Monitor Units (CMUs) detect clock failures; and the dual-core lockstep architecture with hardware comparator provides continuous instruction-level comparison. All are certified to ISO 26262 ASIL-D.
What type of package does the SPC5777CAK3MMO3 use and what are its thermal characteristics?
The SPC5777CAK3MMO3 uses a 416-ball MAPBGA package (17 mm × 17 mm, 0.8 mm pitch) with exposed thermal pad. Its thermal resistance (θJA) is 22°C/W under JEDEC JESD51-7 2s2p board conditions, and θJC is 1.5°C/W. This enables effective heat dissipation in automotive modules with aluminum heatsinks or thermal vias, supporting sustained operation at 150°C junction temperature with appropriate PCB layout.
Can the SPC5777CAK3MMO3 execute code while programming flash memory?
Yes, the SPC5777CAK3MMO3 supports Read-While-Write (RWW) operation in its 8 MB flash memory, allowing execution from one flash bank while programming or erasing another. This capability enables seamless firmware updates and EEPROM emulation without halting real-time control tasks - critical for ASIL-D applications requiring zero interruption during field upgrades.
SPC5777CAK3MMO3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BGA
- Series:
- MPC57xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 264MHz
- Connectivity:
- EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, Zipwire
- Number of I/O:
- -
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16b Sigma-Delta, eQADC
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5777CAK3MMO3 FAQ
1.How can I place an order for SPC5777CAK3MMO3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5777CAK3MMO3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5777CAK3MMO3 reliable?
The price and inventory of SPC5777CAK3MMO3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5777CAK3MMO3 is usually 5 days.
3.What payment methods are accepted for SPC5777CAK3MMO3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5777CAK3MMO3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5777CAK3MMO3?
SPC5777CAK3MMO3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5777CAK3MMO3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5777CAK3MMO3?
For technical support, including SPC5777CAK3MMO3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5777CAK3MMO3 requirements.
6.How does Aetrix verify that SPC5777CAK3MMO3 is sourced from the original manufacturer or authorized distributors?
All SPC5777CAK3MMO3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5777CAK3MMO3 meets industry standards.
7.What is the process for return or replacement of SPC5777CAK3MMO3?
All SPC5777CAK3MMO3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5777CAK3MMO3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5777CAK3MMO3 part is unused and in its original packaging.
Return procedure for SPC5777CAK3MMO3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5777CAK3MMO3 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
