My Inquiry
My Account
NXP Semiconductors SPC5777CDK3MME4R
- Part No.:
- SPC5777CDK3MME4R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BGA
- Datasheet:
-
SPC5777CDK3MME4R.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 416MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,369
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5777CDK3MME4R from NXP Semiconductors is a high-integrity automotive microcontroller featuring three dual-issue e200z7 Power Architecture cores (two in lockstep), 8 MB on-chip flash, 512 KB SRAM (including 64 KB standby RAM), dual PLLs, and integrated safety modules including FCCU, CSE, and ERM. It supports CAN FD, Ethernet (FEC), PSI5, SENT, and eTPU for engine control, transmission, and chassis applications.
For engineers reviewing the SPC5777CDK3MME4R datasheet, SPC5777CDK3MME4R pinout, SPC5777CDK3MME4R application, or SPC5777CDK3MME4R equivalent, this page delivers verified electrical specs, package mapping to 516-ball MAPBGA, functional partitioning across computational, FM, and peripheral clock domains, and validated alternatives for ASIL-D automotive control systems.
Technical Context
The SPC5777CDK3MME4R implements a triple-core architecture with two lockstep e200z7 cores for safety-critical computation and one independent e200z7 core for background tasks. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals with End-to-End ECC protection.
It integrates dual PLLs: one for stable peripheral clocks (up to 153 MHz) and one for frequency-modulated computational shell clocks (up to 306 MHz). Safety features include Fault Collection and Control Unit (FCCU), Clock Monitor Units (CMUs), and Tamper Detection Module (TDM), all aligned with ISO 26262 ASIL-D requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Three dual-issue e200z7 Power Architecture cores; two in lockstep for ASIL-D compliance |
| Max Operating Frequency | 306 MHz computational core frequency with frequency modulation support |
| Memory | 8 MB on-chip flash with EEPROM emulation; 512 KB SRAM (64 KB standby) |
| ADC Resources | Two eQADC modules (70+ analog inputs); four 16-bit SDADCs; 12 hardware decimation filters |
| Communication Interfaces | Four FlexCAN + two M_CAN FD; five DSPI; five eSCI; FEC Ethernet; PSI5 ×2; SENT ×12 |
| Safety & Security | FCCU, CSE with SHE v1.1, ERM, TDM, dual CMUs, Nexus 3+ debug per IEEE-ISTO 5001 |
| Package | 516-ball MAPBGA (19 mm × 19 mm, 0.8 mm pitch), RoHS-compliant |
Pinout & Package
SPC5777CDK3MME4R is housed in a 516-ball MAPBGA package (19 mm × 19 mm, 0.8 mm ball pitch) with thermal pad. Pin assignments follow the MPC5777C 516-ball MAPBGA layout defined in Figure 3 of the Rev. 15 datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA_EQA/B, VDDA_SD | Power supply rails | Dedicated 1.2 V core, 4.75–5.25 V eQADC, and 4.5–5.5 V SDADC supplies enable simultaneous high-precision analog acquisition |
| CLKIN, XOSC | Oscillator input | Supports external crystal (4–40 MHz) or oscillator for primary clock source with internal PLL multiplication |
| FSI, FSO, FSI2, FSO2 | FlexCAN transceiver I/O | Differential CAN FD bus interface pins with integrated termination and slew-rate control per ISO 11898-2 |
| ETPU_A[0:31], ETPU_B[0:31] | eTPU channel I/O | 64 dedicated time-processing channels for precise PWM generation, capture, and waveform synthesis in motor control |
| SDA0–SDA7, SDB0–SDB7, SDC0–SDC3, SDD0–SDD7 | Analog input multiplexers | 182 total ADC input capability via off-chip muxes; each group routed to eQADC or SDADC modules |
| NEXUS_TDI, TDO, TMS, TCK | JTAG/Nexus debug interface | IEEE-ISTO 5001-2003 compliant trace and debug port supporting real-time instruction trace and safety verification |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep dual-core execution | Enables continuous hardware-level comparison between two e200z7 cores to detect transient faults in real time |
| End-to-End ECC on crossbar | Protects data integrity across all memory and peripheral transactions - flash, SRAM, and peripheral register accesses |
| Hardware CRC module (3-channel) | Accelerates checksum calculation for firmware updates, communication frames, and memory integrity checks |
| Self-test capability (STCU) | Integrated startup and runtime self-tests for CPU, memory, and peripheral logic per ISO 26262 diagnostic coverage requirements |
| Secure Hardware Extension (SHE) | Provides AES-128, SHA-256, and key management for secure boot, firmware authentication, and OTA update protection |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline and diesel powertrains. IC Role / Device Role / Timing Role: Primary controller executing ASIL-D safety-critical algorithms with lockstep core validation and fault reporting via FCCU. Use Value: 306 MHz computational frequency and 64-channel eTPU enable sub-microsecond response to cylinder pressure events and injector actuation. | Use Scenario: Torque assist calculation, motor position feedback, and fail-safe torque limiting in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Dual-lockstep core handles safety-critical torque path; independent core manages CAN FD diagnostics and sensor fusion. Use Value: Integrated PSI5 and SENT receivers directly interface with torque and position sensors without external signal conditioning. |
| Brake-by-Wire System | Advanced Driver Assistance (ADAS) Domain Controller |
Use Scenario: Redundant hydraulic pressure control, wheel-speed monitoring, and brake actuator coordination in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety monitor core validates primary control outputs; CSE secures firmware updates and cryptographic key storage. Use Value: Dual M_CAN FD interfaces provide redundant high-speed communication with master brake ECU and vehicle network backbone. | Use Scenario: Sensor preprocessing, radar data aggregation, and low-latency decision handoff to central ADAS processor. IC Role / Device Role / Timing Role: Offloads time-critical sensor processing (e.g., eQADC sampling of radar IF signals) from main SoC using dedicated DMA and decimation filters. Use Value: 12 hardware decimation filters and 70+ analog inputs allow synchronized multi-radar front-end digitization with minimal host CPU load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5777C | Same silicon die; SPC5777CDK3MME4R is the automotive-grade, AEC-Q100 Grade 1 qualified variant of MPC5777C | MPC5777C lacks extended temperature qualification and automotive-specific screening; not approved for production ECU use | Select SPC5777CDK3MME4R for production automotive applications requiring AEC-Q100 Grade 1 (–40°C to +125°C ambient) |
| SPC574K72E3 | Lower integration: single e200z4 core, 2 MB flash, no eTPU, no SDADC, no Ethernet, reduced CAN count (2x FlexCAN only) | Targeted at cost-sensitive body control modules and gateway ECUs-not suitable for powertrain or chassis control | Choose SPC5777CDK3MME4R when full ASIL-D compute, analog acquisition, and high-speed networking are required |
Compared with MPC5777C and SPC574K72E3, SPC5777CDK3MME4R uniquely combines triple-core lockstep execution, 8 MB flash, dual M_CAN FD, FEC Ethernet, and 4× SDADCs - making it the only option among the three qualified for safety-critical powertrain and chassis control under ISO 26262 ASIL-D.
Availability
SPC5777CDK3MME4R is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and brake-by-wire applications requiring stable component supply across long automotive production lifecycles.
Supply support for SPC5777CDK3MME4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The SPC5777CDK3MME4R belongs to NXP's SPC5 automotive MCU family, designed specifically for ASIL-D safety-critical powertrain and chassis control applications with integrated functional safety and security engines.
FAQ
What is the operating temperature range for SPC5777CDK3MME4R?
The SPC5777CDK3MME4R is qualified for ambient operating temperatures from –40°C to +125°C (Grade 1 per AEC-Q100), with junction temperature up to +150°C. This rating is validated per the Rev. 15 datasheet Section 3.4 and applies to all functional blocks including eTPU, eQADC, and M_CAN FD interfaces.
Does SPC5777CDK3MME4R support CAN FD and how many controllers are integrated?
Yes, SPC5777CDK3MME4R integrates two M_CAN FD controllers compliant with ISO 11898-1:2015, plus four legacy FlexCAN modules. The M_CAN FD controllers support data rates up to 5 Mbps, flexible data field lengths, and built-in protocol exception handling for ASIL-D systems.
What is the flash memory endurance specification for SPC5777CDK3MME4R?
The SPC5777CDK3MME4R flash memory supports 100,000 program/erase cycles per block and guarantees data retention for 20 years at TJ ≤ 125°C. These values are specified in Section 3.12.3 and 3.12.4 of the Rev. 15 datasheet and apply to all 8 MB of on-chip flash.
How is functional safety implemented in SPC5777CDK3MME4R?
SPC5777CDK3MME4R implements functional safety via hardware-enforced lockstep core execution, FCCU for fault collection and reaction, dual CMUs for clock domain monitoring, ERM for error reporting, and STCU for built-in self-test. All are documented in Sections 1.1 and 3.11 of the Rev. 15 datasheet and align with ISO 26262 ASIL-D requirements.
Is SPC5777CDK3MME4R pin-compatible with other SPC57xx devices?
No, SPC5777CDK3MME4R uses a unique 516-ball MAPBGA package and is not pin-compatible with other SPC57xx devices such as SPC574K or SPC572L. Pin assignments, power domains, and peripheral mappings differ significantly - PCB redesign is required for migration.
SPC5777CDK3MME4R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BGA
- Series:
- MPC57xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 264MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, Zipwire
- Number of I/O:
- -
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16b Sigma-Delta, eQADC
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5777CDK3MME4R FAQ
1.How can I place an order for SPC5777CDK3MME4R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5777CDK3MME4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5777CDK3MME4R reliable?
The price and inventory of SPC5777CDK3MME4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5777CDK3MME4R is usually 5 days.
3.What payment methods are accepted for SPC5777CDK3MME4R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5777CDK3MME4R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5777CDK3MME4R?
SPC5777CDK3MME4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5777CDK3MME4R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5777CDK3MME4R?
For technical support, including SPC5777CDK3MME4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5777CDK3MME4R requirements.
6.How does Aetrix verify that SPC5777CDK3MME4R is sourced from the original manufacturer or authorized distributors?
All SPC5777CDK3MME4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5777CDK3MME4R meets industry standards.
7.What is the process for return or replacement of SPC5777CDK3MME4R?
All SPC5777CDK3MME4R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5777CDK3MME4R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5777CDK3MME4R part is unused and in its original packaging.
Return procedure for SPC5777CDK3MME4R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5777CDK3MME4R Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
