NXP Semiconductors SPC5777CSK3MME3
- Part No.:
- SPC5777CSK3MME3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BGA
- Datasheet:
-
SPC5777CSK3MME3.pdf
- Description:
- IC MCU 32BIT 8MB FLASH 416MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,186
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5777CSK3MME3 from NXP Semiconductors is a high-integrity 32-bit Power Architecture MCU designed for automotive powertrain and chassis control. It integrates three e200z7 dual-issue CPU cores (two in lockstep), 8 MB on-chip flash, 512 KB SRAM (including 64 KB standby RAM), dual PLLs, Ethernet (FEC), four FlexCAN and two M_CAN FD interfaces, and hardware safety features including FCCU, ERM, and CSE with SHE v1.1 compliance.
For engineers reviewing the SPC5777CSK3MME3 datasheet, SPC5777CSK3MME3 pinout, SPC5777CSK3MME3 application, or SPC5777CSK3MME3 equivalent, key selection criteria include ASIL-D support via lockstep core architecture, integrated functional safety modules (FCCU/ERM), automotive-grade temperature range (–40°C to 125°C ambient), and dual-domain clocking (132/153 MHz platform + 200/240 MHz eTPU) for deterministic real-time control.
Technical Context
The SPC5777CSK3MME3 implements a crossbar switch with End-to-End ECC for concurrent access to flash, SRAM, and peripherals by multiple bus masters. Its computational shell uses two lockstepped e200z7 cores with SPE1.1 DSP extensions, 16 KB I-Cache/D-Cache, and hardware cache coherency - enabling safe, high-throughput signal processing for engine management and transmission control.
Safety-critical subsystems include Fault Collection and Control Unit (FCCU), Error Reporting Module (ERM), Clock Monitor Units (CMUs), and Tamper Detection Module (TDM). The device supports IEEE-ISTO Nexus 3+ debug interface and JTAG/IEEE 1149.1/1149.7 test standards, with Boot Assist Module (BAM) enabling secure serial bootload via CAN or SCI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Three e200z7 dual-issue 32-bit cores; two operate in lockstep for ASIL-D compliance |
| Max Operating Frequency | 306 MHz computational core frequency; 153 MHz platform clock for peripherals |
| Memory | 8 MB on-chip flash with EEPROM emulation; 512 KB SRAM (64 KB battery-backed) |
| ADC Resources | Two eQADC modules (70 analog inputs total); four 16-bit Sigma-Delta ADCs |
| Communication | Four FlexCAN, two M_CAN FD, five DSPI, five eSCI, Ethernet FEC, PSI5, SENT |
| Safety Features | FCCU, ERM, CMUs, TDM, CSE with SHE v1.1, Nexus 3+ debug, JTAG/1149.7 |
| Operating Temp | –40°C to +125°C ambient; junction up to +150°C - qualified for automotive powertrain |
Pinout & Package
SPC5777CSK3MME3 is housed in a 516-ball MAPBGA package (19 mm × 19 mm, 0.8 mm pitch), optimized for thermal performance and high I/O density in automotive ECU designs. Pin assignments follow the 516-ball MAPBGA layout defined in NXP's MPC5777C Data Sheet Rev. 15 (Section 2.2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA_EQA/B, VDDA_SD | Core, ADC, SDADC supply rails | Dedicated power domains enable independent voltage scaling and noise isolation for mixed-signal operation |
| VRH_EQ, VRH_SD | ADC reference voltage inputs | Support precise ratiometric conversion with ≤25 mV differential tolerance vs supply |
| ETPU_A/B/C_CLK, ETBU_A/B/C_IN | eTPU timing and capture inputs | Enable deterministic 240 MHz time-stamping of crank/cam signals with sub-microsecond resolution |
| FEC_TXD[0:3], FEC_RXD[0:3] | Ethernet physical layer interface | Support 100BASE-TX PHY connection with integrated MAC and CRC offload |
| MCAN0_TX, MCAN0_RX | M_CAN FD transceiver interface | Enable CAN FD data rates up to 5 Mbps with flexible data-length and CRC-17 protection |
| BOOT_CFG[0:2] | Boot mode configuration pins | Determine startup source (flash, CAN, SCI) and security policy during reset initialization |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Architecture | Two e200z7 cores execute identical instructions with cycle-by-cycle comparison - enables ASIL-D fault detection per ISO 26262 |
| Hardware Safety Monitoring | FCCU manages fault injection, error classification, and fail-safe state transitions; ERM logs errors with timestamp and context for diagnostics |
| Secure Boot & Cryptography | CSE implements AES-128, SHA-256, and RSA-2048 with SHE v1.1 keys; PASS module enforces secure key lifecycle and MAC verification |
| Real-Time Signal Processing | Three eTPUs (32 channels each) and eMIOS (32 unified channels) provide hardware-accelerated PWM, capture, and modulation for engine valve timing and injector control |
| Robust Analog Front-End | Two eQADC modules support simultaneous sampling across 70 pins; SDADCs deliver 16-bit resolution with oversampling for sensor conditioning |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary controller executing ASIL-D safety-critical algorithms with lockstep core validation and FCCU-managed fault response. Use Value: Enables deterministic <1 µs interrupt latency and hardware-verified execution integrity for emissions-compliant powertrain control. | Use Scenario: Clutch pressure modulation, gear shift scheduling, and torque converter lockup control in automatic transmissions. IC Role / Device Role / Timing Role: High-precision timing hub synchronizing eTPU-based solenoid drivers, eMIOS PWM outputs, and CAN FD communication with vehicle network. Use Value: Delivers 240 MHz eTPU timing resolution and dual-domain clocking to meet <50 µs actuator response deadlines. |
| Brake Control System (BCS) | Electric Power Steering (EPS) |
Use Scenario: ABS/ESC hydraulic pressure modulation and wheel speed fusion using multi-sensor inputs. IC Role / Device Role / Timing Role: Safety monitor coordinating lockstep core computation, FCCU fault arbitration, and redundant CAN/FlexCAN messaging. Use Value: Achieves ASIL-D compliance via hardware-enforced separation of safety and non-safety tasks with dedicated memory protection units. | Use Scenario: Motor current control, torque feedback loop closure, and assist map interpolation in column-assist EPS systems. IC Role / Device Role / Timing Role: Real-time motor controller integrating eQADC sampling, SDADC current sensing, and M_CAN FD status reporting. Use Value: Supports 16-bit SDADC resolution and 200+ kHz PWM switching with synchronized ADC sampling for low-noise torque ripple suppression. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC574SADK1AKLQ | Single e200z4 core, 2 MB flash, no M_CAN FD, lower temp grade (–40°C to 105°C) | Targeted at ASIL-B body control modules; lacks lockstep and FCCU-level safety monitoring | Choose when cost-sensitive BMS or lighting control requires reduced safety scope and smaller footprint |
| TC397XP-128F300S DC | TriCore™ AURIX™, 300 MHz, 8 MB flash, 4.5 MB RAM, HSM for crypto acceleration | Offers higher core count and HSM-based secure boot but uses different ISA and toolchain; no native Power Architecture compatibility | Consider for greenfield designs prioritizing HSM offload and AUTOSAR Classic/Adaptive support over legacy Power Architecture migration |
Compared with SPC5777CSK3MME3, the SPC574SADK1AKLQ provides scaled-down safety and compute for cost-driven ASIL-B applications, while the TC397XP offers higher raw performance and HSM security but requires full software re-architecture - making SPC5777CSK3MME3 optimal for Power Architecture-based powertrain upgrades requiring ASIL-D certification continuity.
Availability
SPC5777CSK3MME3 is available at Aetrix Electronics and suitable for automotive powertrain control, chassis electronics, and safety-critical ECU development requiring stable component supply, long-term automotive qualification, and ASIL-D design assurance.
Supply support for SPC5777CSK3MME3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The SPC5777CSK3MME3 belongs to NXP's SPC5 automotive MCU family, engineered specifically for ASIL-D powertrain and chassis control with integrated functional safety, real-time processing, and automotive-grade reliability.
FAQ
What is the maximum operating frequency of the SPC5777CSK3MME3?
The SPC5777CSK3MME3 supports a maximum computational core frequency of 306 MHz and a platform clock frequency of 153 MHz. These frequencies are validated under specified operating conditions (VDD = 1.2–1.38 V, TA = –40°C to +125°C) and enable deterministic execution of ASIL-D powertrain algorithms. The device also delivers 240 MHz eTPU timing for ultra-precise sensor capture and actuator control.
Does the SPC5777CSK3MME3 support CAN FD communication?
Yes, the SPC5777CSK3MME3 integrates two M_CAN FD modules compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps, flexible data field lengths (up to 64 bytes), and enhanced CRC-17 error detection. This capability is essential for high-bandwidth ECU diagnostics and firmware updates in modern automotive networks - and is fully supported in the SPC5777CSK3MME3 silicon revision and associated SPC5 Studio toolchain.
What safety certifications does the SPC5777CSK3MME3 target?
The SPC5777CSK3MME3 is architected to support ISO 26262 ASIL-D compliance through hardware features including lockstep dual-core execution, FCCU fault collection, ERM error logging, CMU clock monitoring, and TDM tamper detection. NXP provides certified safety documentation (FMEDA, safety manual, HW-SIL evidence) aligned with the SPC5777CSK3MME3 device variant - enabling systematic integration into ASIL-D automotive safety plans.
How much on-chip flash and RAM does the SPC5777CSK3MME3 include?
The SPC5777CSK3MME3 includes 8 MB of on-chip flash memory with EEPROM emulation support and 512 KB of general-purpose SRAM, of which 64 KB is designated as standby RAM with independent VSTBY supply. Flash supports read-while-write operation and multiple independent blocks for robust firmware partitioning - critical for secure OTA updates and fail-safe bootloader operation in the SPC5777CSK3MME3.
Is the SPC5777CSK3MME3 pin-compatible with other SPC57xx devices?
No, the SPC5777CSK3MME3 is not pin-compatible with earlier SPC57xx devices due to its 516-ball MAPBGA package and expanded peripheral set (e.g., dual M_CAN FD, Ethernet FEC, additional eTPU channels). Migration requires PCB redesign and signal routing updates. However, software compatibility is maintained within the SPC5777C family via consistent register mapping and SPC5 Studio SDK support across all SPC5777CSK3MME3 variants.
SPC5777CSK3MME3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BGA
- Series:
- MPC57xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 264MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Peripherals:
- DMA, LVD, POR, Zipwire
- Number of I/O:
- -
- Program Memory Size:
- 8MB (8M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16b Sigma-Delta, eQADC
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5777CSK3MME3 FAQ
1.How can I place an order for SPC5777CSK3MME3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5777CSK3MME3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5777CSK3MME3 reliable?
The price and inventory of SPC5777CSK3MME3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5777CSK3MME3 is usually 5 days.
3.What payment methods are accepted for SPC5777CSK3MME3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5777CSK3MME3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5777CSK3MME3?
SPC5777CSK3MME3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5777CSK3MME3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5777CSK3MME3?
For technical support, including SPC5777CSK3MME3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5777CSK3MME3 requirements.
6.How does Aetrix verify that SPC5777CSK3MME3 is sourced from the original manufacturer or authorized distributors?
All SPC5777CSK3MME3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5777CSK3MME3 meets industry standards.
7.What is the process for return or replacement of SPC5777CSK3MME3?
All SPC5777CSK3MME3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5777CSK3MME3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5777CSK3MME3 part is unused and in its original packaging.
Return procedure for SPC5777CSK3MME3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5777CSK3MME3 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

