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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

STMicroelectronics SPC582B50E3CD00X

Name: SPC582B50E3CD00X
Brand: STMicroelectronics
SKU: SPC582B50E3CD00X
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SPC582B50E3CD00X

Manufacturer:: STMicroelectronics

Category:: Microcontrollers

Package:: 100-TQFP Exposed Pad

Datasheet:: SPC582B50E3CD00X.pdf

Description:: IC MCU 32BIT 512KB FLSH 100ETQFP

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Product details

Overview

SPC582B50E3CD00X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller with e200z2 single core running at up to 80 MHz, 1088 KB on-chip flash (1024 KB code + 64 KB data), 96 KB SRAM, and ASIL-B functional safety compliance per ISO 26262. It integrates 7 MCAN interfaces with ISO CAN FD support, 6 LINFlexD modules, and a dual-PLL clock system for automotive body control modules and gateway ECUs.

For engineers reviewing the SPC582B50E3CD00X datasheet, SPC582B50E3CD00X pinout, SPC582B50E3CD00X application, or SPC582B50E3CD00X equivalent, this MCU delivers deterministic real-time control, end-to-end ECC memory protection, BCTU-synchronized ADC triggering, and factory-programmable boot assist flash via CAN/LIN/UART - critical for automotive ECU development requiring traceable safety lifecycle management.

Technical Context

The SPC582B50E3CD00X implements a single-issue e200z2 CPU core compliant with Power Architecture embedded specification, featuring Variable Length Encoding (VLE) for reduced code footprint and single-precision floating-point unit (EFPU2). Its crossbar switch enables concurrent bus master access to flash, SRAM, and peripherals with end-to-end ECC integrity.

It embeds a comprehensive ASIL-B safety architecture including FCCU for failure notification handling, MEMU for memory error reporting, CRC units, and e2eECC logic across memory and interconnect paths. The BCTU synchronizes up to 27-channel 12-bit SAR ADC conversions with eMIOS timer events or PIT_RTIs to eliminate sampling collisions in motor control and sensor fusion applications.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	e200z2 single-issue 32-bit Power Architecture core with VLE and EFPU2 - enables compact, deterministic firmware with floating-point math for sensor signal processing.
Max Clock Frequency	80 MHz - provides sufficient MIPS for real-time body control, gateway routing, and diagnostic stack execution under ASIL-B timing constraints.
Flash Memory	1088 KB (1024 KB code + 64 KB data) - supports RWW operation and EEPROM emulation across multiple blocks for robust firmware updates and NVM parameter storage.
SRAM	96 KB general-purpose SRAM (64 KB standby-capable) - accommodates AUTOSAR OS stacks, CAN FD message buffers, and runtime variables with low-latency access.
Safety Features	ASIL-B compliance per ISO 26262, FCCU, MEMU, dual CRC units, and e2eECC on XBAR, flash, and SRAM - ensures detectable fault coverage for safety-critical ECU functions.
Communication Interfaces	7 MCAN (ISO CAN FD), 6 LINFlexD, 4 DSPI, 1 I²C - enables high-bandwidth vehicle network backbone with mixed legacy CAN, LIN, and SPI peripheral connectivity.
Analog Subsystem	1 × 12-bit SAR ADC (27 channels), BCTU-triggered conversion, enhanced diagnosis - supports precise battery monitoring, HVAC sensor acquisition, and actuator feedback with hardware synchronization.

Pinout & Package

eTQFP100 package (14 × 14 × 1.0 mm), RoHS-compliant, rated for junction temperature range of –40 °C to +150 °C.

Pin/Terminal	Circuit Role	Design Meaning
VDD_LV / VSS_LV	Core power supply (1.2 V)	Dedicated 1.2 V domain for CPU and logic; requires tight regulation and decoupling to maintain timing integrity at 80 MHz.
VDD_HV_IO_MAIN / VSS_HV	I/O supply (3.0–5.5 V)	Supports 5 V-tolerant digital I/Os and LIN transceiver interface; enables direct connection to automotive 5 V domains without level shifters.
VDD_HV_ADV / VSS_HV_ADV	ADC analog supply	Independent 3.0–5.5 V rail for SAR ADC - isolates noise-sensitive analog acquisition from digital switching transients.
VDD_HV_ADR_S / VSS_HV_ADR_S	ADC reference voltage	Separate precision reference input (3.0–5.5 V) with ≤25 mV differential tolerance - ensures stable 12-bit ADC full-scale accuracy across temperature.
PORST	Power-on reset input	Active-low reset pin with internal pull-up; external RC network required for controlled deassertion timing per automotive startup sequencing.
OSC_IN / OSC_OUT	40 MHz crystal oscillator interface	Drives primary system clock source; supports external crystal or CMOS clock input - essential for CAN FD bit timing stability and PLL lock.
JTAG_TCK / TMS / TDI / TDO	Nexus Class 3 debug interface	2-pin JTAG (IEEE 1149.7) with trace capability - enables non-intrusive real-time debugging, calibration, and safety verification during ECU validation.

Key Features

Feature	Design Value
ASIL-B Safety Architecture	FCCU, MEMU, dual CRC, and e2eECC across memory and interconnect - satisfies ISO 26262 hardware-level fault detection requirements without external safety monitors.
Boot Assist Flash (BAF)	Factory-programmable via serial bootload over asynchronous CAN or LIN/UART - eliminates need for dedicated programming hardware in production line ECU flashing.
Body Cross Triggering Unit (BCTU)	Hardware-synchronized ADC sampling triggered by eMIOS/PIT events - eliminates software jitter in closed-loop motor control and battery cell monitoring.
Enhanced Modular I/O Subsystem (eMIOS)	32-channel 16-bit timed I/O with buffered PWM updates and shifted edge outputs - reduces EMI in LED drivers and solenoid control while supporting AUTOSAR MCAL.
Dual PLL Clock System	Separate FM-modulated computational shell and stable peripheral clock domains - guarantees deterministic CAN FD timing while enabling dynamic CPU frequency scaling.

Applications

Automotive Body Control Module (BCM)

Vehicle Gateway ECU

Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern vehicles.

IC Role / Device Role / Timing Role: Main application controller executing AUTOSAR-compliant BSW and RTE, managing LIN/FlexRay/CAN communication stacks and real-time PWM output generation.

Use Value: Integrated 7× MCAN + 6× LINFlexD eliminates external protocol translators; ASIL-B safety features enable integration of safety-relevant functions like hazard light control.

Use Scenario: Aggregation and routing of messages between powertrain, chassis, infotainment, and ADAS domains in zonal or domain-centralized architectures.

IC Role / Device Role / Timing Role: High-throughput message router with CAN FD frame buffering, filtering, and translation - leveraging dual PLL for independent timing domains.

Use Value: 7 MCAN interfaces with shared memory scheme reduce latency and RAM overhead vs. discrete CAN controllers; BAF simplifies OTA update deployment.

Electric Power Steering (EPS) Sensor Interface

Battery Management System (BMS) Monitor

Use Scenario: Acquisition and preprocessing of torque, angle, and motor current signals in EPS control units.

IC Role / Device Role / Timing Role: Real-time ADC acquisition node synchronized via BCTU to eMIOS PWM edges - ensuring phase-aligned sampling of motor commutation signals.

Use Value: 27-channel 12-bit SAR ADC with diagnosis features meets ASIL-B diagnostic coverage targets; e200z2 core executes sensor fusion algorithms within <50 µs loop time.

Use Scenario: Monitoring cell voltages, temperatures, and pack currents in 12–48 V automotive battery systems.

IC Role / Device Role / Timing Role: Dedicated safety monitor co-processor interfacing with external ADCs and isolation barriers - using MEMU and CRC to validate all NVM-stored calibration data.

Use Value: 1088 KB flash stores redundant SOC/SOH algorithms and fault logs; junction temp rating up to +150 °C supports under-hood placement near battery packs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive MCU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP S32K144	ARM Cortex-M4F core, 112 MHz, 512 KB flash, 64 KB SRAM, ASIL-B certified but no integrated CAN FD PHY - requires external transceivers.	Targets entry-level automotive control where ARM ecosystem tooling is preferred; lacks native LINFlexD and BCTU-level ADC synchronization.	Select when leveraging existing ARM-based AUTOSAR stacks or requiring higher CPU throughput at lower power than Power Architecture.
Renesas RH850/F1L	32-bit RXv2 core, 120 MHz, 1 MB flash, 128 KB SRAM, ASIL-B, 6x CAN FD, but no LINFlexD - uses standard UART/LIN peripherals instead.	Used in powertrain and chassis applications demanding higher interrupt latency performance; lacks eMIOS-style flexible PWM timing and BCTU trigger flexibility.	Select for applications requiring sub-100 ns interrupt response or compatibility with Renesas' proprietary safety libraries and compiler toolchain.

Compared with SPC582B50E3CD00X, the S32K144 offers higher clock speed and ARM toolchain familiarity but requires external CAN FD transceivers and lacks BCTU-driven ADC synchronization; the RH850/F1L delivers superior interrupt latency and larger SRAM but omits LINFlexD integration and eMIOS advanced PWM features critical for body electronics.

Availability

SPC582B50E3CD00X is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateway ECUs, electric power steering sensor interfaces, and battery management system monitors requiring stable component supply across extended product lifecycles.

Supply support for SPC582B50E3CD00X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with strong focus on functional safety and AEC-Q100 qualification.

The SPC582B series belongs to ST's automotive-grade Power Architecture MCU family, designed specifically for ASIL-B automotive control applications including body electronics, gateways, and electrification subsystems - succeeding the SPC560Bx platform with enhanced safety, CAN FD density, and power efficiency.

FAQ

What is the maximum junction temperature rating for SPC582B50E3CD00X?

The SPC582B50E3CD00X is rated for a junction temperature range of –40 °C to +150 °C, validated per AEC-Q100 Grade 0 requirements. This allows direct mounting in under-hood environments such as engine bay gateways or battery disconnect units without forced cooling, provided PCB thermal design meets the eTQFP100 package's θ_JA of 32 °C/W.

Does SPC582B50E3CD00X support CAN FD with ISO 11898-1:2015 physical layer compliance?

Yes - all 7 MCAN modules support ISO CAN FD (Flexible Data-Rate) per ISO 11898-1:2015, including bit rates up to 5 Mbit/s in FD mode and seamless fallback to classical CAN. The MCU implements the advanced shared memory scheme and built-in message RAM arbitration logic required for deterministic multi-CAN FD operation without host CPU intervention.

How is ASIL-B compliance achieved without external safety components?

ASIL-B compliance is achieved through integrated hardware safety mechanisms: FCCU for centralized fault collection and reaction, MEMU for memory error detection and reporting, dual CRC units for data path integrity, and end-to-end ECC on flash, SRAM, and crossbar interconnect. These are verified per ISO 26262 Part 5 and documented in ST's safety manual UM2282.

Can SPC582B50E3CD00X be programmed in-system via CAN without a debugger?

Yes - the Boot Assist Flash (BAF) enables serial bootloader operation over asynchronous CAN, LIN, or UART. Factory programming and field firmware updates can be performed using standard CAN frames without JTAG/Nexus debug hardware, supporting secure OTA update workflows when combined with ST's SPC5 Flash Loader and cryptographic signature verification.

SPC582B50E3CD00X Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Package/Case:: 100-TQFP Exposed Pad

Series:: SPC58 2B-Line

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: e200z2

Core Size:: 32-Bit Single-Core

Speed:: 80MHz

Connectivity:: CANbus, I2C, LINbus, SPI

Peripherals:: DMA, WDT

Number of I/O:: 80

Program Memory Size:: 512KB (512K x 8)

Program Memory Type:: FLASH

EEPROM Size:: 64K x 8

RAM Size:: 96K x 8

Voltage - Supply (Vcc/Vdd):: 3.3V, 5V

Data Converters:: A/D 27x12b SAR

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:

SPC582B50E3CD00X FAQ

1.How can I place an order for SPC582B50E3CD00X through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC582B50E3CD00X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC582B50E3CD00X reliable?

The price and inventory of SPC582B50E3CD00X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC582B50E3CD00X is usually 5 days.

3.What payment methods are accepted for SPC582B50E3CD00X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC582B50E3CD00X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC582B50E3CD00X?

SPC582B50E3CD00X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC582B50E3CD00X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC582B50E3CD00X?

For technical support, including SPC582B50E3CD00X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC582B50E3CD00X requirements.

6.How does Aetrix verify that SPC582B50E3CD00X is sourced from the original manufacturer or authorized distributors?

All SPC582B50E3CD00X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC582B50E3CD00X meets industry standards.

7.What is the process for return or replacement of SPC582B50E3CD00X?

All SPC582B50E3CD00X units undergo pre-shipment inspection (PSI). If there is an issue with SPC582B50E3CD00X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC582B50E3CD00X part is unused and in its original packaging.

Return procedure for SPC582B50E3CD00X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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