STMicroelectronics SPC582B54E1AD00X
- Part No.:
- SPC582B54E1AD00X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
SPC582B54E1AD00X.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 64ETQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,243
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC582B54E1AD00X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller featuring a single e200z2 core at 80 MHz, 1088 KB on-chip flash (1024 KB code + 64 KB data), 96 KB SRAM, ASIL-B functional safety compliance per ISO 26262, and integrated 7-channel ISO CAN FD interfaces - deployed in engine control units for real-time combustion timing and fault-tolerant actuator management.
For engineers reviewing the SPC582B54E1AD00X datasheet, SPC582B54E1AD00X pinout, SPC582B54E1AD00X application, or SPC582B54E1AD00X equivalent, this MCU delivers deterministic real-time execution, end-to-end ECC across memory and crossbar paths, dual PLL clock domains, and hardware safety mechanisms including FCCU, MEMU, and CRC units - critical for ASIL-B powertrain and chassis control designs.
Technical Context
The SPC582B54E1AD00X implements a single-issue e200z2 CPU core compliant with Power Architecture embedded specification, supporting Variable Length Encoding (VLE) for reduced code footprint and single-precision floating-point operations. Its dual PLL architecture provides independent clock domains: one stable domain for peripherals and one FM-modulated domain for computational shell timing.
Memory subsystem includes 1088 KB flash with read-while-write capability and EEPROM emulation across multiple blocks, 96 KB SRAM (64 KB standby), and crossbar switch enabling concurrent access by multiple bus masters with end-to-end ECC protection. Safety logic integrates FCCU for failure notification handling, MEMU for memory error reporting, and dedicated CRC units for data integrity verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | e200z2 single-core, 32-bit Power Architecture, 80 MHz max frequency - enables deterministic real-time task scheduling in safety-critical ECU firmware. |
| Flash Memory | 1088 KB total (1024 KB code + 64 KB data), RWW support - allows background firmware updates without halting application execution. |
| SRAM | 96 KB general-purpose SRAM (64 KB in standby mode) - retains critical state during low-power HALT/STOP modes for fast wake-up recovery. |
| Safety Certification | ASIL-B compliant per ISO 26262, AEC-Q100 Grade 0 (–40 °C to 150 °C junction) - validated for engine bay deployment in powertrain control modules. |
| Communication Interfaces | 7 × MCAN (ISO CAN FD), 6 × LINFlexD, 4 × DSPI, 1 × I²C - supports multi-bus vehicle networking with high-bandwidth diagnostics and actuator feedback loops. |
| Analog Subsystem | 1 × 12-bit SAR ADC with up to 27 channels and enhanced diagnosis - captures sensor signals (e.g., throttle position, coolant temperature) with built-in fault detection. |
| Timers & Triggers | eMIOS (32 timed I/O channels), BCTU (ADC trigger synchronization from eMIOS/PIT), 8 × PIT - enables precise PWM generation and time-aligned sensor sampling for closed-loop control. |
Pinout & Package
eTQFP64 package (10 mm × 10 mm × 1.0 mm, 0.5 mm pitch), RoHS-compliant, designed for automotive PCB thermal and mechanical reliability under vibration and thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_LV | Core supply voltage input | 1.2 V ±6% regulated input for e200z2 core - requires local low-noise decoupling to maintain timing stability at 80 MHz. |
| VDD_HV_IO_MAIN | I/O supply voltage input | 3.0–5.5 V supply for GPIO, LIN, CAN transceivers - supports direct interface with 5 V automotive sensors and actuators. |
| PORST | Power-on reset input | Active-low reset with internal pull-up; must be held low ≥100 µs after VDD_LV/VDD_HV stabilization - ensures deterministic boot sequence initiation. |
| CLKIN | External crystal oscillator input | Accepts 40 MHz crystal (±50 ppm) for primary clock source - feeds PLL0 for system clock generation with jitter < ±50 ps RMS. |
| MCAN0_TX / MCAN0_RX | CAN FD physical layer interface | Differential pair for ISO 11898-1 CAN FD up to 5 Mbps - connects directly to external CAN transceiver (e.g., TJA1044) without level-shifting. |
| ADC0_VREFH / ADC0_VREFL | ADC reference voltage inputs | 3.0–5.5 V reference range with ≤25 mV differential noise - defines full-scale range for 12-bit SAR conversion accuracy (±1 LSB INL). |
Key Features
| Feature | Design Value |
|---|---|
| End-to-End ECC Protection | Hardware ECC applied to flash, SRAM, crossbar, and peripheral bridges - detects and corrects single-bit errors, prevents silent data corruption in safety-critical memory paths. |
| Boot Assist Flash (BAF) | Factory-programmable via serial bootload over asynchronous CAN or LIN/UART - enables secure field reprogramming without JTAG hardware access. |
| Body Cross Triggering Unit (BCTU) | Configurable event routing from eMIOS/PIT to ADC start-of-conversion - eliminates software latency in time-critical sensor sampling (e.g., crankshaft position capture). |
| Enhanced Modular IO Subsystem (eMIOS) | 32-channel 16-bit timer with buffered updates and shifted PWM outputs - reduces electromagnetic interference from simultaneous edge transitions in motor drive applications. |
| Fault Collection and Control Unit (FCCU) | Centralized aggregation of safety-related faults (MEMU, CRC, watchdog timeouts) with configurable reaction (interrupt, reset, safe state assertion) - meets ASIL-B fault response timing requirements (< 100 µs). |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time fuel injection timing, spark advance calculation, and knock detection using crank/cam sensor inputs and wideband O₂ feedback. IC Role / Device Role / Timing Role: Primary computation engine executing AUTOSAR-compliant BSW and application SW with < 5 µs interrupt latency for cylinder-specific events. Use Value: Dual PLL domains isolate computational timing from peripheral jitter; ASIL-B safety mechanisms ensure fail-safe torque reduction upon detected memory or timing faults. |
Use Scenario: Clutch pressure modulation, gear shift scheduling, and hydraulic valve control based on vehicle speed, throttle, and turbine RPM. IC Role / Device Role / Timing Role: Real-time controller managing 16+ PWM outputs and synchronized ADC sampling of pressure/temperature sensors at 10 kHz. Use Value: eMIOS BCTU-triggered ADC acquisition aligns sampling to PWM edges, eliminating aliasing in closed-loop pressure control; 7 CAN FD channels enable high-speed inter-module coordination. |
| Electric Power Steering (EPS) | Brake Control Module (BCM) |
|
Use Scenario: Torque assist calculation, motor current regulation, and road feel emulation using steering angle, torque, and motor position feedback. IC Role / Device Role / Timing Role: Safety-certified controller running dual-core lockstep (via delayed lock-step with redundancy checkers) for torque path monitoring. Use Value: On-chip voltage regulator delivers stable 1.2 V core supply under battery voltage fluctuations (6–16 V); 96 KB SRAM retains assist maps during STOP-mode wake-up. |
Use Scenario: ABS/EBD actuation sequencing, wheel speed signal processing, and brake-by-wire pressure control with redundancy validation. IC Role / Device Role / Timing Role: ASIL-B certified controller interfacing with 4-wheel speed sensors, solenoid drivers, and CAN FD diagnostic bus. Use Value: FCCU-managed fault tree ensures immediate isolation of failed CAN channel or ADC input; CRC-protected flash prevents corrupted brake logic execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144W | ARM Cortex-M4F core (112 MHz), 512 KB flash, 64 KB SRAM, ASIL-B, 3× CAN FD - lacks e200z2 Power Architecture compatibility and VLE instruction set. | Targets mid-tier body electronics; lower flash/SRAM limits restrict complex powertrain algorithms. | Select when ARM ecosystem toolchain adoption or lower cost-per-MIPS is prioritized over legacy SPC5x software migration. |
| Infineon AURIX TC234L | Tri-core TriCore architecture (200 MHz), 2 MB flash, 256 KB SRAM, ASIL-D capable - higher safety grade but larger footprint and power envelope. | Used in high-end ADAS and x-by-wire systems requiring triple-core redundancy and >150 °C junction operation. | Select only when ASIL-D certification, higher compute throughput, or multi-core lockstep is mandatory - not drop-in compatible. |
Compared with NXP S32K144W and Infineon TC234L, the SPC582B54E1AD00X offers optimal balance of ASIL-B compliance, Power Architecture continuity for SPC560Bx migration, compact eTQFP64 packaging, and integrated CAN FD bandwidth - making it the preferred choice for cost-sensitive, thermally constrained engine and transmission ECUs.
Availability
SPC582B54E1AD00X is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake control modules requiring stable component supply across automotive production lifecycles.
Supply support for SPC582B54E1AD00X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power discrete technologies with vertical manufacturing capabilities and AEC-Q100 qualification infrastructure.
The SPC582B line extends ST's automotive MCU portfolio with Power Architecture-based devices targeting ASIL-B powertrain applications, emphasizing functional safety integration, CAN FD scalability, and thermal robustness for under-hood deployment.
FAQ
What is the maximum junction temperature rating for SPC582B54E1AD00X?
The SPC582B54E1AD00X is rated for continuous operation at a junction temperature of –40 °C to +150 °C, validated per AEC-Q100 Grade 0 requirements. This enables direct mounting in high-heat environments such as engine compartments without forced cooling, provided PCB thermal vias and copper pour meet ST's recommended layout guidelines in AN5059.
Does SPC582B54E1AD00X support EEPROM emulation out of the box?
Yes - the 1088 KB on-chip flash includes dedicated 64 KB data flash partition with hardware-supported wear leveling and RWW (Read-While-Write) capability. ST provides SPC5 Flash Library v3.2.0 with certified drivers for EEPROM emulation, enabling up to 100,000 write cycles per logical sector without external memory.
How many CAN FD interfaces does SPC582B54E1AD00X integrate?
The SPC582B54E1AD00X integrates seven fully independent MCAN modules, each compliant with ISO 11898-1:2015 CAN FD specification supporting data rates up to 5 Mbps, flexible payload lengths (up to 64 bytes), and built-in message RAM with hardware acceptance filtering - no external CAN controllers required.
Is Nexus Class 3 debug supported on SPC582B54E1AD00X?
Yes - the device implements IEEE-ISTO 5001-2003 Nexus Class 3+ debug and trace interface with real-time instruction trace, data trace, and stimulus port support. It enables non-intrusive debugging via Lauterbach TRACE32 or iSystem winIDEA using standard 2-pin cJTAG, including run-control, memory inspection, and safety-critical trace analysis.
SPC582B54E1AD00X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- SPC58
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 27x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC582B54E1AD00X FAQ
1.How can I place an order for SPC582B54E1AD00X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC582B54E1AD00X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC582B54E1AD00X reliable?
The price and inventory of SPC582B54E1AD00X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC582B54E1AD00X is usually 5 days.
3.What payment methods are accepted for SPC582B54E1AD00X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC582B54E1AD00X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC582B54E1AD00X?
SPC582B54E1AD00X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC582B54E1AD00X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC582B54E1AD00X?
For technical support, including SPC582B54E1AD00X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC582B54E1AD00X requirements.
6.How does Aetrix verify that SPC582B54E1AD00X is sourced from the original manufacturer or authorized distributors?
All SPC582B54E1AD00X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC582B54E1AD00X meets industry standards.
7.What is the process for return or replacement of SPC582B54E1AD00X?
All SPC582B54E1AD00X units undergo pre-shipment inspection (PSI). If there is an issue with SPC582B54E1AD00X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC582B54E1AD00X part is unused and in its original packaging.
Return procedure for SPC582B54E1AD00X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC582B54E1AD00X Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

