My Inquiry
My Account
STMicroelectronics SPC582B60E1CD00X
- Part No.:
- SPC582B60E1CD00X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
SPC582B60E1CD00X.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 64ETQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,958
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC582B60E1CD00X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller with e200z2 single core operating at up to 80 MHz, 1088 KB on-chip flash (1024 KB code + 64 KB data), 96 KB SRAM, and ASIL-B functional safety compliance per ISO 26262. It integrates 7 MCAN interfaces with ISO CAN FD support, 6 LINFlexD modules, and a dual-PLL clock system for engine control unit (ECU) applications.
For engineers reviewing the SPC582B60E1CD00X datasheet, SPC582B60E1CD00X pinout, SPC582B60E1CD00X application, or SPC582B60E1CD00X equivalent, key selection criteria include ASIL-B safety architecture (FCCU, MEMU, CRC, e2eECC), 27-channel 12-bit SAR ADC with BCTU-triggered synchronization, eTQFP64 package compatibility, and production-ready qualification for powertrain and chassis control systems.
Technical Context
The SPC582B60E1CD00X implements a single-issue e200z2 CPU core compliant with Power Architecture embedded specification, featuring Variable Length Encoding (VLE) for reduced code footprint and single-precision floating-point unit (EFPU2). Its crossbar switch enables concurrent access to flash, RAM, and peripherals with end-to-end ECC protection across all data paths.
Safety-critical operation is enabled by integrated hardware blocks: Fault Collection and Control Unit (FCCU) for failure response, Memory Error Management Unit (MEMU) for error reporting in memories, dual CRC units, and dedicated BCTU for deterministic ADC triggering from eMIOS or PIT channels-ensuring time-synchronized sensor acquisition in real-time automotive control loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z2 single-issue 32-bit Power Architecture core with VLE and EFPU2 - enables compact, deterministic code execution with floating-point math for motor control algorithms. |
| Max Clock Frequency | 80 MHz - delivers sufficient MIPS for real-time ASIL-B-compliant ECU tasks including closed-loop fuel injection and ignition timing. |
| Flash Memory | 1088 KB (1024 KB code + 64 KB data) - supports RWW (Read-While-Write), EEPROM emulation across multiple blocks, and secure boot via Boot Assist Flash (BAF). |
| SRAM | 96 KB general-purpose SRAM (including 64 KB standby RAM) - provides low-latency data storage for runtime variables and safety-critical context preservation during low-power modes. |
| Safety Features | FCCU, MEMU, dual CRC units, e2eECC logic, and delayed lock-step with redundancy checkers - collectively satisfy ASIL-B requirements per ISO 26262 without external safety monitors. |
| ADC System | Single 12-bit SAR ADC with up to 27 input channels and enhanced diagnosis - supports high-resolution analog sensing for throttle position, temperature, and pressure with BCTU-triggered synchronization to PWM outputs. |
| Communication Interfaces | 7 MCAN (ISO CAN FD), 6 LINFlexD, 4 DSPI, 1 I²C - enables full vehicle network integration: high-bandwidth actuator control over CAN FD and legacy diagnostics via LIN. |
Pinout & Package
eTQFP64 package (10 × 10 × 1.0 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, AEC-Q100 Grade 0 (–40 °C to +150 °C junction temperature).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_LV | Core supply voltage | 1.2 V ±60 mV regulated input for e200z2 core - requires local decoupling to maintain stability under dynamic load switching. |
| VDD_HV_IO_MAIN | I/O supply voltage | 3.0–5.5 V supply for GPIO, LINFlexD, DSPI, and MCAN I/O buffers - supports mixed-voltage interfacing with legacy 5 V sensors and actuators. |
| PORST | Power-on reset input | Active-low reset pin with internal pull-up - initiates cold start sequence and triggers FCCU safety state machine initialization. |
| CLKIN | External crystal oscillator input | Accepts 40 MHz crystal for primary PLL reference - enables precise clock domain generation for CAN FD bit timing and ADC sampling synchronization. |
| MCAN0_TX / MCAN0_RX | CAN FD transceiver interface | Differential pair for ISO CAN FD physical layer communication - supports data rates up to 5 Mbit/s with flexible data-rate arbitration and payload phases. |
| ADC0_IN0–ADC0_IN26 | Analog input channels | 27 dedicated pins for 12-bit SAR ADC - routed through BCTU for event-triggered conversion synchronized to eMIOS PWM edges. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Safety Architecture | Integrated FCCU, MEMU, dual CRC, and e2eECC enable self-checking memory access, fault collection, and safe state transition without external safety ICs. |
| Body Cross Triggering Unit (BCTU) | Enables deterministic ADC sampling triggered by eMIOS channels or PIT timers - eliminates software latency in closed-loop control timing critical for engine management. |
| Enhanced Modular I/O Subsystem (eMIOS) | 32-channel 16-bit timer subsystem with buffered updates, shifted PWM outputs, and configurable trigger outputs - reduces electromagnetic interference and simplifies motor phase control. |
| Dual PLL Clock System | Separate FM-modulated computational shell PLL and stable peripheral domain PLL - isolates CPU timing from CAN FD bus jitter and ensures consistent ADC sampling clock accuracy. |
| Boot Assist Flash (BAF) | Factory-programmable serial bootloader accessible via asynchronous CAN or LIN/UART - enables secure field firmware updates without JTAG hardware dependency. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time combustion cycle monitoring and spark/fuel actuation in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary controller executing ASIL-B-compliant safety-critical algorithms with deterministic 80 MHz instruction throughput and synchronized ADC sampling. Use Value: Dual PLL ensures stable ADC clock independent of CAN FD bus activity; BCTU-triggered conversion aligns sampling to crankshaft position events with sub-microsecond jitter. |
Use Scenario: Closed-loop hydraulic pressure regulation and gear shift sequencing in automatic transmissions. IC Role / Device Role / Timing Role: Central MCU managing solenoid drivers, torque converter clutch control, and CAN FD communication with engine and chassis ECUs. Use Value: 7 MCAN interfaces allow simultaneous high-speed communication with multiple subsystems; 96 KB SRAM stores real-time transmission state tables and adaptive learning parameters. |
| Electric Power Steering (EPS) | Brake Control Module (BCM) |
|
Use Scenario: Torque assist calculation and motor current control in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Safety-certified controller performing sensor fusion (torque, angle, speed), motor commutation, and fault-tolerant actuation. Use Value: e200z2 core with VLE reduces flash footprint for complex motor control algorithms; ASIL-B safety features meet ISO 26262 Part 6 requirements for steering assist functions. |
Use Scenario: ABS, EBD, and ESC actuation coordination using wheel speed, yaw rate, and lateral acceleration inputs. IC Role / Device Role / Timing Role: High-integrity controller executing fail-operational braking logic with redundant sensor processing and CAN FD diagnostic messaging. Use Value: FCCU and MEMU provide hardware-level fault detection and reaction within <100 µs; 27-channel ADC supports simultaneous acquisition of all critical vehicle dynamics sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144 | ARM Cortex-M4F core, 112 MHz, 1 MB flash, ASIL-B certified, but lacks native CAN FD support in base configuration (requires external transceivers); no e200z2 Power Architecture compatibility. | Targeted at body electronics and gateway modules rather than powertrain; lower peak MIPS in deterministic control loops due to ARM interrupt latency profile. | Select when ARM toolchain ecosystem and AUTOSAR OS compatibility are prioritized over Power Architecture legacy code reuse and CAN FD integration density. |
| Renesas RH850/F1L | 32-bit RXv2 core, 120 MHz, 1.5 MB flash, ASIL-B certified, includes 4 CAN FD channels (vs. 7 on SPC582B60E1CD00X); higher static power consumption and larger die size. | Optimized for chassis and ADAS domains; limited eMIOS-equivalent timer flexibility for motor control PWM generation. | Select for applications requiring higher flash capacity and broader CAN FD channel count beyond 7, or where Renesas' safety library certification scope better matches OEM requirements. |
Compared with NXP S32K144 and Renesas RH850/F1L, the SPC582B60E1CD00X offers superior CAN FD interface density (7 channels), deterministic e200z2 timing for powertrain control, and tighter integration between BCTU, eMIOS, and ADC-reducing software overhead and improving loop jitter performance in engine management systems.
Availability
SPC582B60E1CD00X is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake control modules requiring stable component supply across automotive production lifecycles.
Supply support for SPC582B60E1CD00X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management solutions with over 40 years of microcontroller innovation.
The SPC582B series belongs to ST's automotive-grade Power Architecture MCU product line, designed specifically for ASIL-B-compliant powertrain and chassis control applications requiring high reliability, functional safety, and CAN FD network integration.
FAQ
What is the maximum junction temperature rating for SPC582B60E1CD00X?
The SPC582B60E1CD00X is rated for continuous operation at a maximum junction temperature of +150 °C, validated per AEC-Q100 Grade 0 qualification. This rating applies under specified voltage and thermal conditions defined in Section 4.3 of the datasheet, with derating required above 125 °C ambient depending on package thermal resistance and airflow.
Does SPC582B60E1CD00X support EEPROM emulation out of the box?
Yes, the 1088 KB on-chip flash includes dedicated 64 KB data flash partition with hardware-supported EEPROM emulation capability. The flash controller enables wear leveling, atomic write operations, and background erase scheduling-verified in ST's SPC582Bx Reference Manual and supported by ST's SPC5Studio middleware libraries.
How many CAN FD interfaces does SPC582B60E1CD00X integrate?
The SPC582B60E1CD00X integrates seven fully independent MCAN modules, each compliant with ISO 11898-1:2015 (CAN FD) and supporting flexible data-rate up to 5 Mbit/s. All modules share a unified message RAM architecture and support advanced filtering, loopback testing, and error confinement per ISO 26262 requirements.
Is Nexus Class 3 debug support available on SPC582B60E1CD00X?
Yes, the device implements full Nexus Class 3+ debug and trace interface per IEEE-ISTO 5001-2003, including real-time instruction trace, data trace, and stimulus control. It supports both 5-pin and 2-pin JTAG configurations (IEEE 1149.1/1149.7), enabling non-intrusive debugging and coverage analysis in safety-critical development environments.
SPC582B60E1CD00X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- SPC58 2B-Line
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI
- Peripherals:
- DMA, WDT
- Number of I/O:
- 48
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D 27x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC582B60E1CD00X FAQ
1.How can I place an order for SPC582B60E1CD00X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC582B60E1CD00X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC582B60E1CD00X reliable?
The price and inventory of SPC582B60E1CD00X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC582B60E1CD00X is usually 5 days.
3.What payment methods are accepted for SPC582B60E1CD00X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC582B60E1CD00X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC582B60E1CD00X?
SPC582B60E1CD00X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC582B60E1CD00X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC582B60E1CD00X?
For technical support, including SPC582B60E1CD00X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC582B60E1CD00X requirements.
6.How does Aetrix verify that SPC582B60E1CD00X is sourced from the original manufacturer or authorized distributors?
All SPC582B60E1CD00X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC582B60E1CD00X meets industry standards.
7.What is the process for return or replacement of SPC582B60E1CD00X?
All SPC582B60E1CD00X units undergo pre-shipment inspection (PSI). If there is an issue with SPC582B60E1CD00X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC582B60E1CD00X part is unused and in its original packaging.
Return procedure for SPC582B60E1CD00X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC582B60E1CD00X Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
