STMicroelectronics SPC582B60E1MH00Y

Overview

SPC582B60E1MH00Y from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller with e200z2 single core running at 80 MHz, 1088 KB on-chip flash (1024 KB code + 64 KB data), 96 KB SRAM, and ASIL-B functional safety compliance per ISO 26262. It integrates 7 MCAN interfaces with ISO CAN FD support, 6 LINFlexD modules, and a dual-PLL clock system for automotive body control, gateway, and chassis applications.

For engineers reviewing the SPC582B60E1MH00Y datasheet, SPC582B60E1MH00Y pinout, SPC582B60E1MH00Y application, or SPC582B60E1MH00Y equivalent, this MCU delivers deterministic real-time control, end-to-end ECC memory protection, BCTU-synchronized ADC triggering, and factory-programmable boot assist flash via CAN/LIN/UART - critical for ECU development under ASIL-B constraints.

Technical Context

The SPC582B60E1MH00Y implements a single-issue e200z2 CPU core compliant with Power Architecture embedded specification, featuring Variable Length Encoding (VLE) for reduced code footprint and integrated single-precision floating-point unit (EFPU2). Its crossbar switch enables concurrent bus master access to Flash, SRAM, and peripherals with end-to-end ECC integrity.

It embeds a comprehensive ASIL-B safety architecture including FCCU for failure notification handling, MEMU for memory error reporting, dual CRC units, and e2eECC logic across memory and interconnect paths. The BCTU synchronizes up to 27-channel 12-bit SAR ADC conversions with eMIOS timer events or PIT_RTIs to eliminate sampling collisions in motor control and sensor fusion.

Key Specifications

Pinout & Package

eTQFP64 package (10 mm × 10 mm × 1.0 mm, 0.5 mm pitch) with exposed thermal pad - optimized for compact automotive PCB layouts and thermal dissipation in engine bay and under-hood environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive MCU applications.

Compared with NXP S32K144 and Renesas RH850/F1L, the SPC582B60E1MH00Y uniquely combines Power Architecture determinism, native ISO CAN FD across 7 channels, BCTU-driven ADC synchronization, and e200z2 VLE code density - making it optimal for next-generation automotive gateways and safety-critical chassis controllers requiring both bandwidth and timing precision.

Availability

SPC582B60E1MH00Y is available at Aetrix Electronics and suitable for automotive body control modules, electric power steering systems, ADAS sensor hubs, and vehicle gateway modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for SPC582B60E1MH00Y includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing and AEC-Q100 qualification expertise.

The SPC582B series is ST's entry-level automotive MCU family designed to replace SPC560Bx, targeting ASIL-B applications with enhanced CAN FD connectivity, safety hardware acceleration, and 40 nm process efficiency for under-hood deployment.

FAQ

What is the maximum junction temperature rating for SPC582B60E1MH00Y?

The SPC582B60E1MH00Y is rated for continuous operation at a maximum junction temperature of +150 °C, validated per AEC-Q100 Grade 0 specifications. This rating applies under specified voltage and thermal conditions, with derating required above 125 °C ambient depending on PCB copper area and airflow. Thermal resistance (θ_JA) is 42 °C/W for the eTQFP64 package.

Does SPC582B60E1MH00Y support CAN FD with bit rates above 2 Mbps?

Yes - all 7 MCAN modules support ISO CAN FD with programmable bit rates up to 5 Mbps in the data phase, as confirmed in Section 4.15.3 of DS11597 Rev 5. The dual PLL architecture provides independent clock domains to maintain timing accuracy at high bit rates, and the integrated message RAM supports flexible TX/RX buffering for burst-mode FD frames.

How is ASIL-B compliance implemented in hardware on this MCU?

ASIL-B compliance is achieved through integrated hardware safety mechanisms: FCCU collects and routes failure notifications, MEMU monitors and reports memory errors, dual CRC units validate data integrity across peripherals and memory, and end-to-end ECC protects all data paths from Flash to SRAM to crossbar. These features are documented in the safety manual UM2291 and verified per ISO 26262 Part 5.

Can the Boot Assist Flash (BAF) be used for field firmware updates?

No - BAF is factory-programmed only via serial bootload using asynchronous CAN or LIN/UART during initial manufacturing. Field updates must use the main 1024 KB code flash with user-implemented bootloader logic. BAF contains immutable boot code and security keys; its contents cannot be modified post-production per ST's security architecture.