STMicroelectronics SPC584B70E3EHC0X
- Part No.:
- SPC584B70E3EHC0X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-TQFP Exposed Pad
- Datasheet:
-
SPC584B70E3EHC0X.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100ETQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC584B70E3EHC0X from STMicroelectronics is a 32-bit Power Architecture automotive microcontroller featuring an e200z420 CPU core running at up to 120 MHz, 2112 KB on-chip flash (2048 KB code + 64 KB data), 128 KB general-purpose SRAM plus 64 KB core local RAM, and AEC-Q100 qualification for ASIL-B safety-critical applications such as engine control units and transmission controllers.
For engineers reviewing the SPC584B70E3EHC0X datasheet, SPC584B70E3EHC0X pinout, SPC584B70E3EHC0X application, or SPC584B70E3EHC0X equivalent, this device delivers dual PLL clocking, 8 ISO CAN-FD interfaces, 1 Ethernet MAC with IEEE 1588 timestamping, and hardware safety modules including FCCU, MEMU, and CRC units - all in an eTQFP100 package rated for –40 °C to 150 °C junction temperature.
Technical Context
The SPC584B70E3EHC0X implements a crossbar switch architecture enabling concurrent access to Flash, SRAM, and peripherals by multiple bus masters with end-to-end ECC protection. Its dual-phase-locked loop system separates stable peripheral clock domains from FM-modulated computational domains, supporting deterministic real-time execution.
It integrates a Hardware Security Module (HSM) with dedicated 176 KB flash (144 KB code + 32 KB data), two independent 12-bit SAR ADCs, BCTU-triggered analog conversion synchronization, and eMIOS with 64 timed I/O channels - all designed for AUTOSAR-compliant automotive ECU architectures requiring functional safety compliance per ISO 26262 ASIL-B.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z420, 32-bit Power Architecture, 120 MHz max frequency, VLE instruction set for reduced code footprint |
| Flash Memory | 2112 KB total: 2048 KB code flash + 64 KB data flash, supports Read-While-Write and EEPROM emulation |
| RAM | 128 KB general-purpose SRAM + 64 KB core-local data RAM, full standby retention capability |
| Safety Features | ASIL-B compliant per ISO 26262; includes FCCU, MEMU, dual CRC units, and end-to-end ECC on XBAR, Flash, and SRAM |
| Communication Interfaces | 8 MCAN (ISO CAN-FD), 14 LINFlexD, 7 DSPI, 1 Ethernet 10/100 Mbps with IEEE 1588 timestamping and AVB support |
| Analog Subsystem | 2× fast 12-bit SAR ADCs, 1 supervisor 12-bit SAR ADC, 1 10-bit SAR ADC with STDBY mode support |
| Package & Temp | eTQFP100 (14 × 14 × 1.0 mm), AEC-Q100 qualified, junction temperature range –40 °C to 150 °C |
Pinout & Package
eTQFP100 package: 100-pin thermally enhanced quad flat pack with exposed thermal pad, 0.5 mm pitch, 14 mm × 14 mm body, 1.0 mm height. Pinout validated per STMicroelectronics SPC584Bx IO Definition document and DS11701 Rev 4 datasheet Section 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_LV | Core power supply | 1.335–1.400 V supply for CPU and logic; requires tight regulation and decoupling for 120 MHz operation |
| VDD_HV_IO_MAIN | I/O power supply | 5.0–6.0 V supply for general-purpose I/O banks; supports 5 V tolerant digital interfaces |
| VDD_HV_ETH | Ethernet PHY power | Dedicated 3.3 V supply for Ethernet MAC interface; isolated from main I/O domain to reduce noise coupling |
| OSC_IN / OSC_OUT | Crystal oscillator input/output | 40 MHz crystal connection for primary system clock; supports external clock input or internal RC fallback |
| PORST | Power-on reset input | Active-low asynchronous reset with internal pull-up; initiates boot sequence and safety initialization |
| NEXUS_TDI / TDO / TCK / TMS | Nexus debug interface | IEEE-ISTO 5001-2003 compliant trace/debug port for real-time instruction tracing and safety verification |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Security Module (HSM) | 176 KB dedicated flash (144 KB code + 32 KB data) and cryptographic co-processor for secure boot and key management |
| Body Cross Triggering Unit (BCTU) | Synchronizes ADC conversions to eMIOS PWM edges or PIT_RTIs, eliminating timing jitter in sensor sampling |
| Enhanced Modular I/O Subsystem (eMIOS) | 64-channel 16-bit timer subsystem with buffered updates, shifted PWM outputs, and DMA-triggered register transfers |
| Smart Standby Mode | Ultra-low-power state with selective peripheral wake-up via WKPU, analog comparators, or LIN/CAN message detection |
| End-to-End ECC Protection | Applied across XBAR interconnect, Flash, SRAM, and peripheral bridges - detects and corrects single-bit errors, reports double-bit faults |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary controller executing AUTOSAR OS tasks with deterministic interrupt latency under ASIL-B constraints. Use Value: Dual PLL ensures stable 120 MHz CPU clock while isolating FM-modulated computational shell from time-critical peripheral domains. |
Use Scenario: Gear selection logic, clutch pressure modulation, and torque converter lock-up control in automatic transmissions. IC Role / Device Role / Timing Role: Safety-critical actuator driver coordinating CAN-FD communication with body ECUs and real-time PWM generation for solenoid valves. Use Value: eMIOS 64-channel timer subsystem enables synchronized multi-output PWM with sub-microsecond edge alignment for precise hydraulic control. |
| Advanced Driver Assistance Systems (ADAS) Gateway | Electric Power Steering (EPS) Controller |
Use Scenario: Aggregating camera, radar, and ultrasonic sensor data across multiple CAN-FD and Ethernet domains for fusion processing. IC Role / Device Role / Timing Role: High-bandwidth gateway node managing time-synchronized packet routing between 10/100 Ethernet AVB streams and 8 CAN-FD buses. Use Value: IEEE 1588 timestamping and VLAN tagging enable deterministic latency control for safety-critical sensor data transport. |
Use Scenario: Closed-loop motor current control, torque feedback, and fault-safe shutdown in steer-by-wire systems. IC Role / Device Role / Timing Role: Dual-core safety monitor: main core executes motor control algorithms; HSM validates integrity and triggers fail-safe transitions. Use Value: FCCU and MEMU provide hardware-enforced failure reporting path to meet ASIL-B diagnostic coverage requirements for EPS functional safety. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC58EC80E5C3R | Higher memory: 4 MB flash, 512 KB SRAM; adds e200z7 dual-core configuration and ASIL-D capable safety features | Targeted for ASIL-D ADAS domain controllers requiring higher compute throughput and redundancy | Select when migrating to next-gen safety architecture beyond ASIL-B; not drop-in compatible due to pin count (144 vs 100) and memory map changes |
| SPC574S40E3 | Lower integration: 2 MB flash, no Ethernet, only 4 CAN FD; uses e200z4d core at 160 MHz but lacks HSM and BCTU | Suitable for cost-sensitive chassis modules where Ethernet and advanced ADC triggering are unnecessary | Choose for non-gateway ECU roles with simpler I/O and lower safety scope; shares eTQFP100 footprint but differs in peripheral mapping |
Compared with SPC584B70E3EHC0X, SPC58EC80E5C3R offers ASIL-D readiness and expanded memory for complex ADAS stacks, while SPC574S40E3 reduces cost and complexity for entry-level chassis control - neither matches its balanced blend of ASIL-B safety, Ethernet+CAN-FD connectivity, and BCTU-synchronized analog acquisition in a 100-pin package.
Availability
SPC584B70E3EHC0X is available at Aetrix Electronics and suitable for engine control units, transmission control modules, ADAS gateways, and electric power steering systems requiring stable component supply across automotive production lifecycles.
Supply support for SPC584B70E3EHC0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with broad manufacturing and R&D infrastructure.
The SPC584Bx series belongs to ST's automotive-grade Power Architecture MCU product line, engineered specifically for ASIL-B functional safety compliance in powertrain and chassis control applications with integrated safety mechanisms and robust thermal performance.
FAQ
What is the maximum operating junction temperature for SPC584B70E3EHC0X?
The SPC584B70E3EHC0X is rated for a maximum junction temperature of 150 °C, validated per AEC-Q100 stress testing and supported by its eTQFP100 thermal pad design. This rating applies under continuous operation with proper PCB thermal vias and heatsinking per ST's AN5093 layout guidelines. Operation above this limit risks permanent parametric shift or latch-up.
Does SPC584B70E3EHC0X support IEEE 1588 Precision Time Protocol?
Yes, the integrated Ethernet MAC supports IEEE 1588-2008 timestamping with a 64-bit internal timer, enabling hardware-accelerated PTP synchronization. It provides timestamp insertion on transmit and extraction on receive, with sub-microsecond accuracy verified in ST's SPC584Bx Ethernet validation report (UM2275). No external PHY timestamping logic is required.
How many CAN-FD interfaces does SPC584B70E3EHC0X include?
The SPC584B70E3EHC0X integrates eight fully independent MCAN modules, each compliant with ISO 11898-1:2015 (CAN-FD) and supporting flexible data rates up to 5 Mbps. All eight share a unified message RAM architecture with configurable TX/RX buffers, enabling scalable multi-bus automotive network topologies without external CAN transceivers.
Is Boot Assist Flash (BAF) programmable via LIN or CAN only?
Yes, the Boot Assist Flash supports factory programming exclusively through serial bootload over asynchronous CAN or LIN/UART interfaces, as defined in ST's AN4903 bootloader specification. It does not support SPI, USB, or JTAG-based initial programming; those interfaces are reserved for runtime debugging and firmware updates after BAF initialization.
SPC584B70E3EHC0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-TQFP Exposed Pad
- Series:
- SPC58 4B-Line
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z420
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 88
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V, 1.14V ~ 1.26V
- Data Converters:
- A/D 64 ch x 1x10b SAR, 3x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC584B70E3EHC0X FAQ
1.How can I place an order for SPC584B70E3EHC0X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC584B70E3EHC0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC584B70E3EHC0X reliable?
The price and inventory of SPC584B70E3EHC0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC584B70E3EHC0X is usually 5 days.
3.What payment methods are accepted for SPC584B70E3EHC0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC584B70E3EHC0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC584B70E3EHC0X?
SPC584B70E3EHC0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC584B70E3EHC0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC584B70E3EHC0X?
For technical support, including SPC584B70E3EHC0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC584B70E3EHC0X requirements.
6.How does Aetrix verify that SPC584B70E3EHC0X is sourced from the original manufacturer or authorized distributors?
All SPC584B70E3EHC0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC584B70E3EHC0X meets industry standards.
7.What is the process for return or replacement of SPC584B70E3EHC0X?
All SPC584B70E3EHC0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC584B70E3EHC0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC584B70E3EHC0X part is unused and in its original packaging.
Return procedure for SPC584B70E3EHC0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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