STMicroelectronics SPC584B70E5EHC0X

Overview

SPC584B70E5EHC0X from STMicroelectronics is a 32-bit Power Architecture automotive microcontroller featuring an e200z420 CPU core operating at up to 120 MHz, 2112 KB on-chip flash (2048 KB code + 64 KB data), 128 KB general-purpose SRAM plus 64 KB core local RAM, and ASIL-B functional safety compliance per ISO 26262. It integrates 8 MCAN interfaces with ISO CAN-FD support, 1 Ethernet MAC (10/100 Mbps, IEEE 802.3-2008), and dual PLLs for segregated clock domains-used in engine control units and ADAS domain controllers requiring deterministic real-time execution and safety-critical firmware integrity.

For engineers reviewing the SPC584B70E5EHC0X datasheet, SPC584B70E5EHC0X pinout, SPC584B70E5EHC0X application, or SPC584B70E5EHC0X equivalent, key selection criteria include its AEC-Q100 qualification, 176 KB HSM-dedicated flash for secure boot and cryptographic operations, crossbar switch with end-to-end ECC for concurrent bus master access, and BCTU-triggered ADC synchronization across 64 eMIOS channels-critical for time-sensitive sensor fusion and motor control timing alignment.

Technical Context

The SPC584B70E5EHC0X implements a dual-PLL architecture: PLL0 provides stable clocks for peripherals and communication modules (Ethernet, MCAN, DSPI), while PLL1 delivers FM-modulated clocks to the computational shell for jitter-sensitive signal processing. Its crossbar switch enables simultaneous access to Flash, SRAM, and peripherals by up to six bus masters-including the main e200z420 core, HSM, eDMA, and debug interface-with full end-to-end ECC protection on all data paths.

Safety architecture includes FCCU for failure notification handling, MEMU for memory error detection and reporting, and CRC units for data integrity verification across flash, RAM, and peripheral registers. The HSM contains a dedicated e200z0 core with 144 KB code + 32 KB data flash, enabling isolated secure boot, key management, and cryptographic acceleration independent of the main application core.

Key Specifications

Pinout & Package

eTQFP144 (20 × 20 × 1.0 mm) package with 144 leads, thermally enhanced for automotive under-hood operation; RoHS-compliant, AEC-Q100 qualified, junction temperature range –40 °C to +150 °C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive ASIL-B microcontroller applications.

Compared with S32K344 and RH850/U2A, the SPC584B70E5EHC0X offers optimal balance of ASIL-B certification, CAN-FD/Ethernet integration, and Power Architecture deterministic timing-making it ideal for mid-tier domain controllers where cost, thermal footprint, and proven automotive qualification outweigh raw compute headroom.

Availability

SPC584B70E5EHC0X is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, electric power steering modules, and vehicle gateway systems requiring stable component supply, long lifecycle support, and AEC-Q100-compliant traceability.

Supply support for SPC584B70E5EHC0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with over 40 years of automotive qualification experience.

The SPC584Bx series belongs to ST's SPC5 automotive MCU family, designed specifically for ASIL-B real-time control applications in powertrain, chassis, and advanced driver assistance systems-emphasizing functional safety, mixed-signal integration, and seamless AUTOSAR compatibility.

FAQ

What is the maximum junction temperature rating for SPC584B70E5EHC0X?

The SPC584B70E5EHC0X is rated for a maximum junction temperature of +150 °C, validated per AEC-Q100 Grade 0 requirements. This enables deployment in under-hood environments such as engine control modules and transmission control units where ambient temperatures exceed 105 °C. Thermal derating curves and PCB layout guidelines are provided in Section 5.5 of the DS11701 datasheet.

Does SPC584B70E5EHC0X support CAN FD with bit rates above 2 Mbps?

No. The SPC584B70E5EHC0X supports ISO CAN-FD up to 5 Mbps in the data phase, as confirmed in Section 2.3 and Table 2 of DS11701 Rev 4. Its MCAN modules implement the full CAN FD protocol stack including flexible data length (up to 64 bytes) and dual-bitrate switching, but do not extend beyond the ISO 11898-1:2015 specification limit of 5 Mbps for data phase transmission.

How is the Hardware Security Module (HSM) isolated from the main CPU?

The HSM is physically isolated via a dedicated e200z0 core, separate 176 KB flash (144 KB code + 32 KB data), and private bus interface. It operates independently with its own clock domain, reset logic, and memory protection unit-preventing unauthorized access to cryptographic keys or secure boot code even if the main e200z420 core is compromised. Communication occurs only through defined mailbox registers with strict access control.

Can SPC584B70E5EHC0X execute code directly from SRAM?

Yes. The device supports XIP (execute-in-place) from its 128 KB general-purpose SRAM, which retains full contents in STANDBY mode. This enables ultra-fast wake-up and deterministic real-time response for safety-critical routines such as watchdog refresh or fault-handling ISR execution-bypassing flash access latency and eliminating dependency on flash power-up sequencing.