STMicroelectronics SPC584B70E7NG00X

Overview

SPC584B70E7NG00X from STMicroelectronics is a 32-bit Power Architecture automotive microcontroller featuring an e200z420 CPU core running at up to 120 MHz, 2112 KB on-chip flash (2048 KB code + 64 KB data), 128 KB general-purpose SRAM, and ASIL-B functional safety compliance per ISO 26262. It integrates 8 MCAN interfaces with ISO CAN-FD support, 1 Ethernet 10/100 Mbps controller with IEEE 1588 timestamping, and dual PLLs for segregated clock domains - deployed in engine control units and ADAS domain controllers.

For engineers reviewing the SPC584B70E7NG00X datasheet, SPC584B70E7NG00X pinout, SPC584B70E7NG00X application, or SPC584B70E7NG00X equivalent, key selection criteria include AEC-Q100 qualification, junction temperature range (–40 °C to 150 °C), eLQFP176 package footprint, HSM-secured boot via CAN/LIN, and crossbar-switch concurrency with end-to-end ECC for safety-critical real-time execution.

Technical Context

The SPC584B70E7NG00X implements a dual-PLL architecture: PLL0 delivers stable clocks to peripherals and memory subsystems, while PLL1 supplies the FM modulation domain for computational shell timing. Its crossbar switch enables concurrent access by multiple bus masters (eDMA, CPU, HSM) to Flash, SRAM, and peripherals - all protected by end-to-end ECC on data paths.

Safety is enforced through dedicated hardware: FCCU collects and reacts to failure notifications; MEMU monitors and reports memory errors; CRC units validate data integrity across critical memory regions; and the Hardware Security Module includes a cryptographic co-processor with 176 KB dedicated flash (144 KB code + 32 KB data) for secure boot and runtime attestation.

Key Specifications

Pinout & Package

eLQFP176 package: 176-pin low-profile quad flat pack with exposed thermal pad, 0.4 mm pitch, body size 24 mm × 24 mm × 1.4 mm, designed for high-reliability automotive PCB assembly and thermal dissipation in under-hood environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive ASIL-B microcontroller applications.

Compared with SPC584B70E7NG00X, the S32K344 offers higher clock speed and memory but lacks native IEEE 1588 Ethernet and integrated HSM; the RH850/U2A provides dual Ethernet and higher compute throughput but requires external security components - making SPC584B70E7NG00X optimal for cost-sensitive, safety-certified gateway and domain controller designs requiring embedded time synchronization and hardware-rooted trust.

Availability

SPC584B70E7NG00X is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, electric powertrain inverters, and vehicle gateway modules requiring stable component supply across extended automotive production lifecycles.

Supply support for SPC584B70E7NG00X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management solutions with vertical manufacturing capabilities and AEC-Q100 design assurance.

The SPC584Bx series belongs to ST's automotive microcontroller product line, engineered specifically for ASIL-B real-time control applications including powertrain, chassis, and advanced driver assistance systems - emphasizing functional safety, mixed-signal integration, and long-term automotive supply chain reliability.

FAQ

What is the maximum junction temperature rating for SPC584B70E7NG00X?

The SPC584B70E7NG00X is rated for a junction temperature range of –40 °C to +150 °C, validated per AEC-Q100 stress testing protocols. This rating applies to continuous operation under specified voltage and load conditions, with thermal derating required above 125 °C ambient depending on PCB layout and airflow. The device includes on-die temperature sensors and thermal shutdown circuitry to prevent permanent damage during transient overtemperature events.

Does SPC584B70E7NG00X support secure boot from factory-programmed flash?

Yes - the Boot Assist Flash (BAF) region supports factory programming via serial bootload over asynchronous CAN or LIN/UART. Secure boot is enforced by the Hardware Security Module (HSM), which verifies digital signatures of boot images stored in protected flash sectors before execution. The HSM includes dedicated 144 KB code flash and 32 KB data flash, with cryptographic acceleration for SHA-256 and AES-128 operations required in the boot validation chain.

How many CAN-FD interfaces does SPC584B70E7NG00X provide, and what memory resources do they use?

The SPC584B70E7NG00X integrates eight fully independent MCAN modules compliant with ISO CAN-FD 2.0. Each module uses dedicated message RAM located within its own peripheral cluster - not shared system RAM - enabling concurrent transmission/reception without software arbitration. Message RAM allocation is configurable per channel (up to 256 bytes per FIFO), and all CAN-FD buffers reside in on-chip SRAM protected by ECC, ensuring deterministic latency and fault resilience.

Is the Ethernet controller capable of hardware-accelerated IPv4/IPv6 checksum offloading?

Yes - the integrated 10/100 Mbps Ethernet MAC includes dedicated IPv4 and IPv6 checksum calculation hardware that operates transparently during packet transmit and receive operations. This offloads the CPU from software-based checksum computation, reducing processing overhead by ~120 cycles per packet and enabling line-rate throughput at 100 Mbps with minimal CPU utilization. Checksum validation is performed in-line before frame delivery to the application layer, supporting AUTOSAR-compliant TCP/IP stack integration.