My Inquiry
My Account
STMicroelectronics SPC584C70E1F0C1X
- Part No.:
- SPC584C70E1F0C1X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
SPC584C70E1F0C1X.pdf
- Description:
- Linear IC's
- Quantity:
- Payment:
- Shipping:
Inventory:1,291
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC584C70E1F0C1X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller with dual e200z420n3 cores running at 180 MHz, 4 MB on-chip flash (4096 KB code + 128 KB data), Hardware Security Module (HSM), and ASIL-B functional safety compliance per ISO 26262. It integrates 384 KB general-purpose SRAM, 64-channel eDMA, 8 MCAN interfaces supporting ISO CAN-FD, and dual FlexRay channels for advanced driver assistance systems (ADAS) domain controllers.
For engineers reviewing the SPC584C70E1F0C1X datasheet, SPC584C70E1F0C1X pinout, SPC584C70E1F0C1X application, or SPC584C70E1F0C1X equivalent, key selection criteria include dual-core lock-step capability for safety-critical execution, HSM-secured boot and cryptographic acceleration, real-time ADC synchronization via BCTU/eMIOS, and IEEE 802.3-2008-compliant 10/100 Mbps Ethernet with IEEE 1588 timestamping.
Technical Context
The SPC584C70E1F0C1X implements a dual-core delayed lock-step architecture with redundancy checkers and dedicated Memory Error Management Unit (MEMU) to detect and report memory errors across Flash, SRAM, and peripheral registers. Its crossbar switch (XBAR) enables concurrent bus master access to peripherals, Flash, and RAM with end-to-end ECC protection on all critical paths.
It features two independent PLLs: PLL0 provides stable clock domains for peripherals and system logic, while PLL1 delivers FM-modulated clocks for computational shell timing; both support dynamic frequency scaling. The HSM contains 176 KB dedicated flash (144 KB code + 32 KB data) and executes secure boot, AES-128/256, SHA-256, and RSA-2048 operations independently of main cores.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z420n3 32-bit Power Architecture CPUs with VLE support; enables code density reduction and deterministic real-time execution. |
| Max Core Frequency | 180 MHz; guarantees worst-case interrupt latency and control loop timing in ASIL-B automotive applications. |
| Flash Memory | 4224 KB total: 4096 KB code flash + 128 KB data flash; supports Read-While-Write and EEPROM emulation across multiple RWW partitions. |
| HSM Flash | 176 KB dedicated HSM flash (144 KB code + 32 KB data); isolates security firmware from application code for tamper resistance. |
| SRAM | 384 KB general-purpose SRAM + 128 KB core-local RAM (64 KB per CPU); enables low-latency data buffering and cache-coherent multi-core operation. |
| Safety Features | ASIL-B compliant per ISO 26262; includes FCCU, MEMU, CRC units, and dual-lockstep core monitoring with error injection test support. |
| Communication Interfaces | 8 MCAN (ISO CAN-FD), 18 LINFlexD, 8 DSPI, dual-channel FlexRay, and 10/100 Mbps Ethernet with IEEE 1588 timestamping and AVB/VLAN support. |
| ADC System | 5 SAR converters: 3×12-bit fast ADCs, 1×12-bit supervisor ADC, 1×10-bit STDBY ADC; synchronized via BCTU triggers from eMIOS/PIT for precise sensor sampling. |
Pinout & Package
eLQFP176 package (24 mm × 24 mm × 1.4 mm), RoHS-compliant, with 176 leads and exposed thermal pad. Designed for automotive PCB layouts requiring high I/O count, thermal reliability, and EMI robustness under -40 °C to 150 °C junction temperature.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_IO_MAIN | Main I/O supply rail | 6.0 V tolerant power domain for LINFlexD, DSPI, and GPIO; enables direct connection to 5 V automotive buses without level shifters. |
| VDD_LV | Core logic supply | 1.35 V nominal (±0.05 V) regulated voltage for CPU, cache, and XBAR; requires external LDO or integrated regulator per datasheet Section 4.15.2. |
| PORST | Power-on reset input | Active-low asynchronous reset with internal pull-up; initiates hardware reset sequence including flash controller initialization and HSM boot validation. |
| OSC_IN / OSC_OUT | 40 MHz crystal oscillator interface | Differential CMOS inputs for external 40 MHz crystal; feeds PLL0 reference clock and enables jitter-free system timing for Ethernet and FlexRay. |
| ETH_MDIO / ETH_MDC | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC pins for PHY register configuration and link status monitoring in time-sensitive networking stacks. |
| MCAN0_TX / MCAN0_RX | CAN-FD channel 0 differential pair | ISO 11898-1 compliant physical layer interface supporting up to 5 Mbps FD data rate; integrated transceiver biasing and filtering. |
| ETM_TRACE[0:3] | Nexus trace output | 4-bit parallel trace bus for real-time instruction and data flow visibility during debug; supports Class 3+ Nexus standard per IEEE-ISTO 5001-2003. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lock-step with redundancy checkers | Hardware-enforced instruction-level comparison between cores; detects transient faults and triggers FCCU-controlled fail-safe response within ≤1 µs. |
| Body Cross Triggering Unit (BCTU) | Configurable event routing from eMIOS timers or PIT_RTIs to ADC start-of-conversion; eliminates software overhead and ensures sub-microsecond sensor sampling alignment. |
| HSM with dedicated flash and crypto engines | Independent execution environment with AES-128/256, SHA-256, and RSA-2048 acceleration; prevents side-channel leakage and isolates key material from main firmware. |
| End-to-end ECC on XBAR interconnect | Single-bit error correction and double-bit error detection applied to all read/write transactions across Flash, SRAM, and peripheral clusters. |
| Smart Standby with RTC and Wake-up Unit | Ultra-low-power mode consuming <5 µA while maintaining RTC accuracy and monitoring up to 32 digital inputs; enables predictive wake-up for battery-powered ADAS sensors. |
| IEEE 1588-2008 timestamping engine | Hardware timestamp insertion into Ethernet frames with ±50 ns precision; enables deterministic time synchronization across distributed ECUs in vehicle networks. |
Applications
| ADAS Domain Controller | Electric Powertrain Inverter Control |
|---|---|
|
Use Scenario: Centralized processing unit aggregating radar, camera, and ultrasonic sensor data for fusion and path planning. IC Role / Device Role / Timing Role: Dual-core real-time scheduler executing AUTOSAR OS tasks with deterministic latency; Ethernet and CAN-FD handle high-bandwidth sensor streaming and actuator command distribution. Use Value: Lock-step execution ensures fault containment during sensor fusion calculations; IEEE 1588 timestamping aligns multi-sensor timestamps to <100 ns tolerance. |
Use Scenario: Closed-loop motor control for traction inverters using field-oriented control (FOC) algorithms and current/voltage feedback. IC Role / Device Role / Timing Role: High-speed ADC synchronization via BCTU triggers eMIOS PWM outputs and captures phase currents with <1 µs jitter; dual PLLs isolate computational and PWM timing domains. Use Value: 180 MHz core frequency and 64 KB local RAM per core enable sub-10 µs FOC loop execution; STDBY-mode 10-bit ADC monitors auxiliary battery voltage during sleep. |
| Vehicle Gateway Module | Secure OTA Update Controller |
|
Use Scenario: Protocol translation and firewall between CAN, LIN, FlexRay, and Ethernet domains in zonal architecture. IC Role / Device Role / Timing Role: Multi-protocol bridge with 8 MCAN, 18 LINFlexD, dual FlexRay, and Ethernet MAC; HSM validates message authenticity and enforces routing policies. Use Value: Shared memory scheme in MCAN reduces CPU load by 40% vs. register-based access; FlexRay dual-channel redundancy supports safety-critical brake-by-wire forwarding. |
Use Scenario: Secure boot and authenticated firmware update for ECU clusters using signed differential patches over CAN-FD or Ethernet. IC Role / Device Role / Timing Role: HSM performs signature verification (RSA-2048), decryption (AES-256), and secure flash programming; Boot Assist Flash (BAF) enables factory reprogramming via LIN/UART. Use Value: 176 KB HSM flash stores immutable root-of-trust keys and update policy engine; ASIL-B safety monitor ensures rollback integrity during partial flash writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | ARM Cortex-M7 dual-core (up to 320 MHz), 4 MB flash, ASIL-D capable, no integrated FlexRay or Ethernet MAC. | Targets higher-ASIL domains (e.g., chassis control) but requires external PHY for Ethernet and external FlexRay transceivers. | Select when ASIL-D certification is mandatory and FlexRay/Ethernet are implemented externally. |
| Renesas RH850/U2A | 32-bit RXv3 core (up to 400 MHz), 8 MB flash, ASIL-B, 10/100 Ethernet, but only 4 CAN FD and no HSM with dedicated flash. | Optimized for powertrain control with high analog integration; lacks BCTU-style ADC triggering and HSM isolation for OTA security. | Select for cost-sensitive powertrain applications where cryptographic acceleration is handled by external SE. |
Compared with NXP S32K344 and Renesas RH850/U2A, the SPC584C70E1F0C1X uniquely combines ASIL-B safety, integrated FlexRay/Ethernet, and HSM with dedicated flash-enabling single-chip gateway and domain controller designs without external security co-processors or protocol bridges.
Availability
SPC584C70E1F0C1X is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, electric powertrain inverter modules, vehicle gateway systems, and secure OTA update controllers requiring stable component supply across extended product lifecycles.
Supply support for SPC584C70E1F0C1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing and AEC-Q100 qualification expertise.
The SPC58 C Line targets next-generation automotive domain controllers and zonal gateways, emphasizing ASIL-B functional safety, hardware-accelerated security, and multi-protocol connectivity for software-defined vehicle architectures.
FAQ
What is the maximum junction temperature rating for SPC584C70E1F0C1X?
The SPC584C70E1F0C1X is rated for continuous operation at a junction temperature range of –40 °C to +150 °C, validated per AEC-Q100 Grade 0 requirements. Thermal derating begins above 135 °C ambient with forced airflow; full electrical specifications are guaranteed up to 150 °C junction per DS11620 Rev 8 Section 4.6.
Does SPC584C70E1F0C1X support CAN FD with bit-rate switching?
Yes, all eight MCAN interfaces comply with ISO 11898-1:2015 and support flexible data-rate (CAN FD) with separate arbitration and data phase bit rates. The hardware implements advanced shared memory schemes and automatic bit-rate switching without CPU intervention, as confirmed in Section 2.3 and Table 2 of DS11620 Rev 8.
How is the Hardware Security Module (HSM) isolated from the main cores?
The HSM operates as a physically separate subsystem with its own 176 KB flash, 32 KB data RAM, cryptographic accelerators (AES/SHA/RSA), and dedicated bus interface. It boots independently, enforces strict memory protection via SMPU, and communicates with main cores only through defined mailbox registers-preventing DMA or cache-based side-channel attacks per SPC584Cx security documentation.
Can SPC584C70E1F0C1X execute AUTOSAR Classic and Adaptive simultaneously?
No. The SPC584C70E1F0C1X supports AUTOSAR Classic exclusively, with certified MCAL drivers for MCAN, Ethernet, ADC, and eMIOS. AUTOSAR Adaptive requires POSIX-compliant OS and virtualization support not present in this Power Architecture device; ST recommends SPC58ECx variants or SPC574S for Adaptive use cases.
SPC584C70E1F0C1X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- SPC58
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- e200z4
- Core Size:
- 32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, Temp Sensor, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 448K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 10/12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC584C70E1F0C1X FAQ
1.How can I place an order for SPC584C70E1F0C1X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC584C70E1F0C1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC584C70E1F0C1X reliable?
The price and inventory of SPC584C70E1F0C1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC584C70E1F0C1X is usually 5 days.
3.What payment methods are accepted for SPC584C70E1F0C1X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC584C70E1F0C1X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC584C70E1F0C1X?
SPC584C70E1F0C1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC584C70E1F0C1X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC584C70E1F0C1X?
For technical support, including SPC584C70E1F0C1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC584C70E1F0C1X requirements.
6.How does Aetrix verify that SPC584C70E1F0C1X is sourced from the original manufacturer or authorized distributors?
All SPC584C70E1F0C1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC584C70E1F0C1X meets industry standards.
7.What is the process for return or replacement of SPC584C70E1F0C1X?
All SPC584C70E1F0C1X units undergo pre-shipment inspection (PSI). If there is an issue with SPC584C70E1F0C1X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC584C70E1F0C1X part is unused and in its original packaging.
Return procedure for SPC584C70E1F0C1X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC584C70E1F0C1X Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
