STMicroelectronics SPC584C70E3F000X

Overview

SPC584C70E3F000X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller with dual e200z420n3 cores operating at up to 180 MHz, 4 MB on-chip flash (4096 KB code + 128 KB data), hardware security module (HSM), and ASIL-B functional safety compliance. It integrates 384 KB general-purpose SRAM, 64-channel eDMA, and dual PLLs for peripheral and computational clock domains. Used in engine control units (ECUs) requiring real-time deterministic execution and secure firmware updates.

For engineers reviewing the SPC584C70E3F000X datasheet, SPC584C70E3F000X pinout, SPC584C70E3F000X application, or SPC584C70E3F000X equivalent, key selection criteria include dual-core lock-step readiness for ASIL-B, ISO CAN-FD support across eight MCAN interfaces, 18 LINFlexD modules for body electronics, and HSM-secured boot via CAN/LIN serial bootloader.

Technical Context

The SPC584C70E3F000X implements a dual-issue e200z420n3 CPU core pair with Variable Length Encoding (VLE) instruction set, 8 KB I-Cache and 4 KB D-Cache per core, and 64 KB local data RAM per core. Its crossbar switch architecture enables concurrent access to Flash, SRAM, and peripherals with end-to-end ECC protection across all bus masters.

Safety-critical operation is enabled by FCCU for failure notification handling, MEMU for memory error reporting, CRC units for data integrity, and delayed lock-step with redundancy checkers. The HSM contains 176 KB dedicated flash (144 KB code + 32 KB data) and executes cryptographic operations independently of main cores.

Key Specifications

Pinout & Package

eTQFP100 package (14 × 14 × 1.0 mm, 100-pin thermally enhanced quad flat pack) with exposed thermal pad; pinout defined per STMicroelectronics IO_Definition document for SPC584Cx series.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive MCU applications.

Compared with SPC58EC70E3F000X, the SPC584C70E3F000X delivers higher HSM compute throughput via dual e200z420n3 cores in the security module, while versus NXP S32K344, it provides native FlexRay and Ethernet MAC integration-reducing BOM count and PCB complexity in gateway and domain controller designs.

Availability

SPC584C70E3F000X is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, electric power steering systems, and vehicle gateway modules requiring stable component supply across automotive production lifecycles.

Supply support for SPC584C70E3F000X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with broad manufacturing and qualification capabilities.

The SPC58 C Line targets next-generation automotive ECUs demanding ASIL-B functional safety, secure over-the-air updates, and heterogeneous connectivity-designed specifically for powertrain, chassis, and zonal gateway applications.

FAQ

What is the maximum junction temperature rating for SPC584C70E3F000X?

The SPC584C70E3F000X is rated for a junction temperature range of –40 °C to +150 °C, qualified per AEC-Q100 Grade 1. This allows deployment in under-hood environments such as engine control modules where ambient temperatures exceed 125 °C and thermal design must accommodate sustained high-power operation without derating.

Does SPC584C70E3F000X support ISO CAN-FD on all eight MCAN interfaces?

Yes, all eight MCAN modules support ISO CAN-FD (Controller Area Network Flexible Data-Rate) with data rates up to 5 Mbps, configurable message RAM allocation, and advanced shared memory schemes. Each MCAN interface includes dedicated TX/RX pins and supports both classic CAN and CAN-FD frame formats without external transceivers.

How is the Hardware Security Module (HSM) physically isolated from the main cores?

The HSM is implemented as a separate, dedicated subsystem with its own e200z420n3 core, 176 KB flash (144 KB code + 32 KB data), and private bus interface. It operates under independent clock and power domains, enforces strict memory protection via SMPU, and communicates with main cores only through defined mailbox registers-preventing direct memory access or privilege escalation.

Can SPC584C70E3F000X execute AUTOSAR OS on both cores simultaneously?

Yes, the dual e200z420n3 cores support symmetric multiprocessing (SMP) and asymmetric multiprocessing (AMP) configurations. AUTOSAR OS can be deployed in AMP mode-running separate OS instances per core-or in SMP-aware variants that distribute tasks across both cores, leveraging the 64-channel eDMA and crossbar switch for low-latency inter-core communication.