Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

STMicroelectronics SPC584C70E3FMC0X

Name: SPC584C70E3FMC0X
Brand: STMicroelectronics
SKU: SPC584C70E3FMC0X
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: SPC584C70E3FMC0X

Manufacturer:: STMicroelectronics

Category:: Microcontrollers

Package:: 100-TQFP Exposed Pad

Datasheet:: SPC584C70E3FMC0X.pdf

Description:: IC MCU 32BIT 2MB FLASH 100ETQFP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,253

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

SPC584C70E3FMC0X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller with dual e200z420n3 cores running at up to 180 MHz, 4 MB on-chip flash (4096 KB code + 128 KB data), Hardware Security Module (HSM), and ASIL-B functional safety compliance per ISO 26262. It targets engine control units (ECUs), transmission control modules, and battery management systems requiring deterministic real-time performance and secure firmware execution.

For engineers reviewing the SPC584C70E3FMC0X datasheet, SPC584C70E3FMC0X pinout, SPC584C70E3FMC0X application, or SPC584C70E3FMC0X equivalent, this MCU delivers dual-core lock-step readiness, integrated CAN-FD and Ethernet AVB interfaces, on-chip SRAM with ECC, and production-ready safety mechanisms including FCCU, MEMU, and CRC units - critical for automotive ECU architecture validation and ASIL-B system integration.

Technical Context

The SPC584C70E3FMC0X implements a dual-issue Power Architecture core with Variable Length Encoding (VLE) for reduced code footprint and includes two independent 64 KB local data RAM blocks (one per core), plus 384 KB general-purpose SRAM with ECC protection. Its crossbar switch enables concurrent bus master access to peripherals, Flash, and RAM with end-to-end ECC integrity.

It integrates eight MCAN interfaces compliant with ISO CAN-FD, one IEEE 802.3-2008 10/100 Mbps Ethernet MAC with IEEE 1588 time stamping and AVB support, and a dual-channel FlexRay controller - all managed under a unified safety concept featuring Fault Collection and Control Unit (FCCU), Memory Error Management Unit (MEMU), and dual CRC engines.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Architecture	Dual e200z420n3 32-bit Power Architecture CPUs with VLE instruction set and dual-issue capability
Max Core Frequency	180 MHz - enables deterministic real-time task scheduling in ASIL-B automotive control loops
Flash Memory	4224 KB total: 4096 KB code flash + 128 KB data flash with Read-While-Write and EEPROM emulation support
HSM Flash	176 KB dedicated HSM memory (144 KB code + 32 KB data) for secure cryptographic key storage and trusted boot
SRAM	384 KB general-purpose SRAM + 128 KB core-local RAM (64 KB per CPU), all with ECC protection
Safety Certification	AEC-Q100 Grade 1 qualified and ASIL-B compliant per ISO 26262 with FCCU, MEMU, and dual CRC units
Communication Interfaces	8× MCAN (ISO CAN-FD), 18× LINFlexD, 8× DSPI, 1× 10/100 Mbps Ethernet (IEEE 1588, AVB, VLAN), 2× FlexRay channels
ADC System	3× fast 12-bit SAR ADCs, 1× supervisor 12-bit SAR ADC, 1× 10-bit SAR ADC with STDBY mode for low-power sensing

Pinout & Package

eTQFP100 package (14 mm × 14 mm × 1.0 mm, 100-pin lead-free quad flat pack with exposed thermal pad).

Pin/Terminal	Circuit Role	Design Meaning
VDD_HV_IO_MAIN	Main I/O supply rail	Provides 5 V or 3.3 V power to GPIO, LINFlexD, DSPI, and MCAN I/O buffers; supports mixed-voltage operation
VDD_LV	Core logic supply	1.2 V nominal supply for CPU, cache, and internal logic; tightly regulated for stable 180 MHz operation
PORST	Power-on reset input	Active-low asynchronous reset with internal pull-up; initiates full device initialization sequence on assertion
CLKIN_40M	Main crystal oscillator input	Accepts 40 MHz external crystal for primary PLL reference; enables precise clock domain generation for peripherals and computation
ETH_RXD[0:3]	Ethernet receive data lines	LVCMOS inputs supporting IEEE 802.3 MII interface; synchronized to ETH_REF_CLK for AVB time-critical packet capture
MCAN_TX[0:7]	MCAN transmit outputs	Open-drain outputs with integrated current drivers for ISO CAN-FD physical layer compliance up to 5 Mbps
SIUL2_PDI[0:63]	General-purpose I/O bank	Configurable digital I/O pins supporting eMIOS timer channels, BCTU triggers, and interrupt generation with glitch filtering

Key Features

Feature	Design Value
Dual-core lock-step readiness	Supports delayed lock-step execution with redundancy checkers for ASIL-B fault detection without external monitoring hardware
On-chip HSM with dedicated flash	176 KB isolated flash and co-processor enable secure boot, key management, and cryptographic acceleration (AES, SHA, RSA)
End-to-end ECC across XBAR	Crossbar switch enforces ECC on all interconnect transactions between CPU, DMA, Flash, and SRAM - preventing silent data corruption
BCTU-triggered ADC synchronization	Body Cross Triggering Unit allows eMIOS PWM edges or PIT timers to precisely initiate ADC conversions - eliminating software jitter in motor control sampling
Smart Standby with RTC	Ultra-low-power standby mode retains SRAM content and RTC operation while consuming <10 µA - enabling wake-on-contact or periodic sensor polling

Applications

Engine Control Unit (ECU)

Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection pulse width calculation, and knock detection in gasoline/diesel ICE platforms.

IC Role / Device Role / Timing Role: Primary application MCU executing AUTOSAR-compliant BSW and ASW layers with dual-core deterministic task partitioning and ASIL-B safety supervision.

Use Value: 180 MHz dual-core throughput ensures sub-100 µs control loop closure; integrated MCAN and LINFlexD reduce external transceiver count by 40% versus legacy SPC564Cx designs.

Use Scenario: Torque assist calculation, motor phase commutation, and steering angle feedback processing in 12 V EPS systems.

IC Role / Device Role / Timing Role: Safety-critical motion controller managing torque demand arbitration, motor current regulation, and fail-safe torque reduction per ISO 26262 ASIL-C decomposition.

Use Value: BCTU-synchronized ADC sampling eliminates phase error in motor current measurement; eMIOS-generated PWM with shifted edges reduces EMI by >15 dB in 20–100 kHz band.

Battery Management System (BMS)

Advanced Driver Assistance Systems (ADAS) Domain Controller

Use Scenario: Cell voltage monitoring, temperature acquisition, state-of-charge estimation, and contactor control in 48 V mild-hybrid and EV traction battery packs.

IC Role / Device Role / Timing Role: High-integrity data acquisition and safety gateway interfacing with analog front-ends, isolation barriers, and CAN FD backbone.

Use Value: Three independent 12-bit SAR ADCs enable simultaneous cell voltage sampling at 1 MSps aggregate rate; HSM secures firmware updates against tampering during OTA deployment.

Use Scenario: Sensor fusion preprocessing, radar/LiDAR data aggregation, and vehicle-to-vehicle (V2V) communication coordination in centralized ADAS architectures.

IC Role / Device Role / Timing Role: Time-synchronized peripheral manager coordinating Ethernet AVB streams, CAN-FD sensor data, and FlexRay actuator commands with sub-microsecond jitter.

Use Value: IEEE 1588 timestamping accuracy <±50 ns enables precise sensor alignment; dual FlexRay channels support redundant communication for steer-by-wire fail-operational requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive MCU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP S32K344	ARM Cortex-M7 dual-core @ 320 MHz; 4 MB flash; no integrated Ethernet MAC; uses ARM TrustZone instead of HSM	Lacks native 10/100 Mbps Ethernet with AVB/TSN; relies on external PHY and software-based time sync	Select when ARM ecosystem toolchain compatibility and higher single-thread compute throughput are prioritized over native Ethernet AVB and Power Architecture deterministic latency
Renesas RH850/U2A	32-bit RXv3 core @ 400 MHz; 6 MB flash; 10/100 Ethernet with IEEE 1588; ASIL-D capable but larger die size and higher cost	Higher safety grade (ASIL-D) and larger memory footprint increase BOM cost by ~28% vs. SPC584C70E3FMC0X	Select only when ASIL-D decomposition is mandatory and Ethernet AVB + CAN-FD coexistence must be implemented on a single die without external bridging

Compared with NXP S32K344 and Renesas RH850/U2A, the SPC584C70E3FMC0X uniquely balances ASIL-B compliance, native Ethernet AVB with hardware timestamping, and Power Architecture real-time determinism - making it optimal for cost-sensitive, high-integration automotive ECUs where CAN-FD/Ethernet convergence is required without sacrificing safety certification rigor.

Availability

SPC584C70E3FMC0X is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and battery management systems requiring stable component supply, long-term automotive lifecycle support, and traceable sourcing through STMicroelectronics' authorized channel.

Supply support for SPC584C70E3FMC0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering automotive-grade microcontrollers, power management ICs, and sensors to Tier-1 suppliers and OEMs worldwide.

The SPC58 C Line targets next-generation automotive electronic control units with emphasis on ASIL-B functional safety, multi-protocol connectivity (CAN-FD/Ethernet/FlexRay), and secure firmware execution - directly addressing electrification and ADAS domain controller requirements.

FAQ

What is the maximum junction temperature rating for SPC584C70E3FMC0X?

The SPC584C70E3FMC0X is rated for junction temperatures from –40 °C to +150 °C, validated per AEC-Q100 Grade 1 requirements. This range supports under-hood deployment in engine control modules and transmission control units without derating, provided PCB thermal design meets ST's recommended copper pour and via guidelines for the eTQFP100 package.

Does SPC584C70E3FMC0X support AUTOSAR 4.x compliant OS and BSW?

Yes - ST provides certified AUTOSAR 4.3 and 4.4 Basic Software (BSW) modules including ECU State Manager, Communication Stack (CAN-FD, LIN, Ethernet AVB), Memory Services, and Crypto Stack, all validated on SPC584C70E3FMC0X hardware with its dual-core e200z4 architecture and HSM.

How is the Hardware Security Module (HSM) accessed and programmed?

The HSM is accessed exclusively via secure mailbox registers mapped in the main CPU address space; firmware executes in the HSM's isolated 144 KB code flash using ST's SPC5-HSM SDK. Cryptographic keys are provisioned during manufacturing using JTAG-bound secure boot and cannot be read out post-configuration due to fuse-based write-protection.

Can SPC584C70E3FMC0X operate in a CAN-FD network alongside legacy CAN 2.0 nodes?

Yes - its eight MCAN controllers support automatic protocol arbitration and bit-rate switching, allowing seamless integration into hybrid networks. The MCAN IP handles CAN-FD frame formatting, CRC calculation, and arbitration field extension transparently, enabling backward compatibility without software intervention or external protocol translators.

SPC584C70E3FMC0X Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Package/Case:: 100-TQFP Exposed Pad

Series:: SPC58

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Core Processor:: e200z420

Core Size:: 32-Bit Single-Core

Speed:: 180MHz

Connectivity:: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART

Peripherals:: DMA

Number of I/O:: 80

Program Memory Size:: 2MB (2M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 64K x 8

RAM Size:: 128K x 8

Voltage - Supply (Vcc/Vdd):: 3.3V, 5V

Data Converters:: A/D - 10b SAR, 12b SAR

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:

SPC584C70E3FMC0X FAQ

1.How can I place an order for SPC584C70E3FMC0X through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC584C70E3FMC0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC584C70E3FMC0X reliable?

The price and inventory of SPC584C70E3FMC0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC584C70E3FMC0X is usually 5 days.

3.What payment methods are accepted for SPC584C70E3FMC0X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC584C70E3FMC0X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC584C70E3FMC0X?

SPC584C70E3FMC0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC584C70E3FMC0X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC584C70E3FMC0X?

For technical support, including SPC584C70E3FMC0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC584C70E3FMC0X requirements.

6.How does Aetrix verify that SPC584C70E3FMC0X is sourced from the original manufacturer or authorized distributors?

All SPC584C70E3FMC0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC584C70E3FMC0X meets industry standards.

7.What is the process for return or replacement of SPC584C70E3FMC0X?

All SPC584C70E3FMC0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC584C70E3FMC0X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC584C70E3FMC0X part is unused and in its original packaging.

Return procedure for SPC584C70E3FMC0X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…