STMicroelectronics SPC584C70E7QMC0X
- Part No.:
- SPC584C70E7QMC0X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
SPC584C70E7QMC0X.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176ELQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,455
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC584C70E7QMC0X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller featuring dual e200z420n3 cores at 180 MHz, 4 MB on-chip flash (4096 KB code + 128 KB data), Hardware Security Module (HSM), and ASIL-B functional safety compliance per ISO 26262. It integrates 384 KB general-purpose SRAM, 64-channel eDMA, dual PLLs, and 8 MCAN interfaces with ISO CAN-FD support - deployed in engine control units for real-time combustion timing and fault-tolerant actuator management.
For engineers reviewing the SPC584C70E7QMC0X datasheet, SPC584C70E7QMC0X pinout, SPC584C70E7QMC0X application, or SPC584C70E7QMC0X equivalent, key selection considerations include dual-core lock-step capability, HSM cryptographic acceleration, crossbar-switched memory arbitration with end-to-end ECC, and integrated FlexRay/Ethernet/STDBY-mode ADC for domain controller consolidation in ASIL-B powertrain systems.
Technical Context
The SPC584C70E7QMC0X implements a dual-issue Power Architecture e200z420n3 core pair with Variable Length Encoding (VLE), 8 KB I-Cache and 4 KB D-Cache per core, and 64 KB local data RAM per CPU. Its crossbar switch enables concurrent access to Flash, SRAM, and peripherals with end-to-end ECC protection across all master–slave paths.
Safety architecture includes FCCU for failure notification handling, MEMU for memory error collection, CRC units for data integrity, and delayed lock-step with redundancy checkers. The HSM contains dedicated 176 KB flash (144 KB code + 32 KB data) and executes secure boot, key management, and AES-128 acceleration independently of main cores.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z420n3 32-bit Power Architecture CPUs with VLE, 180 MHz max frequency - enables deterministic real-time execution and reduced code footprint in safety-critical firmware. |
| Memory | 4224 KB on-chip flash (4096 KB code + 128 KB data) supporting Read-While-Write and EEPROM emulation - allows live firmware updates without halting control loops. |
| Safety Certification | ASIL-B compliant per ISO 26262 with FCCU, MEMU, CRC units, and lock-step core monitoring - meets requirements for engine management and transmission control subsystems. |
| Communication Interfaces | 8 MCAN modules (ISO CAN-FD), 18 LINFlexD, 8 DSPI, dual-channel FlexRay, and IEEE 802.3-2008 10/100 Mbps Ethernet with IEEE 1588 timestamping - supports multi-bus vehicle networking and time-synchronized diagnostics. |
| Analog Subsystem | 3× fast 12-bit SAR ADCs, 1 supervisor 12-bit SAR ADC, and 1 STDBY-mode 10-bit SAR ADC - enables simultaneous high-resolution sensor acquisition (e.g., crankshaft position, throttle, O2) with low-power wake-up capability. |
| Package & Thermal | eLQFP176 (24 × 24 × 1.4 mm), –40 °C to +150 °C junction temperature range - validated for under-hood deployment in gasoline/diesel powertrain ECUs. |
| Power Management | Smart Standby mode with RTC, ultra-low-power contact monitoring via Wake-up Unit, and fast wakeup schemes - reduces quiescent current to <50 µA while maintaining real-time clock and interrupt responsiveness. |
Pinout & Package
eLQFP176 package (24 mm × 24 mm × 1.4 mm body, 0.5 mm pitch, exposed thermal pad). Pinout defined per STMicroelectronics IO_Definition document for SPC584Cx series; full signal mapping includes 128 I/O pins grouped into SIUL2 banks, with dedicated power domains (VDD_LV, VDD_HV_IO_MAIN/FLEX/OSC/FLA), analog reference (VREFH/VREFL), and differential clock inputs (XOSC_P/N, RTCOSC_P/N).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_LV | Core supply voltage | 1.2 V ± 3% regulated input for CPU, cache, and logic - requires low-noise LDO with ≤10 mV ripple to maintain 180 MHz stability. |
| VDD_HV_IO_MAIN | Main I/O supply | 3.3 V or 5 V tolerant I/O rail supporting LINFlexD, DSPI, and GPIO - enables direct interface to legacy sensors and actuators without level shifters. |
| RTCOSC_P / RTCOSC_N | 32 kHz crystal oscillator inputs | Differential inputs for external 32.768 kHz crystal - provides autonomous RTC operation during Smart Standby with <1 ppm accuracy over temperature. |
| XOSC_P / XOSC_N | Main system oscillator inputs | Differential 40 MHz crystal interface - feeds PLL0 for core/peripheral clock generation; supports failover to internal RC oscillator on loss of crystal. |
| MCAN0_TX / MCAN0_RX | Channel 0 CAN-FD transceiver interface | Dedicated differential pins for ISO 11898-1 CAN-FD physical layer - supports bit rates up to 5 Mbps with built-in bus guardian and loopback self-test. |
| ETH_MDIO / ETH_MDC | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC pins for PHY register configuration - enables dynamic PHY parameter tuning (e.g., auto-negotiation, energy detection) without firmware reset. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lock-step with redundancy checkers | Enables real-time fault detection and safe shutdown within ≤10 µs upon core divergence - required for ASIL-B torque control and fuel injection sequencing. |
| HSM with 176 KB dedicated flash | Isolates cryptographic operations (AES-128, SHA-256, secure boot) from main firmware execution - prevents side-channel attacks and ensures OTA update authenticity. |
| Crossbar switch with end-to-end ECC | Guarantees data integrity across all memory and peripheral accesses (Flash/SRAM/ADC/ETH) - eliminates silent corruption in safety-critical data paths like pedal position or knock sensor readings. |
| BCTU-triggered ADC synchronization | Allows precise alignment of ADC sampling to PWM edges (e.g., inverter phase current capture) via eMIOS channel triggers - achieves <50 ns jitter for motor control FOC algorithms. |
| Smart Standby with Wake-up Unit | Monitors up to 32 digital inputs (e.g., ignition switch, door latch) in <10 µA mode - enables immediate transition to active state without polling overhead or missed events. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time spark timing, fuel injection pulse width, and knock detection in gasoline engines. IC Role / Device Role / Timing Role: Primary compute engine executing AUTOSAR-compliant BSW and ASW layers with deterministic 100 µs task scheduling. Use Value: Dual-core lock-step and MEMU ensure correct combustion event sequencing even under EMI stress; 8 MCAN channels enable seamless integration with cam/crank sensors, MAP, and O2 modules. |
Use Scenario: Clutch pressure modulation, gear shift logic, and torque converter lock-up control in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Safety-certified domain controller managing hydraulic solenoid drivers and CAN-FD communication with engine ECU and chassis modules. Use Value: ASIL-B compliance and FCCU-driven fault containment prevent unsafe gear engagement; FlexRay interface synchronizes shift timing with brake-by-wire systems. |
| Electric Power Steering (EPS) | Vehicle Domain Controller |
|
Use Scenario: Motor current sensing, assist torque calculation, and fault response in column-assist EPS systems. IC Role / Device Role / Timing Role: Real-time control unit running FOC algorithms with sub-microsecond ADC sampling triggered by eMIOS PWM outputs. Use Value: STDBY-mode 10-bit ADC and BCTU allow continuous low-power steering angle monitoring; 3× 12-bit SAR ADCs concurrently sample phase currents at 1 MSps. |
Use Scenario: Centralized gateway and coordination node for zonal architecture, aggregating CAN-FD, Ethernet AVB, and FlexRay traffic. IC Role / Device Role / Timing Role: High-throughput network bridge with IEEE 1588 timestamping, VLAN filtering, and secure OTA update handling via HSM. Use Value: Dual Ethernet MAC with AVB support enables time-synchronized camera/radar streaming; 18 LINFlexD ports manage legacy body electronics without additional transceivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | ARM Cortex-M7 dual-core (up to 320 MHz), 4 MB flash, ASIL-D capable, no integrated FlexRay or Ethernet MAC | Targets higher-ASIL ADAS domain controllers; lacks native FlexRay/Ethernet needed for powertrain gateways | Select when ASIL-D certification or ARM ecosystem compatibility outweighs need for FlexRay/Ethernet integration. |
| Renesas RH850/U2A | 32-bit RXv3 core (200 MHz), 4 MB flash, ASIL-B, integrated CAN FD and LIN but no Ethernet or FlexRay | Focused on body control and chassis applications; lacks Ethernet AVB and FlexRay for high-bandwidth domain coordination | Prefer for cost-sensitive body ECUs where Ethernet/FlexRay are unnecessary and Renesas toolchain familiarity exists. |
Compared with SPC584C70E7QMC0X, the S32K344 offers higher core performance and ASIL-D readiness but requires external PHYs for Ethernet and lacks FlexRay - increasing BOM count and layout complexity in powertrain gateways. The RH850/U2A provides strong CAN/LIN integration but cannot replace SPC584C70E7QMC0X in applications requiring time-synchronized multi-bus convergence (e.g., central vehicle server with AVB audio/video transport).
Availability
SPC584C70E7QMC0X is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and vehicle domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for SPC584C70E7QMC0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing and AEC-Q100 qualification infrastructure.
The SPC58 C Line targets next-generation automotive powertrain and chassis control, delivering enhanced MIPS/mW efficiency, integrated safety mechanisms, and multi-protocol connectivity to consolidate domain ECU functionality onto single-chip solutions.
FAQ
What is the maximum junction temperature rating for SPC584C70E7QMC0X?
The device is rated for continuous operation from –40 °C to +150 °C junction temperature, validated per AEC-Q100 Grade 0 requirements. This rating applies to all operating modes including full-speed dual-core execution, Ethernet packet processing, and HSM cryptographic operations - confirmed by thermal characterization across process corners and voltage extremes.
Does SPC584C70E7QMC0X support secure boot from external flash?
No. Secure boot is implemented exclusively from internal Boot Assist Flash (BAF) and main on-chip flash. The BAF supports factory programming via serial bootload over asynchronous CAN or LIN/UART, and enforces cryptographic signature verification using HSM-resident keys before transferring control to user firmware.
How many independent clock domains does the dual PLL system support?
The device implements two fully independent PLLs: PLL0 generates the stable clock domain for peripherals (eMIOS, ADC, DSPI), while PLL1 provides the FM-modulated computational shell clock for CPU cores. Each PLL accepts separate reference inputs (XOSC or RC) and supports dynamic reconfiguration without system reset.
Can the 10-bit STDBY-mode ADC operate during Smart Standby?
Yes. The 10-bit SAR ADC with STDBY mode support remains fully functional during Smart Standby, drawing <15 µA while sampling up to 8 channels at 10 kSps. Its dedicated reference and conversion trigger path (via WKPU or BCTU) enable battery-voltage monitoring and ignition detection without waking the main cores.
SPC584C70E7QMC0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- SPC58
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z420
- Core Size:
- 32-Bit Single-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA
- Number of I/O:
- 64
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.3V, 5V
- Data Converters:
- A/D - 10b SAR, 12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC584C70E7QMC0X FAQ
1.How can I place an order for SPC584C70E7QMC0X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC584C70E7QMC0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC584C70E7QMC0X reliable?
The price and inventory of SPC584C70E7QMC0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC584C70E7QMC0X is usually 5 days.
3.What payment methods are accepted for SPC584C70E7QMC0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC584C70E7QMC0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC584C70E7QMC0X?
SPC584C70E7QMC0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC584C70E7QMC0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC584C70E7QMC0X?
For technical support, including SPC584C70E7QMC0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC584C70E7QMC0X requirements.
6.How does Aetrix verify that SPC584C70E7QMC0X is sourced from the original manufacturer or authorized distributors?
All SPC584C70E7QMC0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC584C70E7QMC0X meets industry standards.
7.What is the process for return or replacement of SPC584C70E7QMC0X?
All SPC584C70E7QMC0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC584C70E7QMC0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC584C70E7QMC0X part is unused and in its original packaging.
Return procedure for SPC584C70E7QMC0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC584C70E7QMC0X Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

