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STMicroelectronics SPC58EC74C3FMC1X
- Part No.:
- SPC58EC74C3FMC1X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 292-FBGA
- Datasheet:
-
SPC58EC74C3FMC1X.pdf
- Description:
- Linear IC's
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SPC58EC74C3FMC1X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller with dual e200z420n3 cores running at up to 180 MHz, 4 MB on-chip flash (4096 KB code + 128 KB data), 384 KB general-purpose SRAM, and integrated Hardware Security Module (HSM) supporting ASIL-B compliance per ISO 26262 for powertrain and chassis control applications.
For engineers reviewing the SPC58EC74C3FMC1X datasheet, SPC58EC74C3FMC1X pinout, SPC58EC74C3FMC1X application, or SPC58EC74C3FMC1X equivalent, this MCU delivers deterministic real-time execution, dual-lockstep-capable safety architecture, CAN-FD and Ethernet AVB connectivity, and production-ready HSM firmware support - critical for ECU designs requiring functional safety certification and secure boot.
Technical Context
The SPC58EC74C3FMC1X implements a dual-core delayed lock-step (DLS) architecture with redundancy checkers for ASIL-B fault detection, supported by FCCU, MEMU, and dual CRC units. Its crossbar switch enables concurrent ECC-protected access to Flash, SRAM, and peripherals by multiple bus masters including eDMA, CPU, and HSM.
It integrates eight MCAN interfaces compliant with ISO CAN-FD, one IEEE 802.3-2008 10/100 Mbps Ethernet MAC with IEEE 1588 timestamping and AVB/VLAN support, and three independent 12-bit SAR ADCs with BCTU-triggered synchronization - enabling precise sensor acquisition in time-critical automotive subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z420n3 Power Architecture CPUs with VLE, 180 MHz max frequency - enables high MIPS/mW efficiency and compact code footprint for complex AUTOSAR-based ECUs. |
| Flash Memory | 4224 KB total: 4096 KB code flash + 128 KB data flash - supports RWW (read-while-write), EEPROM emulation across multiple blocks, and secure boot via Boot Assist Flash (BAF). |
| HSM Flash | 176 KB dedicated HSM memory (144 KB code + 32 KB data) - isolates cryptographic operations and key storage from main application domain for ASIL-B-compliant secure boot and OTA updates. |
| SRAM | 384 KB general-purpose SRAM + 128 KB core-local RAM (64 KB per CPU) - provides low-latency data buffering for real-time control loops and safety monitor stacks. |
| Safety Features | FCCU, MEMU, dual CRC units, DLS with redundancy checkers, and end-to-end ECC on XBAR - collectively satisfy ASIL-B requirements per ISO 26262 Part 5 without external safety monitors. |
| Connectivity | 8× MCAN (ISO CAN-FD), 18× LINFlexD, 8× DSPI, dual-channel FlexRay, 1× 10/100 Mbps Ethernet with AVB/VLAN/IEEE 1588 - enables multi-bus vehicle networking with deterministic timing and time-synchronized diagnostics. |
| ADC System | 3× fast 12-bit SAR ADCs + 1× supervisor 12-bit SAR + 1× 10-bit SAR with STDBY mode - supports simultaneous high-resolution analog sensing for engine management, battery monitoring, and actuator feedback. |
Pinout & Package
SPC58EC74C3FMC1X uses the FPBGA292 package (17 mm × 17 mm × 1.8 mm, 0.8 mm pitch), optimized for automotive thermal and EMI performance with dedicated power/ground ball arrays and I/O banks segregated by voltage domain (1.2 V core, 3.3 V/5 V I/O, 32 kHz/40 MHz oscillator inputs).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_IO_MAIN | Main I/O supply | Provides 3.3 V or 5 V to all general-purpose I/O banks - supports mixed-voltage interfacing with sensors, transceivers, and legacy ECUs. |
| VDD_LV | Core supply | 1.2 V regulated input for CPU, cache, and internal logic - requires low-noise LDO or DC-DC with tight regulation (< ±3%) for stable 180 MHz operation. |
| OSC_IN / OSC_OUT | 40 MHz crystal interface | Differential CMOS oscillator input/output pair - drives primary system clock with ±50 ppm stability; supports external crystal or LVDS clock source. |
| RTC_XIN / RTC_XOUT | 32 kHz crystal interface | Low-power oscillator pins for real-time clock and ultra-low-power standby wake-up - enables <10 µA RTC retention current during STOP mode. |
| ETH_MDIO / ETH_MDC | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC signals for PHY configuration and status polling - essential for AVB stream setup and VLAN registration. |
| MCAN0_TX / MCAN0_RX | CAN-FD channel 0 differential pair | High-speed CAN physical layer interface supporting up to 5 Mbps FD data phase - connects directly to ISO 11898-2 transceiver without level-shifting. |
| HSM_VDD / HSM_VSS | HSM power domain | Isolated 1.2 V supply and ground for Hardware Security Module - prevents fault injection into cryptographic operations via power rail coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core DLS with redundancy checkers | Enables real-time comparison of instruction execution between cores, detecting transient faults with sub-cycle latency - required for ASIL-B diagnostic coverage. |
| HSM with dedicated 176 KB flash | Provides tamper-resistant environment for AES-128/256, SHA-256, RSA-2048, and secure key storage - eliminates need for external secure element in Tier-1 ECU designs. |
| End-to-end ECC on XBAR interconnect | Protects all data transfers between CPU, DMA, Flash, and peripherals against single-bit errors and detects double-bit errors - ensures data integrity across full memory map. |
| BCTU-triggered ADC synchronization | Allows precise alignment of ADC sampling to PWM edges or timer events - reduces jitter in motor control current sensing and improves FOC accuracy. |
| Smart Wake-up Unit (SWU) | Monitors up to 32 digital inputs in ultra-low-power standby mode with configurable edge detection and debounce - enables contact-based wake-up for door modules and seat occupancy sensors. |
Applications
| Powertrain Control Unit | Advanced Driver Assistance System |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary application controller executing AUTOSAR OS, managing CAN-FD communication with sensors/actuators, and performing safety-critical closed-loop control at ≤100 µs cycle times. Use Value: Dual-core DLS and ASIL-B certified safety mechanisms ensure fail-operational behavior during transient faults, while 4 MB flash accommodates complex calibration maps and diagnostic routines. | Use Scenario: Sensor fusion and decision-making for adaptive cruise control (ACC), automatic emergency braking (AEB), and lane-keeping assist (LKA). IC Role / Device Role / Timing Role: Central processing node aggregating radar, camera, and ultrasonic data via CAN-FD/Ethernet, running perception algorithms, and issuing actuator commands with <5 ms end-to-end latency. Use Value: IEEE 1588 timestamping and AVB support enable synchronized multi-sensor data capture; HSM secures OTA update authentication and sensor data privacy. |
| Electric Vehicle Battery Management | Chassis Domain Controller |
Use Scenario: Cell voltage/temperature monitoring, state-of-charge estimation, and contactor control in high-voltage traction battery packs. IC Role / Device Role / Timing Role: Safety-certified master controller interfacing with isolated ADCs and galvanically separated CAN networks, executing ISO 26262-compliant BMS software stack. Use Value: Three independent 12-bit SAR ADCs with BCTU triggering allow simultaneous sampling of 48+ cell voltages; MEMU and CRC units detect memory corruption in SOC calculation tables. | Use Scenario: Integrated control of steering, braking, and suspension systems via centralized domain architecture. IC Role / Device Role / Timing Role: High-integrity gateway and executor handling torque vectoring, brake-by-wire arbitration, and cross-domain CAN/Ethernet bridging with deterministic scheduling. Use Value: Dual FlexRay channels provide redundant high-speed deterministic bus for steer-by-wire; Ethernet AVB enables time-synchronized actuator command distribution across chassis nodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | ARM Cortex-M7 dual-core, 320 MHz, 8 MB flash, ASIL-D capable, no integrated Ethernet MAC | Targets higher ASIL-D domains (e.g., steer-by-wire); lacks native 10/100 Mbps Ethernet with AVB | Select when ASIL-D certification is mandatory and Ethernet is handled externally or via PCIe bridge. |
| Renesas RH850/U2A | 32-bit RXv3 core, 400 MHz, 4 MB flash, ASIL-B, 1x CAN-FD, no Ethernet or HSM | Focused on cost-sensitive powertrain applications; limited networking and security features | Select for legacy-compatible ECU upgrades where CAN-FD suffices and HSM is not required. |
Compared with NXP S32K344 and Renesas RH850/U2A, the SPC58EC74C3FMC1X uniquely combines ASIL-B safety, integrated Ethernet AVB, and production-ready HSM in a single die - reducing BOM count and board area for next-generation zonal architectures requiring secure, time-synchronized vehicle networking.
Availability
SPC58EC74C3FMC1X is available at Aetrix Electronics and suitable for powertrain control units, ADAS domain controllers, EV battery management systems, and chassis domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for SPC58EC74C3FMC1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering automotive-grade microcontrollers, power management ICs, and sensors to Tier-1 suppliers and OEMs worldwide.
The SPC58 C Line targets automotive functional safety applications, specifically engineered to meet ASIL-B requirements for powertrain, chassis, and body electronics - with emphasis on integrated security, deterministic real-time performance, and scalable memory architecture.
FAQ
What is the maximum junction temperature rating for SPC58EC74C3FMC1X?
The SPC58EC74C3FMC1X is rated for a junction temperature range of –40 °C to +150 °C, validated per AEC-Q100 Grade 0 qualification. This allows deployment in under-hood environments such as engine control modules and transmission control units without derating at full 180 MHz operation.
Does SPC58EC74C3FMC1X support secure boot with cryptographic verification?
Yes - the integrated Hardware Security Module (HSM) executes secure boot using SHA-256 hash verification and AES-128 decryption of signed firmware images stored in Boot Assist Flash (BAF). The HSM enforces strict key hierarchy and prevents unauthorized code execution before main application startup.
How many CAN-FD interfaces does SPC58EC74C3FMC1X provide, and what is their data rate capability?
The device integrates eight MCAN modules, each compliant with ISO 11898-1:2015 CAN-FD specification. All support arbitration bit rates up to 1 Mbps and FD data phase bit rates up to 5 Mbps, with shared memory architecture enabling efficient message filtering and transmission scheduling across multiple CAN domains.
Is the Ethernet controller on SPC58EC74C3FMC1X compatible with Time-Sensitive Networking (TSN) standards?
No - the integrated Ethernet MAC complies with IEEE 802.3-2008 (10/100 Mbps), IEEE 1588-2008 (timestamping), IEEE 802.1AS (gPTP), and IEEE 802.1Qav (AVB), but does not implement full TSN features such as IEEE 802.1Qbv (time-aware shaper) or 802.1Qbu (frame preemption). It supports AVB streaming and time-synchronized diagnostics in zonal gateways.
SPC58EC74C3FMC1X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 292-FBGA
- Series:
- SPC58
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 160MHz
- Connectivity:
- Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, Temp Sensor, WDT
- Number of I/O:
- -
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 10/12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC58EC74C3FMC1X FAQ
1.How can I place an order for SPC58EC74C3FMC1X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC58EC74C3FMC1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC58EC74C3FMC1X reliable?
The price and inventory of SPC58EC74C3FMC1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC58EC74C3FMC1X is usually 5 days.
3.What payment methods are accepted for SPC58EC74C3FMC1X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC58EC74C3FMC1X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC58EC74C3FMC1X?
SPC58EC74C3FMC1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC58EC74C3FMC1X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC58EC74C3FMC1X?
For technical support, including SPC58EC74C3FMC1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC58EC74C3FMC1X requirements.
6.How does Aetrix verify that SPC58EC74C3FMC1X is sourced from the original manufacturer or authorized distributors?
All SPC58EC74C3FMC1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC58EC74C3FMC1X meets industry standards.
7.What is the process for return or replacement of SPC58EC74C3FMC1X?
All SPC58EC74C3FMC1X units undergo pre-shipment inspection (PSI). If there is an issue with SPC58EC74C3FMC1X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC58EC74C3FMC1X part is unused and in its original packaging.
Return procedure for SPC58EC74C3FMC1X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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