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STMicroelectronics SPC58EC80E3QMC1X

Part No.:
SPC58EC80E3QMC1X
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
100-TQFP Exposed Pad
Datasheet:
AetrixSPC58EC80E3QMC1X.pdf
Description:
IC MCU 32BIT 4MB FLASH 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:147

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Product details

Overview

SPC58EC80E3QMC1X from STMicroelectronics is an AEC-Q100 qualified 32-bit Power Architecture automotive microcontroller featuring dual e200z420n3 cores at 180 MHz, 4 MB on-chip flash (4096 KB code + 128 KB data), Hardware Security Module (HSM), and ASIL-B functional safety compliance per ISO 26262. It integrates 384 KB general-purpose SRAM, 64-channel eDMA, 8 MCAN interfaces with ISO CAN-FD support, and dual-channel FlexRay - deployed in engine control units and advanced driver assistance systems (ADAS) domain controllers.

For engineers reviewing the SPC58EC80E3QMC1X datasheet, SPC58EC80E3QMC1X pinout, SPC58EC80E3QMC1X application, or SPC58EC80E3QMC1X equivalent, key selection criteria include dual-core lock-step capability for safety-critical execution, HSM-secured boot and cryptographic acceleration, real-time I/O timing via eMIOS/BCTU synchronization, and IEEE 802.3-2008 Ethernet with AVB/TSN readiness.

Technical Context

The device implements a dual-core delayed lock-step (DLS) architecture with redundancy checkers and dedicated memory error management (MEMU) to meet ASIL-B requirements. Each core includes 8 KB I-Cache and 4 KB D-Cache, VLE instruction encoding, and 64 KB local data RAM, enabling deterministic real-time execution while reducing code footprint.

Its crossbar switch (XBAR) supports concurrent bus master access to Flash, SRAM, and peripherals with end-to-end ECC protection. The clock system features dual PLLs: one for stable peripheral domains and another for FM-modulated computational shell operation, ensuring precise timing isolation between safety-critical and non-safety subsystems.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureDual e200z420n3 Power Architecture CPUs, 32-bit, VLE-enabled, 180 MHz max frequency
Flash Memory4224 KB total: 4096 KB code + 128 KB data flash with RWW and EEPROM emulation support
HSM Flash176 KB dedicated: 144 KB code + 32 KB data for secure firmware and crypto keys
SRAM384 KB general-purpose SRAM + 128 KB core-local RAM (64 KB per CPU)
Safety CertificationAEC-Q100 Grade 1, ISO 26262 ASIL-B compliant with FCCU, MEMU, CRC unit, and DLS
Communication Interfaces8 MCAN (ISO CAN-FD), 18 LINFlexD, 8 DSPI, dual-channel FlexRay, 10/100 Mbps Ethernet with IEEE 1588 TS
Analog Subsystem3× fast 12-bit SAR ADCs, 1 supervisor 12-bit SAR ADC, 1 standby-capable 10-bit SAR ADC
PackageeTQFP100 (14 × 14 × 1.0 mm), 100-pin thermally enhanced quad flat pack

Pinout & Package

eTQFP100 package: 100-pin, 0.5 mm pitch, exposed thermal pad, RoHS-compliant, JEDEC MO-220 standard. Thermal resistance θJA = 32 °C/W (JEDEC Std 51-7, 4-layer board).

Pin/TerminalCircuit RoleDesign Meaning
VDD_HV_IO_MAINMain I/O supplyProvides 5 V or 3.3 V power to all high-voltage I/O banks; enables mixed-voltage interface operation
VDD_LVCore supply1.2 V nominal core voltage; regulated internally from main supply; critical for CPU and cache stability
PORSTPower-on reset inputActive-low asynchronous reset; initiates full device initialization sequence including Flash controller and HSM
CLKIN_40MPrimary crystal oscillator inputAccepts 40 MHz external crystal; feeds PLL0 for high-precision peripheral clock generation
CLKIN_32KRTC oscillator inputAccepts 32.768 kHz crystal; enables ultra-low-power RTC operation during STOP/STANDBY modes
MCAN0_TX / MCAN0_RXCAN FD physical layer interfaceDifferential pair supporting ISO 11898-1 CAN FD up to 5 Mbps; integrated termination and slew rate control
ETH_MDIO / ETH_MDCIEEE 802.3 management interfaceSerial interface for PHY register configuration and status monitoring; essential for Ethernet link negotiation
NEXUS_TDI / NEXUS_TDONexus Class 3+ debug interfaceIEEE-ISTO 5001-2003 compliant trace and debug signals; supports real-time instruction trace and hardware breakpoints

Key Features

FeatureDesign Value
Dual-core delayed lock-step (DLS)Runtime hardware comparison of core outputs with automatic fault detection and fail-safe response per ASIL-B
Hardware Security Module (HSM)Isolated secure co-processor with AES-128/256, SHA-256, RSA-2048, and secure boot ROM enforcing chain-of-trust
eMIOS + BCTU synchronization64-channel modular timer subsystem triggering ADC conversions from any eMIOS output or PIT_RTI, enabling deterministic sensor sampling
End-to-end ECC crossbar (XBAR)Automatic ECC generation/checking on all XBAR transactions between CPU, DMA, Flash, and peripherals - prevents silent data corruption
Smart Standby with Wake-up UnitSub-10 µA current draw in STANDBY mode with configurable analog/digital pin wake sources and RTC alarm
IEEE 802.1AS AVB time synchronizationHardware timestamping and gPTP stack acceleration for deterministic Ethernet audio/video streaming in vehicle networks

Applications

Engine Control Unit (ECU)Advanced Driver Assistance Systems (ADAS)

Use Scenario: Real-time combustion timing, fuel injection, and exhaust gas recirculation control in gasoline and diesel powertrains.

IC Role / Device Role / Timing Role: Primary safety-certified MCU executing AUTOSAR-compliant engine management software with dual-core lock-step verification.

Use Value: ASIL-B compliance ensures fault detection within <100 µs; 180 MHz dual-core throughput meets tight 10 ms control loop deadlines.

Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for lane-keeping and automatic emergency braking.

IC Role / Device Role / Timing Role: Central domain controller managing time-synchronized data ingestion via MCAN FD and Ethernet AVB.

Use Value: 8 MCAN FD interfaces enable 5 Mbps sensor data aggregation; IEEE 1588 hardware timestamping aligns multi-sensor timestamps to ±50 ns.

Electric Vehicle Battery Management System (BMS)Vehicle Gateway / Domain Controller

Use Scenario: High-accuracy cell voltage, temperature, and insulation monitoring across 100+ battery cells in traction packs.

IC Role / Device Role / Timing Role: Safety-critical monitor MCU interfacing with isolated ADCs and communicating via CAN FD to master BMS controller.

Use Value: 3 independent 12-bit SAR ADCs sample 32 channels simultaneously; HSM secures over-the-air firmware updates against tampering.

Use Scenario: Secure communication bridge between infotainment, ADAS, and powertrain domains using firewall-aware routing.

IC Role / Device Role / Timing Role: Firewall-enabled gateway MCU performing protocol translation, message filtering, and intrusion detection.

Use Value: Dual-channel FlexRay handles legacy chassis comms; 10/100 Ethernet with VLAN tagging isolates safety-critical traffic from best-effort streams.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K344ARM Cortex-M7 dual-core, 200 MHz, 4 MB flash, ASIL-D capable, no integrated FlexRayTargets higher-ASIL domains (e.g., brake-by-wire); lacks native FlexRay but adds PCIe and more CAN FD channelsSelect when ASIL-D certification or ARM ecosystem compatibility is required; avoid if FlexRay legacy integration is mandatory
Renesas RH850/U2A32-bit RXv3 core, 400 MHz single-core (dual-core variant available), 8 MB flash, ASIL-B, no HSMFocused on high-speed motor control; stronger PWM and encoder interface; weaker crypto accelerationSelect for high-frequency motor control where 400 MHz deterministic execution outweighs security needs; not suitable for secure OTA update workflows

Compared with SPC58EC80E3QMC1X, the S32K344 offers higher ASIL coverage and ARM toolchain alignment but requires external FlexRay transceivers, while the RH850/U2A delivers superior motor control timing precision but lacks hardware-based cryptographic acceleration and secure boot enforcement.

Availability

SPC58EC80E3QMC1X is available at Aetrix Electronics and suitable for engine control units, ADAS domain controllers, electric vehicle battery management systems, and vehicle gateways requiring stable component supply across automotive production lifecycles.

Supply support for SPC58EC80E3QMC1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade silicon for industrial and transportation markets.

The SPC58 C Line targets next-generation automotive ECU platforms demanding ASIL-B safety, hardware security, and heterogeneous connectivity - specifically engineered for domain-centralized architectures replacing legacy distributed ECUs.

FAQ

What is the maximum junction temperature rating for SPC58EC80E3QMC1X?

The device is rated for junction temperatures from –40 °C to +150 °C, validated per AEC-Q100 Grade 1 requirements. This rating applies under specified power dissipation and PCB thermal design conditions, including use of the eTQFP100 package's exposed thermal pad with ≥4 thermal vias to internal ground planes.

Does SPC58EC80E3QMC1X support secure boot with cryptographic signature verification?

Yes. The integrated Hardware Security Module (HSM) enforces secure boot by verifying ECDSA-P256 signatures on boot images stored in protected Flash sectors. Boot assist Flash (BAF) allows factory programming via CAN/LIN UART, and HSM key storage is isolated from application software access.

How many CAN FD interfaces does SPC58EC80E3QMC1X provide, and what is their data rate capability?

The MCU integrates eight MCAN modules, each compliant with ISO 11898-1 CAN FD. All support bit rates up to 5 Mbps in FD mode and include shared memory schemes for efficient message buffering. Each MCAN has dedicated message RAM and flexible filtering, enabling concurrent high-bandwidth sensor and actuator communication.

Is the Ethernet controller compatible with Time-Sensitive Networking (TSN) standards?

The integrated 10/100 Mbps Ethernet MAC supports IEEE 1588-2008 Precision Time Protocol (PTP) with hardware timestamping (64-bit), IEEE 802.1AS (AVB), and IEEE 802.1Q VLAN tagging. While it provides foundational TSN capabilities like time synchronization and traffic shaping, full TSN scheduler offload requires external PHY or software stack implementation.

SPC58EC80E3QMC1X Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
100-TQFP Exposed Pad
Series:
SPC58
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Core Processor:
e200z4
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
Ethernet, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, Temp Sensor, WDT
Number of I/O:
-
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10/12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

SPC58EC80E3QMC1X FAQ

1.How can I place an order for SPC58EC80E3QMC1X through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC58EC80E3QMC1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC58EC80E3QMC1X reliable?

The price and inventory of SPC58EC80E3QMC1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC58EC80E3QMC1X is usually 5 days.

3.What payment methods are accepted for SPC58EC80E3QMC1X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC58EC80E3QMC1X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC58EC80E3QMC1X?

SPC58EC80E3QMC1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC58EC80E3QMC1X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC58EC80E3QMC1X?

For technical support, including SPC58EC80E3QMC1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC58EC80E3QMC1X requirements.

6.How does Aetrix verify that SPC58EC80E3QMC1X is sourced from the original manufacturer or authorized distributors?

All SPC58EC80E3QMC1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC58EC80E3QMC1X meets industry standards.

7.What is the process for return or replacement of SPC58EC80E3QMC1X?

All SPC58EC80E3QMC1X units undergo pre-shipment inspection (PSI). If there is an issue with SPC58EC80E3QMC1X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC58EC80E3QMC1X part is unused and in its original packaging.

Return procedure for SPC58EC80E3QMC1X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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