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STMicroelectronics SR5E1E770C30F00X

Part No.:
SR5E1E770C30F00X
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixSR5E1E770C30F00X.pdf
Description:
LQFP 176L 24X24X1.4 EXPOSED PAD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:467

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Product details

Overview

SR5E1E770C30F00X from STMicroelectronics is an AEC-Q100 qualified automotive MCU featuring dual 300 MHz Arm® Cortex®‑M7 cores, 2 MB on-chip flash (including 960 KB OTA-reprogrammable bank), 488 KB SRAM, ASIL-D safety architecture, and integrated HSM with Cortex®‑M0+ core running at 150 MHz - designed for silicon carbide and gallium nitride power conversion in traction inverters and on-board chargers.

For engineers reviewing the SR5E1E770C30F00X datasheet, SR5E1E770C30F00X pinout, SR5E1E770C30F00X application, or SR5E1E770C30F00X equivalent, key selection criteria include dual-core lockstep capability, 102 ps high-resolution timer resolution, 5× 12-bit SAR ADCs (5 MSPS dual-mode sampling), eLQFP176 package compatibility, and ISO/SAE 21434 cybersecurity compliance via embedded HSM.

Technical Context

This MCU implements a split-lock dual Cortex®‑M7 architecture supporting either parallel execution (2× 300 MHz) or lockstep safety mode with paired DMA engines, FCCU failure handling, MEMU memory error reporting, and CRC units - all aligned to ISO 26262 ASIL-D requirements. The HSM subsystem uses a dedicated 150 MHz Cortex®‑M0+ core with 160 KB flash and 40 KB RAM, enabling EVITA Medium–compliant cryptographic services including AES-128/256, GCM, and TRNG.

Peripherals are optimized for wide-bandgap control: two HRTIM modules deliver 24× PWM outputs with 102 ps timing resolution; five independent 12-bit SAR ADCs achieve up to 5 MSPS in dual mode; two 16-bit sigma-delta ADCs (333 ksps OSR=24) are available only in eLQFP176; and four MCAN-FD interfaces share 16 KB message RAM for deterministic real-time communication.

Key Specifications

ParameterValue and Actual Design Meaning
CoresDual 32-bit Arm® Cortex®‑M7 @ 300 MHz (1284 DMIPS), configurable in split or lockstep mode
Flash Memory2 MB total: 1920 KB user code flash (dual-bank OTA), 160 KB HSM code flash
RAM488 KB total: 256 KB system RAM + 64 KB instruction TCM + 128 KB data TCM + 40 KB HSM RAM
High-Resolution Timer2× HRTIM modules, 12× 16-bit counters, 102 ps resolution, 24 PWM channels
Analog Converters5× 12-bit SAR ADCs (8 ch each, 5 MSPS dual-mode), 2× 16-bit sigma-delta ADCs (2 ch each, 333 ksps)
SecurityHSM with Cortex®‑M0+ @ 150 MHz, AES-128/256, GCM, TRNG, 160 KB flash, 40 KB RAM
Safety CertificationAEC-Q100 Grade 0 (−40°C to +150°C junction), ISO 26262 ASIL-D compliant architecture

Pinout & Package

eLQFP176 package (24 × 24 × 1.4 mm), thermally enhanced with exposed pad; supports full peripheral set including all 2× HRTIM, 2× sigma-delta ADCs, 4× MCAN-FD, and parallel trace port (1–8 lines).

Pin/TerminalCircuit RoleDesign Meaning
VDD_LVCore supply voltage1.225–1.345 V supply for Cortex®‑M7 cores; critical for 300 MHz operation stability
VDD_HV_IOI/O and internal PMU supply3.15–3.45 V supply enabling 3.3 V GPIO operation and internal SMPS regulation
VDD_HV_SARSAR ADC analog supply3.15–3.45 V rail ensuring 12-bit accuracy and 5 MSPS sampling performance
PA0–PA15, PB0–PB15, etc.Multi-function GPIO banksConfigurable as HRTIM outputs, ADC inputs, CAN-FD transceivers, or SPI/I²C peripherals
TRACED0–TRACED7Parallel trace data linesOptional 1–8-line trace port (not available in smaller packages); enables off-chip CoreSight™ instruction/data tracing

Key Features

FeatureDesign Value
Dual-core lockstep configurationEnables ASIL-D compliance by executing identical instructions on two M7 cores with comparator logic detecting divergence
Built-in OTA reprogrammingDual-image flash banking (960 KB per bank) allows safe firmware updates without runtime interruption
CORDIC hardware acceleratorOffloads trigonometric computations (sin/cos/tan) from CPU, reducing control loop latency in motor algorithms
Enhanced analog subsystemFive independent SAR ADCs + two sigma-delta ADCs enable simultaneous high-speed current/voltage sensing and precision temperature monitoring
MCAN-FD with shared RAMFour CAN-FD controllers sharing 16 KB message RAM reduce memory footprint and improve deterministic message scheduling

Applications

Traction Inverter ControlOn-Board Charger (OBC)

Use Scenario: Real-time field-oriented control of SiC/GaN-based 3-phase motor drives in EV powertrains.

IC Role / Device Role / Timing Role: Primary controller executing PWM generation, current sensing, and fault response with <100 ns jitter tolerance.

Use Value: 102 ps HRTIM resolution enables precise dead-time insertion and phase alignment across 24 PWM outputs, minimizing switching losses in high-frequency SiC operation.

Use Scenario: Bidirectional AC/DC and DC/DC conversion in EV charging systems with dynamic load balancing.

IC Role / Device Role / Timing Role: Central digital controller managing PFC, isolation, and battery-side regulation using multi-loop feedback.

Use Value: Five SAR ADCs sample input voltage, output current, and thermal sensors simultaneously at 5 MSPS, enabling adaptive control under transient grid conditions.

DC/DC Converter for 48 V SystemsAutomotive Battery Management System (BMS)

Use Scenario: High-efficiency isolated DC/DC conversion between 48 V and 12 V domains in mild-hybrid architectures.

IC Role / Device Role / Timing Role: High-frequency digital controller synchronizing GaN half-bridges with sub-nanosecond timing precision.

Use Value: Dual HRTIM modules generate complementary PWM pairs with programmable delay compensation, eliminating external gate drivers and reducing BOM cost.

Use Scenario: Cell-level voltage, temperature, and current monitoring with secure firmware updates over CAN-FD.

IC Role / Device Role / Timing Role: Safety-critical host processor performing ASIL-D diagnostics, SOC/SOH estimation, and encrypted OTA patching.

Use Value: Integrated HSM validates firmware signatures and executes AES-256 encryption for secure CAN-FD communication, meeting ISO/SAE 21434 cybersecurity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance automotive MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP S32K398Single 32-bit Arm® Cortex®‑R52 core @ 400 MHz; 4 MB flash; no integrated sigma-delta ADCsTargeted at domain controller roles with higher compute density but less analog integrationSelect when prioritizing raw CPU throughput over mixed-signal control fidelity
Renesas RH850/U2A32-bit proprietary core @ 400 MHz; 8 MB flash; ASIL-D certified but lacks OTA dual-bank architectureFocused on legacy automotive ECU consolidation with strong CAN FD and functional safety toolchain supportSelect when requiring long-term toolchain continuity and minimal migration effort from RH850 legacy designs

Compared with NXP S32K398 and Renesas RH850/U2A, SR5E1E770C30F00X uniquely combines dual M7 lockstep execution, 102 ps timer resolution, and integrated sigma-delta ADCs - making it optimal for wide-bandgap power stage control where analog precision, timing determinism, and safety-certified OTA updates are co-dependent requirements.

Availability

SR5E1E770C30F00X is available at Aetrix Electronics and suitable for traction inverter development, on-board charger production, and 48 V DC/DC converter design requiring stable component supply across automotive OEM and Tier-1 programs.

Supply support for SR5E1E770C30F00X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering intelligent power, sensing, and control solutions for automotive, industrial, and consumer markets.

The SR5E1E7 line belongs to the Stellar electrification MCU family - engineered specifically for digital control of silicon carbide and gallium nitride power converters, emphasizing real-time determinism, ASIL-D safety, and secure over-the-air updates in electric vehicle powertrain systems.

FAQ

What is the maximum junction temperature rating for SR5E1E770C30F00X?

The SR5E1E770C30F00X is rated for operation up to 150°C junction temperature, validated per AEC-Q100 Grade 0 specifications. This enables deployment in high-thermal-load locations such as traction inverter control boards mounted near power modules, provided PCB thermal design meets the 2.5°C/W max θJA requirement specified in DS13808 Rev 8.

Does SR5E1E770C30F00X support CAN-FD with flexible data-rate operation?

Yes - SR5E1E770C30F00X integrates four fully compliant MCAN modules supporting ISO 11898-1:2015 CAN-FD, including bit-rate switching, payload up to 64 bytes, and shared 16 KB message RAM. Each MCAN supports programmable TX/RX buffers, hardware filtering, and time-triggered communication modes for deterministic network scheduling.

How is the HSM (Hardware Security Module) physically isolated from the main application cores?

The HSM is implemented as a dedicated Cortex®‑M0+ subsystem clocked at 150 MHz, with private 160 KB flash, 40 KB RAM, and 32 KB data flash - all electrically and logically isolated via SMPU and firewall registers. Communication occurs only through defined mailbox interfaces with hardware-enforced access control, preventing unauthorized read/write access from the M7 cores.

Can the 16-bit sigma-delta ADCs be used simultaneously with all five 12-bit SAR ADCs?

Yes - both sigma-delta ADCs and all five SAR ADCs operate independently and concurrently. However, the two sigma-delta ADCs are only available in the eLQFP176 package (SR5E1E7), while SAR ADCs are present across all variants. Their combined use enables synchronized high-precision temperature sensing (sigma-delta) alongside fast current/voltage sampling (SAR) in multi-sensor motor control loops.

SR5E1E770C30F00X Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
176-LQFP Exposed Pad
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, PWM, Temp Sensor, WDT
Number of I/O:
-
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
96K x 8
RAM Size:
488K x 8
Voltage - Supply (Vcc/Vdd):
3.15V ~ 3.45V
Data Converters:
A/D 40x12b SAR, 4x16b Sigma-Delta; D/A 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SR5E1E770C30F00X FAQ

1.How can I place an order for SR5E1E770C30F00X through Aetrix?

Please submit a Request for Quotation (RFQ) for SR5E1E770C30F00X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SR5E1E770C30F00X reliable?

The price and inventory of SR5E1E770C30F00X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SR5E1E770C30F00X is usually 5 days.

3.What payment methods are accepted for SR5E1E770C30F00X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SR5E1E770C30F00X transactions.

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4.How is shipping managed for SR5E1E770C30F00X?

SR5E1E770C30F00X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SR5E1E770C30F00X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SR5E1E770C30F00X?

For technical support, including SR5E1E770C30F00X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SR5E1E770C30F00X requirements.

6.How does Aetrix verify that SR5E1E770C30F00X is sourced from the original manufacturer or authorized distributors?

All SR5E1E770C30F00X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SR5E1E770C30F00X meets industry standards.

7.What is the process for return or replacement of SR5E1E770C30F00X?

All SR5E1E770C30F00X units undergo pre-shipment inspection (PSI). If there is an issue with SR5E1E770C30F00X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SR5E1E770C30F00X part is unused and in its original packaging.

Return procedure for SR5E1E770C30F00X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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