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NXP Semiconductors SSL3250AHN/C1,528
- Part No.:
- SSL3250AHN/C1,528
- Manufacturer:
- NXP Semiconductors
- Category:
- LED Drivers
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
SSL3250AHN/C1,528.pdf
- Description:
- IC LED DRVR RGLTR I2C 16HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,349
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Product details
Overview
SSL3250AHN/C1,528 from NXP Semiconductors is a photo flash dual LED driver IC designed for mobile phone camera modules. It delivers up to 500 mA flash current with >85 % efficiency, supports Flash/Torch/Indicator modes via I²C or direct enable control, and integrates time-out protection and TxMasking-capable current scaling for RF coexistence.
For engineers reviewing the SSL3250AHN/C1,528 datasheet, SSL3250AHN/C1,528 pinout, SSL3250AHN/C1,528 application, or SSL3250AHN/C1,528 equivalent, key selection criteria include its 1.2 MHz boost switching frequency, HVQFN16 (SOT758-3) thermal package, programmable 2.5–500 mA LED currents, integrated OVP/OTP/UVLO protection, and strobe-triggered flash timing with 820 ms hardware timeout.
Technical Context
The SSL3250AHN/C1,528 implements an asynchronous boost converter with integrated linear current sink for main LED(s), plus a separate linear sink for indicator LED. It operates in two interface modes-configurable via IF_SEL pin-supporting either I²C (up to 400 kHz) with register-based control or direct enable logic using ACT/EN1/EN2 signals.
Functional operation includes five distinct modes: Shut-down, Standby, Indicator, Torch (50–200 mA), and Flash (up to 500 mA). Flash mode supports timed operation (programmable up to 820 ms), strobe-triggered activation (STRB), and rapid current reduction during RF transmit via external RFL resistor reconfiguration within 50 μs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| LED Drive Capability | Single or dual-series white LEDs; 500 mA max flash current ensures high-luminance photo capture. |
| Input Voltage Range | 2.7 V to 5.5 V; compatible with single-cell Li-ion and Li-poly battery systems without external regulation. |
| Boost Switching Frequency | 1.2 MHz; enables use of small 2.2 μH inductor and 4.7 μF ceramic capacitors, minimizing PCB footprint. |
| Output Voltage Range | Up to 9.5 V; sufficient to drive two 3.6 V white LEDs in series under worst-case forward voltage conditions. |
| I²C Interface Speed | Up to 400 kHz Fast-mode; allows real-time configuration of current levels, timing, and protection flags without bus contention. |
| Thermal Protection | Integrated OverTemperature Protection (OTP); halts switching above Totp, prevents thermal runaway in compact mobile enclosures. |
| Flash Timing Control | Hardware time-out fixed at 820 ms; prevents LED overstress during uncontrolled Flash mode activation in Direct enable mode. |
Pinout & Package
SSL3250AHN/C1,528 uses the SOT758-3 (HVQFN16) thermally enhanced 3 × 3 × 0.85 mm package with exposed die pad for GND connection. Pin 1 is located in quadrant 2 per tape-and-reel orientation (package rotated 90° clockwise).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| R_TR | Analog input for torch current setting | Resistor-connected pin defining 50–200 mA main LED current in Direct enable mode; ignored in I²C mode. |
| R_FL | Analog input for flash current scaling | Enables TxMasking by dynamically lowering flash current during RF transmit; sets 500 mA default when tied to VIN. |
| SCL / EN2 | I²C clock or enable control input | Dual-function pin: SCL in I²C mode; EN2 in Direct mode for mode selection (Torch/Flash/Indicator). |
| SDA / EN1 | I²C data or enable control I/O | Dual-function pin: bidirectional SDA in I²C mode; EN1 in Direct mode for mode selection and interrupt acknowledgment. |
| R_IND | Analog input for indicator LED current | Sets 2.5–20 mA indicator current in Direct mode; ignored in I²C mode where register-controlled. |
| I_IND | Indicator LED current sink output | Linear sink driving indicator LED between VBAT and this pin; independent of main LED boost path. |
| VO | Boost converter output voltage | Regulated high-side output node feeding LED anode; monitored for overvoltage protection (Vovp = 9.5 V). |
| GND | Signal ground reference | Logic and analog reference plane; distinct from PGND to minimize noise coupling into current sensing. |
| LED | Main LED current feedback input | Sense node connected to LED cathode; used for closed-loop current regulation and short-circuit detection. |
| IF_SEL | Interface selection control | Static logic input at power-up determining I²C vs. Direct enable mode; must remain stable after startup. |
| INT | Open-drain fault interrupt output | Active-low signal indicating OVP/OTP/TO/OS_PROT faults; supports wired-OR multi-device interrupt sharing. |
| PGND | Power ground return | High-current return path for LX switch node and LED sink; isolated from signal GND to reduce EMI. |
| LX | Switch node connection | Connection point for external boost inductor; carries pulsed 2.2 A peak current during switching. |
| VIN | Main supply input | Accepts 2.7–5.5 V battery input; powers internal regulators and gate drivers; UVLO threshold at ~2.5 V. |
| ACT | Global device activation | Asynchronous enable pin common to both interface modes; LOW forces Shut-down mode regardless of other controls. |
| STRB | Hardware flash strobe trigger | Edge-sensitive input enabling Flash mode in I²C mode; bypasses I²C latency for precise timing-critical flash initiation. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable multi-mode LED control | Independent Flash (500 mA), Torch (50–200 mA), and Indicator (2.5–20 mA) operation via I²C registers or resistor networks. |
| RF-aware flash current modulation | External RFL reconfiguration reduces main LED current within 50 μs during RF transmit, lowering inductor/battery stress. |
| Integrated safety protections | OVP (9.5 V), OTP, UVLO, time-out (820 ms), and output short detection-all inhibit switching and assert INT pin. |
| Low-power standby and shutdown | <1 μA shutdown current; Standby mode maintains I²C responsiveness while disabling boost switching and LED sinks. |
| Thermally optimized HVQFN package | SOT758-3 with exposed die pad; achieves low θJA for sustained 500 mA flash operation in space-constrained mobile PCBs. |
Applications
| Mobile Phone Camera Flash | Digital Camera Auxiliary Lighting |
|---|---|
|
Use Scenario: Front/rear camera module in smartphone requiring high-intensity, brief-duration illumination for low-light still capture. IC Role / Device Role / Timing Role: Primary flash LED driver delivering 500 mA current pulses with <820 ms hardware time-out and strobe-synchronized activation. Use Value: Enables consistent luminance across varying battery voltage (2.7–5.5 V) and prevents LED thermal damage via integrated time-out and OTP. |
Use Scenario: Compact digital camera needing dual-mode lighting: bright flash for photos and dim indicator for UI status or video assist. IC Role / Device Role / Timing Role: Single-chip solution managing both main flash LED (Flash/Torch) and auxiliary indicator LED (2.5–20 mA) with independent current control. Use Value: Eliminates need for separate indicator driver IC; reduces BOM count and PCB area while maintaining precise current accuracy for both functions. |
| RF-Coexistent Mobile Imaging | Space-Constrained Portable Devices |
|
Use Scenario: LTE/5G smartphone where simultaneous flash illumination and cellular transmission must avoid mutual interference and battery overload. IC Role / Device Role / Timing Role: Flash driver with TxMasking capability-externally lowers flash current during RF burst via RFL switching, synchronized to baseband control. Use Value: Prevents excessive inductor current draw during RF transmit, avoiding battery sag and RF desense without sacrificing flash brightness pre/post transmit. |
Use Scenario: Wearable camera or ultra-thin tablet requiring minimal component height and board area for camera subsystem integration. IC Role / Device Role / Timing Role: Highly integrated flash driver replacing discrete boost + current sink + protection circuits; uses only four external components (2×cap, 1×ind, 1×diode). Use Value: Reduces total solution footprint by >40% versus discrete alternatives; 1.2 MHz switching enables 2.2 μH inductor and 3×3 mm QFN package. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar photo flash LED driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS61310DSKR | Single-mode boost driver (flash-only); no Torch/Indicator outputs; no I²C; fixed 400 mA current; no time-out or TxMasking. | Requires external circuitry for Torch/Indicator; lacks integrated protection signaling; limited to basic flash-only use cases. | Select when only flash functionality is needed and system-level control is handled externally; not suitable for multi-mode or RF-coexistent designs. |
| MAX8630YETA+ | Triple-output LED driver (flash + torch + indicator); I²C interface; 1.25 MHz switching; but max flash current 350 mA and no dedicated STRB pin. | Supports concurrent Torch+Indicator but lower flash current ceiling; lacks hardware strobe for latency-critical flash triggering. | Prefer when simultaneous indicator + torch operation is required and 350 mA flash suffices; avoid if 500 mA or sub-μs strobe response is mandatory. |
Compared with TPS61310DSKR and MAX8630YETA+, the SSL3250AHN/C1,528 uniquely combines 500 mA flash current, hardware strobe (STRB), programmable TxMasking, and full three-mode operation in a thermally optimized 3×3 mm HVQFN, making it optimal for high-end mobile imaging with RF coexistence requirements.
Availability
SSL3250AHN/C1,528 is available at Aetrix Electronics and suitable for mobile phone camera modules, digital camera auxiliary lighting, and RF-coexistent portable imaging systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for SSL3250AHN/C1,528 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and mobile applications, with leadership in power management and interface ICs.
The SSL3250A product line was developed specifically for high-efficiency, multi-mode photo flash LED driving in battery-powered mobile devices, emphasizing thermal robustness, RF coexistence, and minimal external component count.
FAQ
What is the maximum flash current supported by the SSL3250AHN/C1,528?
The SSL3250AHN/C1,528 supports a maximum flash current of 500 mA in both I²C and Direct enable modes. In Direct enable mode, this is set by connecting a 50 kΩ resistor to the R_FL pin; in I²C mode, it corresponds to register value 31 in the Current Control register (00h). The device enforces an 820 ms hardware time-out to prevent LED overstress at this current level.
How does the SSL3250AHN/C1,528 support RF coexistence during flash operation?
The SSL3250AHN/C1,528 supports RF coexistence through its TxMasking capability: an external switch can dynamically reconfigure the R_FL resistor during RF transmit, reducing flash current within 50 μs. This lowers inductor current and battery load without disabling the flash function, preventing RF desense and battery sag in LTE/5G smartphones.
What package type and pin orientation does the SSL3250AHN/C1,528 use?
The SSL3250AHN/C1,528 uses the SOT758-3 (HVQFN16) package: a 3 × 3 × 0.85 mm thermally enhanced quad flat no-lead package with exposed die pad. Per ordering information, the SSL3250AHN/C1,528 variant has pin 1 located in quadrant 2, achieved by rotating the standard package 90° clockwise relative to the tape-and-reel orientation.
Does the SSL3250AHN/C1,528 require external components for basic operation?
Yes-the SSL3250AHN/C1,528 requires four external components for basic boost operation: one 2.2 μH inductor (LX to VO), one Schottky diode (VO to LED), and two 4.7 μF ceramic capacitors (VIN and VO decoupling). Additional resistors (R_FL, R_TR, R_IND) are optional and used only for current programming in Direct enable mode.
What protection features are integrated into the SSL3250AHN/C1,528?
The SSL3250AHN/C1,528 integrates OverVoltage Protection (OVP), OverTemperature Protection (OTP), UnderVoltage LockOut (UVLO), time-out protection (820 ms), and output short-circuit protection. All faults assert the open-drain INT pin and halt switching; OVP triggers at 9.5 V, OTP activates above chip temperature limit, and short-circuit detection responds in <1 ms.
SSL3250AHN/C1,528 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- DC DC Regulator
- Topology:
- Step-Up (Boost)
- Internal Switch(s):
- Yes
- Number of Outputs:
- 1
- Voltage - Supply (Min):
- 2.7V
- Voltage - Supply (Max):
- 5.5V
- Voltage - Output:
- 9.5V
- Current - Output / Channel:
- 500mA
- Frequency:
- 1.2MHz
- Dimming:
- I2C
- Applications:
- Camera Flash
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-HVQFN (3x3)
SSL3250AHN/C1,528 FAQ
1.How can I place an order for SSL3250AHN/C1,528 through Aetrix?
Please submit a Request for Quotation (RFQ) for SSL3250AHN/C1,528 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SSL3250AHN/C1,528 reliable?
The price and inventory of SSL3250AHN/C1,528 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SSL3250AHN/C1,528 is usually 5 days.
3.What payment methods are accepted for SSL3250AHN/C1,528?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SSL3250AHN/C1,528 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SSL3250AHN/C1,528?
SSL3250AHN/C1,528 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SSL3250AHN/C1,528 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SSL3250AHN/C1,528?
For technical support, including SSL3250AHN/C1,528 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SSL3250AHN/C1,528 requirements.
6.How does Aetrix verify that SSL3250AHN/C1,528 is sourced from the original manufacturer or authorized distributors?
All SSL3250AHN/C1,528 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SSL3250AHN/C1,528 meets industry standards.
7.What is the process for return or replacement of SSL3250AHN/C1,528?
All SSL3250AHN/C1,528 units undergo pre-shipment inspection (PSI). If there is an issue with SSL3250AHN/C1,528, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SSL3250AHN/C1,528 part is unused and in its original packaging.
Return procedure for SSL3250AHN/C1,528:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SSL3250AHN/C1,528 Tags
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BCR402RE6327HTSA1
Infineon Technologies
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BCR430UXTSA2
Infineon Technologies
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BCR420UE6433HTMA1
Infineon Technologies
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BCR420UE6327HTSA1
Infineon Technologies
-
BCR421UE6327HTSA1
Infineon Technologies
-
LYT1604D-TL
Power Integrations
-
HV9910CLG-G
Microchip Technology
-
CL2N8-G
Microchip Technology
-
BCR420UW6-7
Diodes Incorporated
-
BCR421UW6-7
Diodes Incorporated
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BCR420UFD-7
Diodes Incorporated
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BCR421UFD-7
Diodes Incorporated
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