My Inquiry
My Account
Microchip Technology SST12LF01-QDE
- Part No.:
- SST12LF01-QDE
- Manufacturer:
- Microchip Technology
- Category:
- RF Front End (LNA + PA)
- Package:
- 24-WFQFN Exposed Pad
- Datasheet:
-
SST12LF01-QDE.pdf
- Description:
- IC FRONT END MOD 2.4GHZ 24WQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,667
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST12LF01-QDE from Microchip Technology is a 2.4 GHz Front-End Module (FEM) integrating a GaAs PHEMT-based Low-Noise Amplifier (LNA) and an InGaP/GaAs HBT Power Amplifier (PA) in a single 24-contact WQFN package. It delivers 12 dB RX gain, 1.45 dB noise figure, >1 dBm RX IIP3, 29 dB TX gain, and 22% PAE at 22 dBm output for IEEE 802.11g applications in WLAN transceivers.
For engineers reviewing the SST12LF01-QDE datasheet, SST12LF01-QDE pinout, SST12LF01-QDE application, or SST12LF01-QDE equivalent, key selection criteria include its dual-chain RF performance across 2.4–2.55 GHz, ultra-low 2.5 µA shutdown current, <100 ns power-up/down timing, and 50 Ω matched RX/TX ports requiring no external DC blocking or matching components.
Technical Context
The SST12LF01-QDE implements two independent RF signal paths: an LNA chain optimized for low-noise, moderate-gain receive amplification with self-biasing and 50 Ω input/output matching; and a high-efficiency PA chain supporting 802.11b/g OFDM modulation with linear output up to 23 dBm while meeting spectral mask requirements.
Its architecture uses separate bias supplies (VDD_RX for LNA; VCC_TX1/VCC_TX2/VCCb for PA stages) and a dedicated VREF-controlled enable/current-setting interface. Gain stability over temperature (±1 dB from 0°C to +85°C) and fast switching (<200 ns total delay including driver) support time-division duplex (TDD) operation in Wi-Fi systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RX Frequency Range | 2400–2550 MHz - Covers full 802.11b/g/n 2.4 GHz ISM band without tuning. |
| RX Small-Signal Gain | 12 dB typical - Enables sufficient sensitivity boost before baseband ADC with minimal added noise. |
| RX Noise Figure | 1.45 dB typical - Directly supports high SNR in low-SINAD environments like mobile clients. |
| TX Output Power (P1dB) | >26.5 dBm - Ensures headroom for 23 dBm linear operation under 802.11g OFDM ACPR compliance. |
| TX Power-Added Efficiency | 22% @ 22 dBm (802.11g) - Reduces thermal load and extends battery life in portable devices. |
| Shutdown Current | 2.5 µA typical - Allows deep-sleep modes without compromising system-level power budget. |
| Power-Up/Down Time | <100 ns (10–90%) - Meets tight TDD timing constraints in modern Wi-Fi MAC layer protocols. |
Pinout & Package
Package: 24-contact WQFN, 4 mm × 4 mm, 0.5 mm pitch, exposed thermal paddle (SST Package Code QD). Complies with JEDEC MO-220J variant WGGD-4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (LNAIN) | LNA RF Input | 50 Ω matched single-ended receive antenna interface; no external DC blocking required. |
| 4, 5 (PAOUT) | PA RF Output | Dual-output configuration enables balanced layout or diversity routing; both pins carry identical RF signal. |
| 6, 9, 11 (VCC_TX2, VCC_TX1, VCCb) | PA Power Supplies | Independent bias rails for PA stages - allows optimization of efficiency vs. linearity trade-offs. |
| 10 (VREF) | PA Enable & Current Control | Ultra-low-current control input (IREF <4 mA); sets operating point and enables fast on/off switching. |
| 14 (PAIN) | PA RF Input | 50 Ω matched single-ended transmit path input; accepts typical +10 dBm driver output. |
| 18 (LNAOUT) | LNA RF Output | 50 Ω matched output directly interfaces with downconversion mixer or SAW filter. |
| 22 (VDD_RX) | LNA Power Supply | Dedicated 3.3 V supply rail; draws only 10 mA typical, enabling low-power RX mode operation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LNA + PA in single WQFN | Reduces PCB area by >40% vs. discrete solutions; eliminates inter-stage matching complexity. |
| Self-biased LNA with no external resistors | Eliminates 4–6 passive components per LNA stage, lowering BOM cost and layout risk. |
| 50 Ω matched RX/TX ports | Removes need for external DC blocking capacitors, baluns, or impedance-matching networks. |
| Ultra-fast enable/disable control | Sub-200 ns total latency enables dynamic TDD scheduling in 802.11n/ac PHY layers. |
| RoHS-compliant non-Pb finish | Meets global environmental regulations without requiring lead-free reflow process changes. |
Applications
| Wi-Fi Client Devices | IoT Gateway Transceivers |
|---|---|
Use Scenario: Compact 2.4 GHz Wi-Fi client in smartphones, tablets, or USB dongles requiring low power consumption and small footprint. IC Role / Device Role / Timing Role: Dual-chain FEM handles both RX amplification and TX power boosting within same physical package; operates synchronously with MAC-layer TDD timing. Use Value: 70 mA idle current and 2.5 µA shutdown current extend battery life; 12 dB RX gain improves link margin in weak-signal indoor environments. | Use Scenario: Multi-node IoT gateway aggregating data from BLE/Wi-Fi sensors using concurrent 2.4 GHz radios. IC Role / Device Role / Timing Role: Provides high-linearity TX output (23 dBm @ 802.11g) and low-noise RX path (1.45 dB NF) for reliable coexistence in dense RF environments. Use Value: Meets 802.11g OFDM ACPR mask at 23 dBm and 802.11b mask at 24 dBm - ensures regulatory compliance without external filtering. |
| Wireless Audio Streaming | Industrial Wireless Sensors |
Use Scenario: Real-time audio streaming over Wi-Fi with low-latency, low-EVM transmission. IC Role / Device Role / Timing Role: PA chain delivers <4% added EVM at 20 dBm output for 54 Mbps 802.11g OFDM - preserving audio fidelity during packet bursts. Use Value: High TX linearity minimizes intermodulation distortion in multi-channel audio streams, reducing audible artifacts. | Use Scenario: Battery-powered industrial sensor node transmitting telemetry via 802.11b/g in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Maintains ±1 dB gain/power variation across full operating temperature range - ensures consistent RF performance without calibration. Use Value: Stable 29 dB TX gain and 12 dB RX gain eliminate need for closed-loop power control circuitry in remote deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 2.4 GHz front-end module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST12LP14-QDF | Higher 33 dB TX gain; 2.4–2.5 GHz band only; requires external VREF resistor network. | Better suited for long-range access points needing higher output drive; less optimal for compact clients due to larger bias overhead. | Select when >30 dB TX gain is mandatory and board space allows additional bias components. |
| SKY85303-31 | Integrated T/R switch; 2.4–2.5 GHz; 27 dB TX gain; 1.7 dB NF; RoHS-compliant 16-pin QFN. | Reduces external switch count but lacks dual PA outputs; lower RX gain limits sensitivity in marginal links. | Choose when system-level integration priority outweighs absolute RX sensitivity requirements. |
Compared with SST12LF01-QDE, SST12LP14-QDF offers higher TX gain at the cost of increased bias complexity, while SKY85303-31 trades RX performance for integrated switching - making SST12LF01-QDE optimal for balanced, low-power, dual-output 2.4 GHz client designs.
Availability
SST12LF01-QDE is available at Aetrix Electronics and suitable for Wi-Fi client devices, IoT gateways, wireless audio streaming endpoints, and industrial wireless sensors requiring stable component supply, consistent RF performance across temperature, and RoHS-compliant manufacturing.
Supply support for SST12LF01-QDE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontroller, analog, FPGA, and connectivity solutions, acquired Silicon Storage Technology (SST) in 2016 to expand its RF and memory portfolio.
The SST12LF01-QDE belongs to Microchip's legacy SST RF Front-End Module product line, designed specifically for cost-sensitive, high-volume 2.4 GHz IEEE 802.11b/g/n client applications demanding low power, small form factor, and simplified RF design.
FAQ
What is the operating frequency range of the SST12LF01-QDE?
The SST12LF01-QDE operates across 2400–2550 MHz for its LNA chain and 2400–2485 MHz for its PA chain, fully covering the 2.4 GHz ISM band used by IEEE 802.11b/g/n standards. This range supports all 14 channels in the 2.4 GHz Wi-Fi band without retuning or band-switching circuitry.
Does the SST12LF01-QDE require external matching components?
No, the SST12LF01-QDE features internally matched 50 Ω input and output ports for both RX and TX chains. Its LNAIN and LNAOUT pins are DC-coupled and require no external DC blocking capacitors or impedance-matching networks, significantly reducing BOM count and layout complexity compared to discrete solutions.
What is the power-up time specification for the SST12LF01-QDE?
The SST12LF01-QDE achieves 10% to 90% power-up in under 100 ns, with total enable delay (including driver propagation) less than 200 ns. This ultra-fast switching supports time-division duplex (TDD) operation in modern Wi-Fi PHY layers where rapid RX/TX state transitions are critical for throughput and latency.
How does the SST12LF01-QDE handle thermal stability across temperature?
The SST12LF01-QDE maintains ±1 dB variation in both gain and output power from 0°C to +85°C ambient temperature. This stability is achieved through GaAs PHEMT/HBT process optimization and internal bias compensation, eliminating the need for external temperature compensation circuits in most client applications.
Is the SST12LF01-QDE pin-compatible with other SST front-end modules?
No, the SST12LF01-QDE uses a unique 24-pin WQFN pinout optimized for its dual-output PA and single-input LNA architecture. Pin assignments differ from SST12LP14-QDF (20-pin) and SST12LP05 (16-pin), requiring dedicated PCB layout - it is not a drop-in replacement for other SST FEMs.
SST12LF01-QDE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- Bluetooth, WLAN
- Frequency:
- 2.4GHz
- Features:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 24-WQFN (4x4)
SST12LF01-QDE FAQ
1.How can I place an order for SST12LF01-QDE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST12LF01-QDE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST12LF01-QDE reliable?
The price and inventory of SST12LF01-QDE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST12LF01-QDE is usually 5 days.
3.What payment methods are accepted for SST12LF01-QDE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST12LF01-QDE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST12LF01-QDE?
SST12LF01-QDE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST12LF01-QDE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST12LF01-QDE?
For technical support, including SST12LF01-QDE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST12LF01-QDE requirements.
6.How does Aetrix verify that SST12LF01-QDE is sourced from the original manufacturer or authorized distributors?
All SST12LF01-QDE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST12LF01-QDE meets industry standards.
7.What is the process for return or replacement of SST12LF01-QDE?
All SST12LF01-QDE units undergo pre-shipment inspection (PSI). If there is an issue with SST12LF01-QDE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST12LF01-QDE part is unused and in its original packaging.
Return procedure for SST12LF01-QDE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST12LF01-QDE Tags
-
RFX2401C
Skyworks Solutions Inc.
.jpg)
-
NRF21540-QDAA-R
Nordic Semiconductor ASA
-
NRF21540-QDAA-R7
Nordic Semiconductor ASA
-
RFX2411N
Skyworks Solutions Inc.
-
SE2438T-R
Skyworks Solutions Inc.
-
SKY66118-11
Skyworks Solutions Inc.
-
SKY85712-21
Skyworks Solutions Inc.
-
SKY85329-11
Skyworks Solutions Inc.
-
SKY66422-11
Skyworks Solutions Inc.
-
SKY66119-11
Skyworks Solutions Inc.
-
NJG1156PCD-TE1
Nisshinbo Micro Devices Inc.
-
SE2435L-R
Skyworks Solutions Inc.
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
