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Microchip Technology SST38VF6404-90-5C-B3KE
- Part No.:
- SST38VF6404-90-5C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST38VF6404-90-5C-B3KE.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,071
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Product details
Overview
SST38VF6404-90-5C-B3KE from Microchip Technology is a 64 Mbit (4M × 16) CMOS Advanced Multi-Purpose Flash Plus memory IC, designed for nonvolatile program, configuration, and data storage in embedded systems. It operates from a single 2.7–3.6 V supply, delivers 90 ns read access time, supports 100,000 write/erase cycles, and retains data for >100 years. It is commonly used in industrial controllers and network edge devices requiring field-upgradable firmware.
For engineers reviewing the SST38VF6404-90-5C-B3KE datasheet, SST38VF6404-90-5C-B3KE pinout, SST38VF6404-90-5C-B3KE application, or SST38VF6404-90-5C-B3KE equivalent, key selection considerations include its 48-ball TFBGA package, boot-block protection architecture (B127), Page Read capability (25 ns), Write-Buffer Programming (1.75 µs/word), and JEDEC-compliant x16 interface timing.
Technical Context
The SST38VF6404-90-5C-B3KE implements SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. Its memory map features a top-boot configuration where Block B127 (S1022–S1023) serves as the 8 KWord protected boot sector, with per-sector VPB/NVPB control in that block.
It supports three hardware-controlled protection modes: WP#-enabled boot-block lock, software-controlled individual 32 KWord block locking, and password-based security. Command execution follows JEDEC-standard x16 flash protocols, with status detection via DQ6/DQ7 polling and RY/BY# output, and includes Erase-Suspend/-Resume for concurrent read/program during background erase.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4M × 16 organization), providing 8 MB of addressable nonvolatile storage |
| Read Access Time | 90 ns - determines minimum bus cycle time for random reads in legacy parallel interfaces |
| Page Read Time | 25 ns per word - enables burst-like throughput for sequential access within 4-word pages |
| Write-Buffer Size | 16-word buffer - reduces effective programming time to 1.75 µs/word when loading multiple words |
| Endurance | 100,000 program/erase cycles - guarantees long-term reliability in firmware update applications |
| Data Retention | >100 years - ensures data integrity across product lifecycles without refresh |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic domains and tolerant of brown-out conditions |
Pinout & Package
Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), RoHS-compliant, 6 mm × 8 mm footprint, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4M-word addressing; A21–A12 select sector during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high |
| OE# | Output Enable | Active-low output gate; controls data bus visibility during read operations |
| WE# | Write Enable | Active-low control for write/program command latching and timing initiation |
| WP# | Write Protect | Active-low hardware lock for top boot block (B127); overrides software protection when asserted |
| RST# | Reset | Active-low hardware reset; returns device to read mode and aborts ongoing operations |
| RY/BY# | Ready/Busy | Open-drain status indicator: low = active program/erase, high = ready |
| VDD | Power Supply | 2.7–3.6 V core and I/O supply; decoupling required per JEDEC layout guidelines |
| VSS | Ground | Reference return path for all signals and power; requires low-impedance PCB plane |
| NC | No Connection | Unbonded pad; must be left floating or tied to ground per board design rules |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide injector enables fixed 18 ms sector/block erase time regardless of accumulated cycles |
| Top-Boot Block Architecture | Block B127 (S1022–S1023) is factory-configured as 8 KWord boot sector with dedicated VPB/NVPB per sector |
| Write-Buffer Programming | 16-word buffer reduces average programming time to 1.75 µs/word, accelerating firmware patch deployment |
| Erase-Suspend/-Resume | Allows reading or programming other blocks while erasing B127, enabling real-time system responsiveness |
| Hardware + Software Protection | Combines WP# pin lock, volatile/non-volatile block locks, and password protection for layered security |
| CFI & JEDEC Compliance | Supports standard flash command sets and CFI query mode for automatic driver detection and configuration |
Applications
| Industrial PLC Firmware Storage | Network Router Boot Code |
|---|---|
Use Scenario: Storing and updating firmware images in programmable logic controllers operating in harsh environments with wide temperature ranges. IC Role / Device Role / Timing Role: Nonvolatile code storage with hardware boot-block protection to prevent corruption during power loss or field updates. Use Value: 100,000-cycle endurance and >100-year data retention ensure multi-decade field operation without replacement; 90 ns read access meets deterministic scan-time requirements. |
Use Scenario: Holding bootloader and initial configuration in enterprise-grade Ethernet routers requiring secure, field-upgradable startup code. IC Role / Device Role / Timing Role: Primary boot memory with top-boot protection (B127) and password-enabled write-lock to prevent unauthorized firmware modification. Use Value: Write-Buffer Programming (1.75 µs/word) accelerates recovery image writes; Erase-Suspend allows concurrent diagnostics during background flash updates. |
| Medical Device Configuration Memory | Automotive Telematics Module |
Use Scenario: Storing calibrated sensor parameters and regulatory-compliant device settings in Class II medical equipment with audit-trail requirements. IC Role / Device Role / Timing Role: Secure configuration storage using 128-bit Unique ID and 256-word OTP Security-ID for device authentication and traceability. Use Value: Hardware-reset (RST#) and RY/BY# status pin enable deterministic fail-safe recovery; JEDEC compliance simplifies qualification against IEC 62304. |
Use Scenario: Hosting OTA update partitions and vehicle-specific calibration maps in automotive telematics control units (TCUs) operating at -40°C to +105°C. IC Role / Device Role / Timing Role: Dual-partition flash memory supporting A/B firmware swapping with hardware-level boot-block isolation between active and standby images. Use Value: Uniform 18 ms block erase time ensures predictable OTA update duration; Auto Low Power mode (3 µA) minimizes quiescent current during sleep states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF6402-90-5C-B3KE | Bottom-boot configuration (B0 protected), identical density/timing/package but different boot-block location and memory map | Requires PCB layout and firmware changes to remap boot vector and protection logic | Select only if bottom-boot architecture aligns with existing system boot ROM initialization flow |
| MX29LV640ETTI-90G | Same 64 Mbit x16, 90 ns, 48-TSOP package; lacks Write-Buffer Programming and Erase-Suspend; uses different command set | Not suitable for systems requiring fast buffered writes or concurrent read/erase; requires driver rewrite | Consider for cost-sensitive designs where simplified command set and TSOP packaging are prioritized over advanced features |
Compared with SST38VF6404-90-5C-B3KE, SST39VF6402-90-5C-B3KE offers identical performance but mandates firmware and protection logic rework due to inverted boot-block placement, while MX29LV640ETTI-90G sacrifices Write-Buffer and Erase-Suspend capabilities for broader distributor availability in TSOP form factor.
Availability
SST38VF6404-90-5C-B3KE is available at Aetrix Electronics and suitable for industrial automation, networking infrastructure, and automotive telematics applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant TFBGA packaging.
Supply support for SST38VF6404-90-5C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a leading provider of microcontrollers, analog components, and memory solutions, with expertise in embedded control and nonvolatile storage technologies.
The SST38VF6404 belongs to Microchip's Advanced Multi-Purpose Flash Plus (MPF+) product line, engineered for high-reliability, low-power, field-upgradable firmware and configuration storage in resource-constrained embedded systems.
FAQ
What is the boot-block configuration of SST38VF6404-90-5C-B3KE?
The SST38VF6404-90-5C-B3KE implements a top-boot architecture where Block B127 (S1022–S1023) serves as the 8 KWord protected boot sector. Unlike SST38VF6401/6402, this variant assigns volatile and non-volatile protection bits (VPB/NVPB) individually per sector within B127, enabling granular lockdown of critical startup code without affecting adjacent sectors. This configuration is fixed and cannot be altered in-circuit.
Does SST38VF6404-90-5C-B3KE support Page Read, and what is its timing benefit?
Yes, SST38VF6404-90-5C-B3KE supports Page Read with a 25 ns access time per word for four consecutive words within the same page (A21–A2 constant). This reduces average read latency by ~72% compared to standard 90 ns random reads when accessing sequential firmware instructions or configuration tables, directly improving boot speed and real-time interrupt response in embedded hosts.
How does the Write-Buffer Programming feature work in SST38VF6404-90-5C-B3KE?
SST38VF6404-90-5C-B3KE implements a 16-word Write Buffer that accepts up to 16 words via a Write-to-Buffer command sequence, then programs them collectively to flash with a Program Buffer-to-Flash command. This achieves an effective programming rate of 1.75 µs per word-over 4× faster than single-word programming (7 µs)-reducing firmware update time and system downtime during field upgrades.
What protection mechanisms does SST38VF6404-90-5C-B3KE provide against accidental writes?
SST38VF6404-90-5C-B3KE provides three-tiered protection: (1) hardware WP# pin lock for the top boot block, (2) software-controlled individual 32 KWord block locking using volatile/non-volatile bits, and (3) password-enabled security lock. All mechanisms operate independently and can be combined-for example, WP# can override software locks during power-on, ensuring boot code immunity even if firmware is compromised.
Is SST38VF6404-90-5C-B3KE pin-compatible with other members of the SST38VF64xx family?
Yes, SST38VF6404-90-5C-B3KE shares identical pinout, package (48-ball TFBGA), and electrical interface with SST38VF6401/6402/6403 in the same speed grade and temperature range. However, memory map differences-especially boot-block location (B127 vs B0) and sector-level VPB/NVPB assignment-require firmware and protection logic adaptation; hardware layout remains unchanged.
SST38VF6404-90-5C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST38
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST38VF6404-90-5C-B3KE FAQ
1.How can I place an order for SST38VF6404-90-5C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST38VF6404-90-5C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST38VF6404-90-5C-B3KE reliable?
The price and inventory of SST38VF6404-90-5C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST38VF6404-90-5C-B3KE is usually 5 days.
3.What payment methods are accepted for SST38VF6404-90-5C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST38VF6404-90-5C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST38VF6404-90-5C-B3KE?
SST38VF6404-90-5C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST38VF6404-90-5C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST38VF6404-90-5C-B3KE?
For technical support, including SST38VF6404-90-5C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST38VF6404-90-5C-B3KE requirements.
6.How does Aetrix verify that SST38VF6404-90-5C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST38VF6404-90-5C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST38VF6404-90-5C-B3KE meets industry standards.
7.What is the process for return or replacement of SST38VF6404-90-5C-B3KE?
All SST38VF6404-90-5C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST38VF6404-90-5C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST38VF6404-90-5C-B3KE part is unused and in its original packaging.
Return procedure for SST38VF6404-90-5C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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