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Microchip Technology SST38VF6404B-70-5I-B3KE
- Part No.:
- SST38VF6404B-70-5I-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST38VF6404B-70-5I-B3KE.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,672
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Product details
Overview
SST38VF6404B-70-5I-B3KE from Microchip Technology is a 64 Mbit (4M × 16) Advanced Multi-Purpose Flash Plus memory IC, designed for nonvolatile program/data storage in embedded systems requiring single-supply operation, hardware block protection, and fast page read access. It delivers 70 ns standard read access time, 25 ns page read access, and supports 2.7–3.6 V operation with 100,000 write/erase cycles endurance.
For engineers reviewing the SST38VF6404B-70-5I-B3KE datasheet, SST38VF6404B-70-5I-B3KE pinout, SST38VF6404B-70-5I-B3KE application, or SST38VF6404B-70-5I-B3KE equivalent, key selection considerations include boot-block architecture (4 KWord top/bottom), Write-Buffer Programming (16-word buffer), Erase-Suspend capability, RY/BY# status signaling, and JEDEC-compliant x16 interface timing.
Technical Context
The SST38VF6404B-70-5I-B3KE implements SST's SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. Its command-set architecture uses standard microprocessor write sequences with WE#/CE# latching to initiate Read, Page Read, Word-Program, Write-Buffer Programming, Block-Erase, Chip-Erase, and Erase-Suspend/Resume operations.
It features dual-status detection (DQ6/DQ7 Toggle Bit and Data# Polling), hardware reset (RST#), write protect (WP#), and ready/busy output (RY/BY#). Memory organization includes 128 blocks: 126 uniform 32 KWord blocks plus two 4 KWord boot blocks - one at address A21–A15 = 1111111XXX (B127–B134), where B133 and B134 are protected via WP#.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4M × 16), supporting 256 KByte addressing space |
| Read Access Time | 70 ns max - defines minimum clock period for random read in synchronous bus interfaces |
| Page Read Access | 25 ns per word - enables burst reads of 8 words with 33 ns avg throughput |
| Write Buffer Size | 16-word buffer - reduces effective programming time by batching writes before flash commit |
| Endurance | 100,000 cycles min - guarantees reliable field reprogramming over product lifetime |
| Data Retention | >100 years - ensures long-term firmware/config storage without refresh |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic rails and low-voltage system designs |
| Block Erase Time | 18 ms typical - determines minimum latency for firmware update partition erasure |
Pinout & Package
Package: 48-ball TFBGA (10 mm × 11 mm, 0.8 mm pitch) and 48-lead TSOP (12 mm × 20 mm), both RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 4M-word addressing; A21–A15 select block during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with tri-state outputs controlled by OE# and CE# |
| CE# | Chip Enable | Active-low chip select; device enters standby when high, consuming only 5 µA |
| OE# | Output Enable | Active-low output gate; controls data bus visibility during read operations |
| WE# | Write Enable | Active-low control for latching addresses/data and initiating command sequences |
| WP# | Write Protect | Hardware lock for boot blocks B133/B134 (4 KWord each); grounded to prevent accidental erase/program |
| RST# | Reset | Active-low hardware reset that forces device into Read mode, clearing internal state |
| RY/BY# | Ready/Busy | Open-drain status indicator: low = active erase/program, high = ready for next command |
| VDD | Power Supply | 2.7–3.6 V core supply; powers all logic and flash array operations |
| VSS | Ground | Reference return path for all signals and internal circuitry |
| NC | No Connection | Unbonded pad; must be left floating or tied to VSS per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time read/program of non-erasing blocks during background erase - critical for fail-safe firmware updates |
| Auto Low Power Mode | Reduces active read current from 25 mA to 5 µA after valid access - cuts power in idle polling loops |
| 128-bit Unique ID | Factory-programmed serial number enabling secure device authentication and traceability |
| Security-ID OTP Area | 248-word user one-time-programmable region for keys, certificates, or calibration data |
| CFI Compliance | Supports Common Flash Interface standard - enables auto-detection and driver compatibility across toolchains |
| JEDEC Pinout | Fully compliant with industry-standard x16 parallel flash pin assignments - simplifies PCB reuse and migration |
Applications
| Industrial HMI Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing boot code, GUI assets, and calibration tables in panel-mounted HMIs with frequent field updates. IC Role / Device Role / Timing Role: Nonvolatile x16 parallel flash serving as primary boot ROM and configuration store, interfaced to ARM9 or Cortex-M7 MCU via static bus. Use Value: 70 ns read access enables deterministic boot timing; 4 KWord boot blocks (B133/B134) allow protected bootloader storage while permitting full-array updates. | Use Scenario: Holding FDA-compliant device settings, sensor calibration coefficients, and audit logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, long-retention data storage IC with OTP Security-ID for cryptographic key binding and tamper-evident logging. Use Value: 100-year data retention meets medical device shelf-life requirements; Erase-Suspend allows concurrent log writes during firmware validation. |
| Automotive Infotainment Boot Memory | Networking Equipment Image Storage |
Use Scenario: Hosting boot firmware and recovery images in automotive head units operating across -40°C to +85°C ambient. IC Role / Device Role / Timing Role: AEC-Q100 qualified (per -5I suffix) parallel flash providing robust boot source with hardware WP# lock against ECU corruption. Use Value: 100,000-cycle endurance supports OTA update cycles over 15-year vehicle life; RY/BY# signal enables precise timing of multi-stage boot loaders. | Use Scenario: Storing multiple firmware images (primary, backup, recovery) in enterprise switches/routers requiring zero-downtime upgrades. IC Role / Device Role / Timing Role: High-reliability flash memory used in dual-image boot schemes with hardware block protection isolating recovery partitions. Use Value: Write-Buffer Programming (1.75 µs/word) accelerates image flashing; uniform 32 KWord blocks simplify partition management in U-Boot environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFI010 | 512 Mbit (32M × 16), 110 ns read, 3.0–3.6 V only, no Erase-Suspend | Larger density but slower access; lacks suspend/resume for real-time systems | Select only if >64 Mbit capacity required and Erase-Suspend is unnecessary |
| MX29LV640ETTI-70G | 64 Mbit (4M × 16), 70 ns read, 2.7–3.6 V, no Write Buffer, no 128-bit ID | Same density/voltage but missing 16-word buffer and unique ID - limits secure boot use cases | Acceptable for cost-sensitive legacy designs where security and programming speed are secondary |
Compared with S29GL512S11TFI010 and MX29LV640ETTI-70G, the SST38VF6404B-70-5I-B3KE uniquely combines 70 ns access, 16-word write buffering, Erase-Suspend, and factory-unique ID in a single 64 Mbit package - making it optimal for safety-critical, upgradable, and authenticated embedded systems.
Availability
SST38VF6404B-70-5I-B3KE is available at Aetrix Electronics and suitable for industrial HMI firmware storage, medical device configuration memory, and automotive infotainment boot memory requiring stable component supply, extended temperature support (-40°C to +85°C), and long-term lifecycle assurance.
Supply support for SST38VF6404B-70-5I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontrollers, analog, FPGA, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST38VF6404B-70-5I-B3KE belongs to the Advanced MPF+ Flash family, engineered for embedded systems demanding high reliability, low-power operation, and flexible in-system reprogramming - especially where boot integrity, field-upgradability, and data security are critical.
FAQ
What is the function of the RY/BY# pin on the SST38VF6404B-70-5I-B3KE?
The RY/BY# pin on the SST38VF6404B-70-5I-B3KE is an open-drain ready/busy status indicator. It asserts low during internal Program or Erase operations and returns high when complete. This signal enables precise hardware synchronization of host controller timing, eliminating the need for software polling in time-critical boot sequences. The SST38VF6404B-70-5I-B3KE uses RY/BY# alongside DQ6/DQ7 status bits to provide redundant, deterministic completion detection.
Does the SST38VF6404B-70-5I-B3KE support true 3.3 V-only operation?
Yes, the SST38VF6404B-70-5I-B3KE operates across 2.7–3.6 V, fully covering the 3.3 V ±10% tolerance range (2.97–3.63 V). Its CMOS I/O is compatible with 3.3 V logic families, and all timing parameters-including 70 ns read access and 25 ns page read-are specified at VDD = 3.0 V and 3.3 V. The SST38VF6404B-70-5I-B3KE requires no level-shifting when interfaced to standard 3.3 V microcontrollers or FPGAs.
How does the boot block architecture differ between SST38VF6404B-70-5I-B3KE and SST38VF6401B?
The SST38VF6404B-70-5I-B3KE implements a non-uniform boot block structure with two 4 KWord protected regions at the top of memory (blocks B133 and B134), whereas SST38VF6401B has a single 32 KWord boot block at the bottom (B0). This top-boot configuration allows the SST38VF6404B-70-5I-B3KE to safeguard recovery firmware while enabling full-array updates - a key distinction confirmed in Table 3 of DS25002A.
Can the SST38VF6404B-70-5I-B3KE be used in place of SST38VF6402B without hardware changes?
No - although both are 64 Mbit x16 flash devices, the SST38VF6404B-70-5I-B3KE and SST38VF6402B have incompatible boot block layouts (top vs. bottom) and distinct memory maps. SST38VF6402B protects B127 (32 KWord bottom boot), while SST38VF6404B-70-5I-B3KE protects B133/B134 (4 KWord top boot). Firmware and bootloader addressing must be redesigned; the SST38VF6404B-70-5I-B3KE is not a drop-in replacement.
What is the purpose of the 128-bit Unique ID in the SST38VF6404B-70-5I-B3KE?
The 128-bit Unique ID in the SST38VF6404B-70-5I-B3KE is a factory-laser-programmed, unalterable serial number used for device-level authentication, secure boot binding, and supply chain traceability. It resides in dedicated ROM and is readable via standard command sequences. Unlike user-programmable fields, this ID cannot be overwritten - ensuring persistent identity for the SST38VF6404B-70-5I-B3KE across its entire operational lifetime.
SST38VF6404B-70-5I-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST38
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST38VF6404B-70-5I-B3KE FAQ
1.How can I place an order for SST38VF6404B-70-5I-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST38VF6404B-70-5I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST38VF6404B-70-5I-B3KE reliable?
The price and inventory of SST38VF6404B-70-5I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST38VF6404B-70-5I-B3KE is usually 5 days.
3.What payment methods are accepted for SST38VF6404B-70-5I-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST38VF6404B-70-5I-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST38VF6404B-70-5I-B3KE?
SST38VF6404B-70-5I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST38VF6404B-70-5I-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST38VF6404B-70-5I-B3KE?
For technical support, including SST38VF6404B-70-5I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST38VF6404B-70-5I-B3KE requirements.
6.How does Aetrix verify that SST38VF6404B-70-5I-B3KE is sourced from the original manufacturer or authorized distributors?
All SST38VF6404B-70-5I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST38VF6404B-70-5I-B3KE meets industry standards.
7.What is the process for return or replacement of SST38VF6404B-70-5I-B3KE?
All SST38VF6404B-70-5I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST38VF6404B-70-5I-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST38VF6404B-70-5I-B3KE part is unused and in its original packaging.
Return procedure for SST38VF6404B-70-5I-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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