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Microchip Technology SST38VF6404B-70-5I-B3KE-T
- Part No.:
- SST38VF6404B-70-5I-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST38VF6404B-70-5I-B3KE-T.pdf
- Description:
- IC FLASH 64MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,570
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Product details
Overview
SST38VF6404B-70-5I-B3KE-T from Microchip Technology is a 64 Mbit (4M × 16) Advanced Multi-Purpose Flash Plus memory IC designed for nonvolatile program, configuration, and data storage in embedded systems. It operates from a single 2.7–3.6 V supply, delivers 70 ns read access time, supports 16-word write buffering, and features hardware boot block protection with WP# pin control.
For engineers reviewing the SST38VF6404B-70-5I-B3KE-T datasheet, SST38VF6404B-70-5I-B3KE-T pinout, SST38VF6404B-70-5I-B3KE-T application, or SST38VF6404B-70-5I-B3KE-T equivalent, key selection considerations include its 48-ball TFBGA package, uniform 32 KWord block architecture, erase-suspend/resume capability, and JEDEC-compliant x16 interface for compatibility with legacy and new microcontroller-based designs.
Technical Context
The SST38VF6404B-70-5I-B3KE-T implements SST's proprietary SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. It uses standard JEDEC x16 flash command sets and supports both CE#- and WE#-controlled operations with latched address/data buses.
Its memory map allocates 128 blocks (B0–B127), each 32 KWord, with boot protection applied to B0 (top boot) and B127 (bottom boot) - though B127 is subdivided into eight 4 KWord sub-blocks in SST38VF6404B. The device supports Page Read (25 ns/page, 8-word buffer), Write-Buffer Programming (1.75 µs/word), and Auto Low Power mode (5 µA standby).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mbit (4M × 16 organization), providing 8 MB of nonvolatile storage space |
| Read Access Time | 70 ns (max), enabling direct interface with 14 MHz bus systems without wait states |
| Page Read Speed | 25 ns per word (8-word page), reducing sequential read latency in firmware update or code execution scenarios |
| Write Buffer Size | 16-word buffer, allowing burst programming of up to 16 words with one command sequence |
| Endurance | 100,000 program/erase cycles minimum, supporting field firmware updates over product lifetime |
| Data Retention | Greater than 100 years at +25°C, ensuring long-term reliability in unpowered storage applications |
| Supply Voltage | 2.7–3.6 V single supply, compatible with modern low-voltage embedded power rails |
Pinout & Package
Package: 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA), RoHS-compliant, 6 mm × 8 mm footprint, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus selecting 4M × 16 locations; A21–A15 define block address during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; tri-stated when CE# or OE# high; latched internally during write |
| CE# | Chip Enable | Active-low chip select; device enters standby (5 µA) when high; required low for all operations |
| OE# | Output Enable | Active-low output gate; controls data bus drive; high = high-impedance state |
| WE# | Write Enable | Active-low control for write cycles; latches address/data edges and initiates internal timing |
| WP# | Write Protect | Hardware boot block lock; grounded to protect top/bottom boot sectors (B0/B127) from accidental erase/program |
| RST# | Reset | Active-low hardware reset; returns device to read mode and clears abort states (e.g., DQ1) |
| RY/BY# | Ready/Busy | Open-drain status indicator; low = active program/erase; used for polling-free operation coordination |
| VDD | Power Supply | 2.7–3.6 V core supply; powers logic and memory array; decoupling required per JEDEC guidelines |
| VSS | Ground | Reference return path for all signals and power; two dedicated pins for noise reduction |
| NC | No Connection | Unbonded ball; must be left floating or connected to ground per PCB layout best practices |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows interruption of block erase to read/program other blocks - critical for real-time firmware patching without halting system operation |
| 128-bit Unique ID | Factory-programmed serial number enabling secure device authentication and anti-cloning in production firmware |
| Security-ID OTP Area | 248-word user one-time-programmable region for storing keys, calibration data, or license tokens |
| Auto Low Power Mode | Automatically transitions to 5 µA standby after valid read access - eliminates need for software-controlled power management |
| JEDEC & CFI Compliance | Ensures interoperability with standard flash controllers, BIOS/UEFI firmware, and automated programming tools |
Applications
| Industrial HMI Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing GUI assets, localization strings, and firmware binaries in panel-mounted HMIs with frequent field updates. IC Role / Device Role / Timing Role: Nonvolatile code and data storage with fast page reads for UI rendering and write-buffered updates via CAN or USB. Use Value: 25 ns page read enables responsive UI refresh; 100K endurance supports >10 years of quarterly firmware patches. |
Use Scenario: Holding calibrated sensor parameters, device serial logs, and regulatory-compliant configuration profiles in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, long-retention configuration store with OTP Security-ID for audit-trail integrity and tamper resistance. Use Value: >100-year data retention ensures log validity across device lifecycle; WP#-enabled boot protection prevents corruption of FDA-mandated startup routines. |
| Telecom Baseband Processor Boot ROM | Automotive Infotainment System Code Storage |
Use Scenario: Hosting boot loader and DSP firmware for LTE/5G baseband processors requiring deterministic cold-start timing. IC Role / Device Role / Timing Role: Primary boot memory mapped to processor address space; accessed via x16 parallel interface with 70 ns access guarantee. Use Value: Fixed 70 ns read time eliminates timing margin uncertainty; uniform 32 KWord blocks simplify bootloader partitioning and OTA update validation. |
Use Scenario: Storing navigation maps, voice recognition models, and UI assets in head-unit ECUs subject to automotive temperature and vibration requirements. IC Role / Device Role / Timing Role: High-reliability code/data storage operating across –40°C to +85°C with hardware write protection against ECU reset glitches. Use Value: 100K-cycle endurance withstands repeated map updates; RST# and WP# pins enable fail-safe recovery from brown-out events during firmware flashing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF6402B-70-5I-B3KE | Same density and voltage range but uniform 32 KWord block architecture (no boot block subdivision); lacks B127 4 KWord sub-block support | Preferred for designs requiring symmetric block layout and simpler erase management across full array | Select if boot block granularity is not required and legacy SST39VF compatibility is prioritized |
| MX29LV640ETTI-70G | 64 Mbit x16, 70 ns access, but uses standard AMD/Fujitsu command set; no Write-Buffer Programming or Erase-Suspend | Suitable for cost-sensitive industrial controllers where advanced features are unused and JEDEC compliance is secondary | Choose only when migrating from existing MX29LV designs; verify command set compatibility before integration |
Compared with SST38VF6404B-70-5I-B3KE-T, SST39VF6402B offers identical timing and endurance but simplified block structure, while MX29LV640ETTI-70G trades advanced features for broader ecosystem support - making SST38VF6404B-70-5I-B3KE-T optimal for new designs needing boot flexibility and real-time erase interruption.
Availability
SST38VF6404B-70-5I-B3KE-T is available at Aetrix Electronics and suitable for industrial HMI firmware storage, medical device configuration memory, telecom baseband boot ROM, and automotive infotainment system code storage requiring stable component supply across extended product lifecycles.
Supply support for SST38VF6404B-70-5I-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST38VF6404B-70-5I-B3KE-T belongs to the Advanced Multi-Purpose Flash Plus (MPF+) family, engineered for embedded systems demanding high reliability, low-power operation, and flexible in-field firmware update capabilities.
FAQ
What is the package type and pin count of the SST38VF6404B-70-5I-B3KE-T?
The SST38VF6404B-70-5I-B3KE-T uses a 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package with a 6 mm × 8 mm body and 0.8 mm ball pitch. It is RoHS-compliant and designed for surface-mount assembly in space-constrained embedded applications. This package matches the pinout defined in Figure 3 of DS25002A and supports standard reflow profiles for lead-free soldering.
Does the SST38VF6404B-70-5I-B3KE-T support hardware write protection for boot sectors?
Yes, the SST38VF6404B-70-5I-B3KE-T supports hardware boot block protection via the WP# pin. When WP# is grounded, it locks both the top boot block (B0) and bottom boot block (B127) against accidental erase or program operations. This feature is critical for safeguarding bootloader code in safety-critical or field-updatable systems.
How does the Write-Buffer Programming feature improve efficiency in the SST38VF6404B-70-5I-B3KE-T?
The SST38VF6404B-70-5I-B3KE-T supports 16-word Write-Buffer Programming, reducing effective word-program time to 1.75 µs per word - over 4× faster than standard 7 µs word programming. This accelerates firmware updates and configuration writes, especially when modifying contiguous memory regions in embedded applications.
What is the difference between SST38VF6404B-70-5I-B3KE-T and SST38VF6403B-70-5I-B3KE-T?
The SST38VF6404B-70-5I-B3KE-T implements bottom-boot architecture with B127 subdivided into eight 4 KWord sub-blocks for granular protection, whereas SST38VF6403B-70-5I-B3KE-T uses top-boot architecture with B0 similarly subdivided. Both share identical timing, voltage, and feature sets - the distinction lies solely in boot block location and memory map layout.
Can the SST38VF6404B-70-5I-B3KE-T operate reliably across industrial temperature ranges?
Yes, the SST38VF6404B-70-5I-B3KE-T is rated for operation from –40°C to +85°C (industrial grade, denoted by 'I' in the part number). Its SuperFlash technology maintains consistent 70 ns read access time and 100,000-cycle endurance across this full range, validated per AEC-Q100 stress testing protocols for automotive-adjacent applications.
SST38VF6404B-70-5I-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST38
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST38VF6404B-70-5I-B3KE-T FAQ
1.How can I place an order for SST38VF6404B-70-5I-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST38VF6404B-70-5I-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST38VF6404B-70-5I-B3KE-T reliable?
The price and inventory of SST38VF6404B-70-5I-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST38VF6404B-70-5I-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST38VF6404B-70-5I-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST38VF6404B-70-5I-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST38VF6404B-70-5I-B3KE-T?
SST38VF6404B-70-5I-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST38VF6404B-70-5I-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST38VF6404B-70-5I-B3KE-T?
For technical support, including SST38VF6404B-70-5I-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST38VF6404B-70-5I-B3KE-T requirements.
6.How does Aetrix verify that SST38VF6404B-70-5I-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST38VF6404B-70-5I-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST38VF6404B-70-5I-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST38VF6404B-70-5I-B3KE-T?
All SST38VF6404B-70-5I-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST38VF6404B-70-5I-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST38VF6404B-70-5I-B3KE-T part is unused and in its original packaging.
Return procedure for SST38VF6404B-70-5I-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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