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Microchip Technology SST39LF020-45-4C-B3KE-T
- Part No.:
- SST39LF020-45-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39LF020-45-4C-B3KE-T.pdf
- Description:
- IC FLASH 2MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,835
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Product details
Overview
SST39LF020-45-4C-B3KE-T from Microchip Technology is a 2 Mbit (256K × 8) single-supply CMOS Multi-Purpose Flash memory IC with 45 ns read access time, 3.0–3.6 V operating voltage, and uniform 4 KB sector-erase architecture. It serves as nonvolatile program/data storage in embedded microcontroller systems requiring field-upgradable firmware and configuration data.
For engineers reviewing the SST39LF020-45-4C-B3KE-T datasheet, SST39LF020-45-4C-B3KE-T pinout, SST39LF020-45-4C-B3KE-T application, or SST39LF020-45-4C-B3KE-T equivalent, key selection criteria include JEDEC-standard x8 parallel interface compatibility, SuperFlash® technology endurance (100,000 cycles), 100-year data retention, and support for software data protection command sequences.
Technical Context
This device implements SST's proprietary SuperFlash® split-gate cell architecture with thick-oxide tunneling injector, enabling fixed erase/program timing independent of cycle count. It uses standard microprocessor bus control signals (CE#, OE#, WE#) and latched address/data I/Os compliant with JEDEC pinouts for x8 memories.
Write operations require a six-byte software command sequence for sector or chip erase, and a three-byte sequence for byte-program; status detection relies on DQ7 (Data# Polling) and DQ6 (Toggle Bit), with no external VPP required due to internal charge pump generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2 Mbit (256K × 8) - supports full firmware image storage for mid-complexity 8/16-bit MCUs. |
| Read Access Time | 45 ns - enables direct execution from flash (XIP) at up to ~14 MHz system bus frequency. |
| Supply Voltage | 3.0–3.6 V - compatible with 3.3 V logic systems without level-shifting. |
| Endurance | 100,000 program/erase cycles - sufficient for frequent field updates over product lifetime. |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications. |
| Byte-Program Time | 14 µs typical - reduces firmware patch latency during in-system programming. |
| Sector Size | 4 KB uniform sectors - allows granular update of bootloader, parameter tables, or application modules. |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm, ball pitch 0.8 mm), RoHS-compliant, intended for high-density PCB layouts with thermal and space constraints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 used for 256K addressing; A17 selects upper half of 512K space (reserved for future compatibility). |
| DQ0–DQ7 | Data I/O | Bidirectional x8 data bus; tri-stated when CE# or OE# high; DQ6/DQ7 provide write status feedback. |
| CE# | Chip Enable | Active-low chip select; must be low for any operation except standby mode. |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read; high = high-impedance. |
| WE# | Write Enable | Active-low write control; initiates latching of address/data and triggers internal program/erase. |
| VDD | Power Supply | 3.0–3.6 V supply; powers core logic and internal charge pump for erase/program. |
| VSS | Ground | Reference ground for all I/O and internal circuitry; requires low-impedance PCB connection. |
| NC (Balls A1, C1, D1, E1, F1, G1, H1, J1) | No Connection | Unbonded pads; must remain unconnected per datasheet to avoid functional interference. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with fixed 18 ms sector-erase and 70 ms chip-erase times - eliminates software de-rating over lifetime. |
| Software Data Protection | JEDEC-standard 3-byte (program) and 6-byte (erase) command sequences - prevents accidental writes during power transitions. |
| Hardware Write Inhibit | Glitch immunity (<5 ns), VDD lockout (<1.5 V), and OE#/CE#/WE# gating - ensures robustness in noisy industrial environments. |
| Low Power Standby | 1 µA typical current - enables battery-backed systems to retain memory state for years. |
| CMOS I/O Compatibility | VIH = 0.7×VDD, VOL = 0.2 V - interoperable with standard 3.3 V microcontrollers without level shifters. |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing firmware images and calibration tables in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Nonvolatile code storage with in-field update capability via RS-485 or Ethernet bootloader. Use Value: 45 ns read access enables real-time deterministic scan-cycle execution; 100,000-cycle endurance supports quarterly firmware patches over 10+ year service life. | Use Scenario: Holding patient-specific therapy parameters and device serialization data in portable infusion pumps. IC Role / Device Role / Timing Role: Secure, long-retention configuration memory accessed only during power-on initialization and user setup. Use Value: >100-year data retention meets ISO 13485 requirements; software/hardware write protection prevents corruption during ESD events or brownout conditions. |
| Automotive Body Control Module | Networking Equipment Bootloader Storage |
Use Scenario: Storing lighting control logic and CAN message routing tables in automotive BCMs. IC Role / Device Role / Timing Role: Parallel-interface flash memory mapped into MCU address space for fast boot and runtime reads. Use Value: 3.0–3.6 V operation aligns with automotive 3.3 V rail; uniform 4 KB sectors allow safe over-the-air (OTA) updates of individual subsystems. | Use Scenario: Hosting primary bootloader and fail-safe recovery image in enterprise switches and routers. IC Role / Device Role / Timing Role: XIP-capable boot memory accessed directly by ARM Cortex-A series processors during cold start. Use Value: 45 ns access time reduces boot latency below 100 ms; chip-erase time of 70 ms enables rapid recovery from corrupted firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT29LV020-15 | 150 ns read access; 2.7–3.6 V; 10,000-cycle endurance; PLCC-32 only | Slower timing limits XIP use; lower endurance restricts frequent updates | Select when legacy PLCC footprint is mandatory and update frequency is low. |
| S29AL002DT | 70 ns read; 2.7–3.6 V; 100,000-cycle endurance; supports CFI query | Lacks SuperFlash® fixed timing; requires CFI-aware bootloader integration | Choose for CFI-compliant systems needing vendor-agnostic flash management. |
Compared with AT29LV020-15 and S29AL002DT, SST39LF020-45-4C-B3KE-T delivers faster 45 ns read performance, guaranteed SuperFlash® timing stability across lifetime, and native TFBGA packaging for space-constrained designs - making it optimal for high-reliability, update-intensive embedded applications.
Availability
SST39LF020-45-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and automotive body control module applications requiring stable component supply and long-term lifecycle support.
Supply support for SST39LF020-45-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39LF/VF series was designed specifically for cost-sensitive, high-reliability embedded systems requiring field-upgradable firmware and configuration data with minimal external circuitry.
FAQ
What is the maximum operating frequency supported by SST39LF020-45-4C-B3KE-T?
The SST39LF020-45-4C-B3KE-T does not specify a maximum clock frequency but defines timing via access times: 45 ns read cycle time (TRC) implies reliable operation at bus frequencies up to approximately 14 MHz. System timing must comply with all AC parameters in Table 12, including CE# and OE# setup/hold requirements. SST39LF020-45-4C-B3KE-T is not a synchronous device and relies on asynchronous control signals.
Does SST39LF020-45-4C-B3KE-T require an external VPP voltage for programming?
No, SST39LF020-45-4C-B3KE-T integrates an internal charge pump that generates the high voltage needed for erase and program operations. Only a single 3.0–3.6 V supply (VDD) is required - eliminating external VPP circuitry and simplifying board design. This feature is inherent to SST's SuperFlash® technology and applies to all SST39LF020-45-4C-B3KE-T operations.
How is software data protection enabled on SST39LF020-45-4C-B3KE-T?
Software Data Protection (SDP) is permanently enabled at shipment. To perform byte-program or sector-erase, the host must issue precise JEDEC-compliant command sequences: a three-byte sequence (5555H/AAH, 2AAAH/55H, 5555H/A0H) for programming and a six-byte sequence for erasing. Any invalid command aborts the operation and returns SST39LF020-45-4C-B3KE-T to read mode within TRC.
What package type is used for SST39LF020-45-4C-B3KE-T?
SST39LF020-45-4C-B3KE-T uses a 48-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package measuring 6 mm × 8 mm with 0.8 mm ball pitch. This RoHS-compliant package supports high-density PCB layouts and provides thermal performance suitable for industrial temperature ranges (0°C to +70°C).
Can SST39LF020-45-4C-B3KE-T be used in place of SST39LF020-45-4C-NHE-T?
No - SST39LF020-45-4C-B3KE-T (TFBGA) and SST39LF020-45-4C-NHE-T (TSOP) are not pin-compatible. They share identical electrical specifications and command sets but differ in physical package, pinout, and solder reflow profiles. Direct substitution requires PCB redesign. SST39LF020-45-4C-B3KE-T is not a drop-in replacement for TSOP variants; always verify mechanical and thermal constraints before integration.
SST39LF020-45-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 2Mbit
- Memory Organization:
- 256K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 45 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39LF020-45-4C-B3KE-T FAQ
1.How can I place an order for SST39LF020-45-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF020-45-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF020-45-4C-B3KE-T reliable?
The price and inventory of SST39LF020-45-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF020-45-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39LF020-45-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF020-45-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF020-45-4C-B3KE-T?
SST39LF020-45-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF020-45-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF020-45-4C-B3KE-T?
For technical support, including SST39LF020-45-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF020-45-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39LF020-45-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39LF020-45-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF020-45-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39LF020-45-4C-B3KE-T?
All SST39LF020-45-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF020-45-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF020-45-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39LF020-45-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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