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Microchip Technology SST39LF200A-55-4C-EKE

Part No.:
SST39LF200A-55-4C-EKE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixSST39LF200A-55-4C-EKE.pdf
Description:
IC FLASH 2MBIT PARALLEL 48TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:359

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Product details

Overview

SST39LF200A-55-4C-EKE from Microchip Technology is a 2 Mbit (128K × 16) CMOS Multi-Purpose Flash memory IC using SuperFlash technology, operating at 3.0–3.6 V with 55 ns read access time, 100,000 program/erase cycles endurance, and >100 years data retention. It serves as nonvolatile program/data storage in embedded microcontroller systems requiring field-upgradable firmware.

For engineers reviewing the SST39LF200A-55-4C-EKE datasheet, SST39LF200A-55-4C-EKE pinout, SST39LF200A-55-4C-EKE application, or SST39LF200A-55-4C-EKE equivalent, key selection criteria include x16 asynchronous interface timing, JEDEC-standard flash command set compatibility, sector/block erase granularity, hardware/software write protection, and TSOP-48 package suitability for space-constrained PCB layouts.

Technical Context

The SST39LF200A-55-4C-EKE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed 14 µs word-program and 18 ms sector/block-erase times independent of cycle count. Its control logic supports standard JEDEC x16 flash command sequences including Software Data Protection (SDP) with three-byte unlock for programming and six-byte unlock for erasure.

It features dual status detection-Data# Polling (DQ7) and Toggle Bit (DQ6)-for end-of-write verification, and integrates noise/glitch protection, VDD power-up/down detection, and write-inhibit mode via CE#/OE#/WE# logic states to prevent inadvertent writes during power transitions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density2 Mbit (128K × 16), providing 256 KB of nonvolatile storage for boot code or configuration data
Read Access Time55 ns max - enables direct execution from flash (XIP) in 14 MHz bus systems without wait states
Supply Voltage3.0–3.6 V - compatible with 3.3 V logic rails and eliminates need for separate VPP programming voltage
Endurance100,000 program/erase cycles - supports frequent firmware updates in industrial controllers
Data Retention>100 years - ensures long-term reliability in unattended equipment like metering or remote sensors
Erase GranularityUniform 2 KWord sectors (4 KB) and 32 KWord blocks (64 KB) - allows selective update of application modules without full chip erase
Write TimingInternal VPP generation + automatic timing - removes external high-voltage circuitry and simplifies system design

Pinout & Package

Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, surface-mountable with standard reflow profile (260°C for 10 s).

Pin/TerminalCircuit RoleDesign Meaning
A0–A15Address Inputs16-bit address bus; A16 used as AMS (most significant address) for sector/block selection
DQ0–DQ15Data I/Ox16 bidirectional data bus with internal latching; tri-stated when CE# or OE# high
CE#Chip EnableActive-low device select; disables outputs and reduces current to 3 µA standby when high
OE#Output EnableActive-low output gate; controls data bus visibility without affecting internal state
WE#Write EnableActive-low write control; initiates command latching and internal program/erase operations
VDDPower Supply3.0–3.6 V core supply; powers all logic and memory array
VSSGroundTwo dedicated ground pins (pins 23 and 48) reduce noise coupling and improve signal integrity
NCNo ConnectionPins 9, 10, 12–15, 18, 20, 21, 22, 24, 25, 26, 27, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47 - must remain unconnected

Key Features

FeatureDesign Value
SuperFlash TechnologySplit-gate cell with thick-oxide injector delivers stable 14 µs program and 18 ms erase times across full lifecycle
JEDEC x16 Pinout & Command SetDirect drop-in replacement for legacy parallel NOR flash in existing socketed designs without layout changes
Hardware + Software Write ProtectionGlitch immunity, VDD monitoring, and mandatory 3-byte SDP unlock prevent corruption during power transients
Common Flash Interface (CFI)Enables automatic detection of geometry, timing, and command set by host bootloader or flash programmer
Low Power Operation9 mA active current and 3 µA standby current support battery-backed or energy-harvesting applications

Applications

Industrial PLC Firmware StorageMedical Device Configuration Memory

Use Scenario: Storing ladder logic programs and I/O mapping tables in programmable logic controllers subject to frequent field updates.

IC Role / Device Role / Timing Role: Nonvolatile x16 parallel flash acting as primary boot and application code storage, interfaced directly to ARM Cortex-M4 MCU address/data bus.

Use Value: 55 ns read access enables zero-wait-state XIP execution; sector erase allows updating individual function modules without interrupting controller runtime.

Use Scenario: Holding calibration coefficients, patient history logs, and regulatory compliance settings in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Secure configuration memory with hardware write inhibit during power-up, ensuring settings persist through battery swaps or brownouts.

Use Value: >100-year data retention meets FDA 21 CFR Part 11 long-term recordkeeping requirements; 100,000-cycle endurance supports daily recalibration over 27 years.

Automotive Infotainment BootloaderNetworking Equipment FPGA Bitstream Storage

Use Scenario: Hosting secure bootloader and recovery image in automotive head units requiring AEC-Q100-compliant components.

IC Role / Device Role / Timing Role: Dual-image flash partitioned into primary and backup banks, managed via software-controlled sector erase and word-program.

Use Value: Fixed 14 µs program time guarantees deterministic firmware patching latency; CFI query enables auto-negotiation of timing parameters across temperature ranges.

Use Scenario: Storing FPGA configuration bitstreams in enterprise switches where field upgrades must avoid system downtime.

IC Role / Device Role / Timing Role: Parallel NOR flash mapped to FPGA configuration interface, supporting fast parallel loading at power-on and in-system reconfiguration.

Use Value: 64 KB uniform block erase enables rapid partial reconfiguration of FPGA logic sections; JEDEC compatibility ensures interoperability with Xilinx/Intel configuration tools.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SST39VF200A-70-4C-EKE2.7–3.6 V operation, 70 ns read access, identical density and pinoutLower voltage range supports battery-powered devices; slower access limits XIP in high-speed MCUsSelect when system VDD may dip below 3.0 V or when 70 ns timing satisfies bus timing budget
MX29LV200CTTI-70G3.0–3.6 V, 70 ns access, 2 Mbit x16, supports CFI but uses different command sequenceRequires firmware adaptation for unlock/erase commands; lacks SuperFlash's fixed timing stabilityChoose for cost-sensitive designs where minor software changes are acceptable and long-term timing drift is not critical

Compared with SST39VF200A-70-4C-EKE and MX29LV200CTTI-70G, the SST39LF200A-55-4C-EKE provides faster 55 ns read performance and guaranteed fixed erase/program timing across its full endurance life-critical for real-time firmware update validation in safety-critical systems.

Availability

SST39LF200A-55-4C-EKE is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and automotive infotainment systems requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for SST39LF200A-55-4C-EKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global provider of microcontrollers, analog, FPGA, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.

The SST39LF/VF series was designed specifically for embedded systems needing reliable, low-power, field-upgradable parallel NOR flash with JEDEC compatibility and robust data protection-targeting industrial, medical, and automotive applications.

FAQ

What is the maximum operating frequency supported by SST39LF200A-55-4C-EKE?

The SST39LF200A-55-4C-EKE does not operate at a clock frequency-it is an asynchronous parallel flash memory. Its 55 ns read access time corresponds to a maximum effective bus speed of approximately 14 MHz (1/55 ns ≈ 18.2 MHz, derated for setup/hold). System timing must comply with AC specifications in Table 10, including 5 ns input rise/fall times and 30 pF load capacitance.

Does SST39LF200A-55-4C-EKE require an external VPP voltage for programming?

No, the SST39LF200A-55-4C-EKE does not require an external VPP voltage. It generates the necessary high-voltage programming pulses internally using its 3.0–3.6 V VDD supply. This eliminates the need for external charge pumps or high-voltage regulators, simplifying board design and reducing component count compared to older flash technologies.

How many erase sectors does SST39LF200A-55-4C-EKE have, and what is their size?

The SST39LF200A-55-4C-EKE contains 64 uniform erase sectors, each 2 KWords (4 KB) in size. This is confirmed by Table 7, where sector information shows y = 63 (003FH), so y + 1 = 64 sectors, and z = 16 (0010H), meaning z × 256 B = 4 KB per sector. Sector erase enables granular firmware updates without disturbing unrelated code or data regions.

Is SST39LF200A-55-4C-EKE compatible with standard JEDEC x16 flash controllers?

Yes, the SST39LF200A-55-4C-EKE conforms fully to JEDEC standard pinouts and command sets for x16 parallel flash memories. It supports standard Read, Word-Program, Sector-Erase, Block-Erase, Chip-Erase, and Software ID commands-including the mandatory three-byte unlock sequence-ensuring seamless integration with existing JEDEC-compliant flash controllers and bootloaders.

What package type is used for SST39LF200A-55-4C-EKE, and are there footprint-compatible alternatives?

The SST39LF200A-55-4C-EKE uses a 48-lead TSOP (Thin Small Outline Package) measuring 12 mm × 20 mm. Microchip also offers pin-compatible 48-ball TFBGA and WFBGA variants (e.g., SST39LF200A-55-4C-B3E), allowing migration to smaller footprints without redesigning the core interface logic-though PCB layout and thermal management must be validated per package.

SST39LF200A-55-4C-EKE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
2Mbit
Memory Organization:
128K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
20µs
Access Time:
55 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSOP

SST39LF200A-55-4C-EKE FAQ

1.How can I place an order for SST39LF200A-55-4C-EKE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39LF200A-55-4C-EKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39LF200A-55-4C-EKE reliable?

The price and inventory of SST39LF200A-55-4C-EKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF200A-55-4C-EKE is usually 5 days.

3.What payment methods are accepted for SST39LF200A-55-4C-EKE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF200A-55-4C-EKE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39LF200A-55-4C-EKE?

SST39LF200A-55-4C-EKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39LF200A-55-4C-EKE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39LF200A-55-4C-EKE?

For technical support, including SST39LF200A-55-4C-EKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF200A-55-4C-EKE requirements.

6.How does Aetrix verify that SST39LF200A-55-4C-EKE is sourced from the original manufacturer or authorized distributors?

All SST39LF200A-55-4C-EKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF200A-55-4C-EKE meets industry standards.

7.What is the process for return or replacement of SST39LF200A-55-4C-EKE?

All SST39LF200A-55-4C-EKE units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF200A-55-4C-EKE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39LF200A-55-4C-EKE part is unused and in its original packaging.

Return procedure for SST39LF200A-55-4C-EKE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39LF200A-55-4C-EKE Tags

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