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Microchip Technology SST39LF400A-55-4C-B3KE
- Part No.:
- SST39LF400A-55-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39LF400A-55-4C-B3KE.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,224
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Product details
Overview
SST39LF400A-55-4C-B3KE from Microchip Technology is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash memory IC using SuperFlash technology, designed for embedded program/data storage in microcontroller-based systems. It operates at 3.0–3.6 V, delivers 55 ns read access time, supports sector/block erase (2 KWord/32 KWord), and features hardware/software data protection. It is commonly used in industrial control firmware updates and boot code storage.
For engineers reviewing the SST39LF400A-55-4C-B3KE datasheet, SST39LF400A-55-4C-B3KE pinout, SST39LF400A-55-4C-B3KE application, or SST39LF400A-55-4C-B3KE equivalent, this page provides verified functional specifications, JEDEC-compliant x16 asynchronous interface details, SuperFlash endurance metrics, and validated alternative flash parts for firmware storage migration.
Technical Context
The SST39LF400A-55-4C-B3KE implements a split-gate SuperFlash cell architecture with thick-oxide tunneling injector, enabling fixed 14 µs word-program and 18 ms sector/block-erase times independent of cycle count. Its command-set follows JEDEC-standard x16 flash protocols, including Software Data Protection (SDP) with six-byte erase sequences and toggle-bit/data# polling for write completion detection.
It supports uniform 2 KWord sectors (128 total) and 32 KWord blocks (8 total), with address decoding up to A17 (256K × 16 = 4 Mbit). The device uses latched address/data buses and requires no external VPP - internal charge pump generates programming voltage during write operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16 organization), directly maps to 512 KB byte-addressable space in x16 mode |
| Read Access Time | 55 ns - enables direct execution from flash (XIP) in 14 MHz bus systems without wait states |
| Supply Voltage | 3.0–3.6 V - single-supply operation compatible with 3.3 V logic rails and eliminates level-shifting needs |
| Endurance | 100,000 program/erase cycles - supports frequent field firmware updates over product lifetime |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage for critical configuration data |
| Power Consumption | 9 mA active / 3 µA standby - reduces system-level power budget in battery-backed or low-power modes |
| Erase Granularity | Sector (2 KWord) and block (32 KWord) - enables selective firmware patching without full chip erase |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, standard JEDEC x16 flash footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 used for 256K × 16 addressing; A17 selects upper half of 4 Mbit array (SST39LF400A-specific) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; outputs tri-stated when CE# or OE# high; latched on WE#/CE# edges during writes |
| CE# | Chip Enable | Active-low global enable - device enters standby (3 µA) when high; required low for all operations |
| OE# | Output Enable | Active-low output gate - controls data bus drive; high impedance when high, even if CE# is low |
| WE# | Write Enable | Active-low control for write cycles; latches command/address/data per JEDEC timing; initiates internal program/erase |
| VDD | Power Supply | 3.0–3.6 V supply; powers core logic and internal charge pump - no external VPP required |
| VSS | Ground | Two dedicated ground pins (pins 23 and 48) - reduce noise coupling during high-speed reads/writes |
| NC | No Connect | Pins 9, 10, 12–15, 18, 20, 21, 22, 24, 25, 26, 27, 29, 30, 31, 32, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47 - electrically isolated, must be left floating |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide injector - delivers stable 14 µs program and 18 ms erase times across full lifecycle |
| JEDEC x16 Command Set | Fully compliant with industry-standard flash protocols - enables drop-in replacement in existing x16 memory designs |
| Hardware + Software Protection | Glitch filtering (<5 ns), VDD lockout (<1.5 V), and mandatory 6-byte SDP erase sequence - prevents accidental firmware corruption |
| CFI & Product ID Support | Standard CFI query mode (98H command) and software ID entry (90H) - allows runtime identification and auto-configuration |
| Uniform Erase Architecture | 128 × 2 KWord sectors + 8 × 32 KWord blocks - supports modular firmware updates and wear leveling in host firmware |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with field serviceability requirements. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to MCU address space; accessed via parallel x16 bus with 55 ns read latency. Use Value: 100,000-cycle endurance enables quarterly firmware patches over 10+ years; sector erase avoids full reflash downtime. |
Use Scenario: Holding certified boot loader and safety-critical initialization code in FDA-regulated diagnostic equipment. IC Role / Device Role / Timing Role: Primary boot ROM executed at power-on reset; verified via checksum before loading application firmware. Use Value: >100-year data retention ensures integrity across device shelf life; hardware write inhibit prevents corruption during brown-out events. |
| Automotive Telematics Module | Networking Equipment Configuration |
Use Scenario: Storing OTA-updatable communication stack and vehicle ID parameters in CAN/LIN gateway modules. IC Role / Device Role / Timing Role: Dual-purpose memory for both executable code and runtime-configurable NVM variables. Use Value: Block-erase capability (32 KWord) allows atomic update of radio stack without disrupting CAN message buffers. |
Use Scenario: Maintaining persistent switch/router configuration, MAC tables, and security certificates in enterprise networking gear. IC Role / Device Role / Timing Role: Configuration EEPROM replacement with faster write performance and higher density. Use Value: 3 µA standby current extends uptime during power-loss events; software ID commands enable multi-vendor BOM flexibility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF400A-70-4C-B3KE | Wider VDD range (2.7–3.6 V); slower 70 ns read access; identical 4 Mbit density and pinout | Better suited for mixed-voltage systems with 2.7 V minimum supply; not suitable where 55 ns timing is required | Select when operating below 3.0 V or when lower cost justifies 15 ns timing penalty |
| MX29LV400CTTI-70G | 3.0–3.6 V supply; 70 ns access; 4 Mbit (256K × 16); supports CFI but uses different SDP command sequence | Requires firmware driver modification for erase/write commands; lacks toggle-bit polling (uses only data# polling) | Choose for legacy MXIC ecosystem compatibility; verify bootloader rewrite for command set differences |
Compared with SST39VF400A-70-4C-B3KE and MX29LV400CTTI-70G, the SST39LF400A-55-4C-B3KE offers the fastest read access and guaranteed SuperFlash timing stability, making it optimal for real-time boot and deterministic firmware execution - while the alternatives trade speed for voltage flexibility or vendor continuity.
Availability
SST39LF400A-55-4C-B3KE is available at Aetrix Electronics and suitable for industrial control firmware storage, medical device boot code retention, and automotive telematics module updates requiring stable component supply and long-term obsolescence support.
Supply support for SST39LF400A-55-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016 and now manufactures and supports the SST39LF/VF family as part of its broad flash memory portfolio.
The SST39LF400A-55-4C-B3KE belongs to the SST39LF/VF Multi-Purpose Flash product line, engineered for reliable, low-power, high-endurance firmware and configuration storage in resource-constrained embedded systems.
FAQ
What is the memory organization of the SST39LF400A-55-4C-B3KE?
The SST39LF400A-55-4C-B3KE is organized as 256K × 16, delivering 4 Mbit (512 KB) of storage in x16 parallel interface mode. Address lines A0–A17 decode the full space, with A17 being active for the SST39LF400A variant. This structure supports direct 16-bit bus interfacing with microcontrollers and DSPs without data-width conversion logic.
Does the SST39LF400A-55-4C-B3KE require an external VPP voltage?
No, the SST39LF400A-55-4C-B3KE does not require an external VPP voltage. It integrates an internal charge pump that generates the high voltage needed for programming and erasing operations from the standard 3.0–3.6 V VDD supply. This simplifies board design by eliminating VPP routing and associated decoupling components.
How is write completion detected on the SST39LF400A-55-4C-B3KE?
The SST39LF400A-55-4C-B3KE supports two hardware-supported methods: Data# Polling (DQ7) and Toggle Bit (DQ6). During program/erase, DQ7 returns complemented data until completion, then true data; DQ6 toggles between 0 and 1 until the operation finishes, then holds steady. Both are valid after the fourth (program) or sixth (erase) WE# pulse rising edge.
What package type is used for the SST39LF400A-55-4C-B3KE?
The SST39LF400A-55-4C-B3KE is supplied in a 48-lead TSOP (Thin Small Outline Package), measuring 12 mm × 20 mm, with standard JEDEC pinout for x16 flash devices. This package is surface-mount compatible, reflow-solderable at 260°C, and RoHS-compliant - matching footprint requirements of legacy and new industrial PCB designs.
Is the SST39LF400A-55-4C-B3KE compatible with JEDEC-standard flash command sets?
Yes, the SST39LF400A-55-4C-B3KE fully complies with JEDEC Standard JESD21-C for x16 flash memories. It implements the standard six-byte sector/block/erase command sequences, three-byte program initiation, and CFI query protocol (98H command), ensuring interoperability with generic flash drivers and memory testers.
SST39LF400A-55-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39LF400A-55-4C-B3KE FAQ
1.How can I place an order for SST39LF400A-55-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF400A-55-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF400A-55-4C-B3KE reliable?
The price and inventory of SST39LF400A-55-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF400A-55-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39LF400A-55-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF400A-55-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF400A-55-4C-B3KE?
SST39LF400A-55-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF400A-55-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF400A-55-4C-B3KE?
For technical support, including SST39LF400A-55-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF400A-55-4C-B3KE requirements.
6.How does Aetrix verify that SST39LF400A-55-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39LF400A-55-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF400A-55-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39LF400A-55-4C-B3KE?
All SST39LF400A-55-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF400A-55-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF400A-55-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39LF400A-55-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39LF400A-55-4C-B3KE Tags
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