Microchip Technology SST39LF400A-55-4C-B3KE-T
- Part No.:
- SST39LF400A-55-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39LF400A-55-4C-B3KE-T.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,267
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39LF400A-55-4C-B3KE-T from Microchip Technology is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash memory IC using SuperFlash technology, operating at 3.0–3.6 V, with 55 ns read access time, 100,000 program/erase cycles endurance, and >100 years data retention. It serves as nonvolatile program/data storage in embedded controllers and firmware update modules.
For engineers reviewing the SST39LF400A-55-4C-B3KE-T datasheet, SST39LF400A-55-4C-B3KE-T pinout, SST39LF400A-55-4C-B3KE-T application, or SST39LF400A-55-4C-B3KE-T equivalent, key selection criteria include x16 asynchronous interface timing, JEDEC-standard command set compatibility, sector/block erase granularity, 48-pin TSOP package footprint, and single-supply 3.3 V operation for legacy industrial designs.
Technical Context
The SST39LF400A-55-4C-B3KE-T implements an x16 asynchronous parallel interface with JEDEC-standard pinouts and command protocols, supporting Word-Program, Sector-Erase (2 KWord), Block-Erase (32 KWord), and Chip-Erase operations. Its SuperFlash split-gate cell architecture enables fixed 14 µs program and 18 ms erase times independent of cycle count.
It uses hardware write inhibit (OE#/CE#/WE# control) and software data protection (6-byte command sequences) to prevent inadvertent writes. End-of-write detection is implemented via DQ7 Data# Polling and DQ6 Toggle Bit, both valid after the sixth WE# pulse during erase operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16 organization), providing 512 KB of addressable storage space |
| Read Access Time | 55 ns - enables direct execution from flash (XIP) in systems with ≤18 MHz bus timing |
| Supply Voltage | 3.0–3.6 V - compatible with standard 3.3 V logic rails and eliminates need for separate VPP |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage applications |
| Erase Granularity | Uniform 2 KWord sectors and 32 KWord blocks - allows fine-grained firmware patching without full chip erase |
| Write Timing | 14 µs word-program time - reduces system wait states during code updates |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A16 used for 256K × 16 addressing; A17 selects upper half of 4 Mbit array (per Figure 2) |
| DQ0–DQ15 | Data I/O | Bi-directional x16 data bus; latched internally during write; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low device select; must be low for all write/erase/read operations |
| OE# | Output Enable | Active-low output gate; controls data bus drive during read; inhibits writes when low |
| WE# | Write Enable | Active-low write strobe; latches address/data and initiates internal program/erase sequences |
| VDD | Power Supply | +3.0–3.6 V supply; powers core and I/O; no external VPP required |
| VSS | Ground | Two dedicated ground pins (pins 23 and 48) reduce noise coupling in high-speed reads |
| NC | No Connect | Pins 9, 10, 12–15, 17, 18, 20, 21, 22, 24, 25, 26, 27, 29, 30, 31, 32, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47 - electrically isolated, must not be connected |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide tunneling injector delivers stable 55 ns read and 14 µs program times across full temperature and lifetime |
| JEDEC-Compliant Interface | Standard x16 pinout and command set (e.g., 6-byte sector erase: 5555H/AAH → 2AAAH/55H → 5555H/80H → 5555H/AAH → 2AAAH/55H → SAX/30H) ensure drop-in replacement in existing designs |
| Hardware + Software Protection | Glitch immunity (<5 ns pulses ignored), VDD power-up/down detection, and mandatory 6-byte erase command prevent accidental corruption during brown-out or reset |
| CFI Query Support | Accessible via 5555H/AAH → 2AAAH/55H → 5555H/98H sequence; returns geometry, timing, and vendor ID for runtime configuration in bootloader code |
| Uniform Erase Architecture | 128 sectors (4 KB each) and 8 blocks (64 KB each) enable deterministic update partitioning - critical for fail-safe OTA firmware upgrades |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code |
|---|---|
Use Scenario: Storing programmable logic controller firmware that requires field updates via serial port or SD card. IC Role / Device Role / Timing Role: Nonvolatile x16 parallel boot memory mapped to microcontroller address space; accessed during cold start and firmware recovery. Use Value: 55 ns read access enables zero-wait-state execution; sector erase allows incremental patch deployment without full reflash downtime. | Use Scenario: Holding certified boot loader and safety-critical diagnostic routines in Class II medical equipment. IC Role / Device Role / Timing Role: Primary boot ROM with hardware write-inhibit and software data protection to meet IEC 62304 traceability requirements. Use Value: 100,000-cycle endurance supports periodic regulatory-mandated firmware validation; >100-year retention satisfies long-life device certification. |
| Automotive Infotainment Head Unit | Networking Equipment Configuration |
Use Scenario: Storing UI assets, voice recognition models, and calibration tables in automotive infotainment systems. IC Role / Device Role / Timing Role: Secondary program memory interfaced to ARM Cortex-A application processor via 16-bit EBI bus. Use Value: 3.0–3.6 V operation matches automotive 3.3 V rail; block-erase capability enables fast map database updates during vehicle service. | Use Scenario: Storing switch/router configuration profiles, MAC address tables, and feature license keys in enterprise networking gear. IC Role / Device Role / Timing Role: Configuration EEPROM replacement with faster write performance and higher density than serial EEPROM. Use Value: 14 µs word-program time accelerates save-to-flash operations; CFI query support simplifies multi-vendor BOM management. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV400CBTI-70G | 4 Mbit x16, 70 ns access, 2.7–3.6 V supply, supports CFI but lacks Toggle Bit detection | Requires longer read polling loops due to absence of DQ6 Toggle Bit; less efficient for real-time status monitoring | Select when 70 ns timing is acceptable and legacy CFI-only toolchains are in use |
| EN29LV400B-70TCP | 4 Mbit x16, 70 ns access, 2.7–3.6 V, JEDEC-compatible but no SuperFlash endurance guarantee | Rated for 10,000 cycles only; unsuitable for frequent field updates or diagnostic logging | Select for cost-sensitive, static firmware storage where update frequency is <10× lifetime |
Compared with MX29LV400CBTI-70G and EN29LV400B-70TCP, the SST39LF400A-55-4C-B3KE-T delivers 22% faster read access, guaranteed 10× higher endurance, and deterministic SuperFlash timing - making it optimal for systems requiring reliable, high-frequency firmware updates under industrial temperature conditions.
Availability
SST39LF400A-55-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code, and automotive infotainment head unit applications requiring stable component supply and long-term obsolescence support.
Supply support for SST39LF400A-55-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39LF400A-55-4C-B3KE-T belongs to the SST39LF/VF family of Multi-Purpose Flash devices, designed specifically for cost-sensitive, high-reliability embedded systems requiring robust firmware storage with minimal external circuitry.
FAQ
What is the exact memory organization of the SST39LF400A-55-4C-B3KE-T?
The SST39LF400A-55-4C-B3KE-T is organized as 256K × 16, delivering 4 Mbit (512 KB) of storage. Address lines A0–A16 cover the full 256K word space, with A17 used for internal bank selection per the device geometry table. This x16 configuration interfaces directly to 16-bit microprocessor buses without data multiplexing.
Does the SST39LF400A-55-4C-B3KE-T require an external VPP voltage for programming?
No, the SST39LF400A-55-4C-B3KE-T does not require an external VPP voltage. It generates all necessary high-voltage programming signals internally using its on-chip charge pump, operating solely from the 3.0–3.6 V VDD supply. This eliminates external VPP circuitry and simplifies board design compared to older flash technologies.
How does the SST39LF400A-55-4C-B3KE-T indicate completion of a Sector-Erase operation?
The SST39LF400A-55-4C-B3KE-T indicates Sector-Erase completion using two methods: Data# Polling on DQ7 (which transitions from complement to true data) and Toggle Bit on DQ6 (which stops alternating between 0 and 1). Both are valid after the rising edge of the sixth WE# pulse, enabling efficient polling without fixed delays.
Is the SST39LF400A-55-4C-B3KE-T compatible with JEDEC-standard flash command sets?
Yes, the SST39LF400A-55-4C-B3KE-T fully complies with JEDEC standard pinouts and command definitions for x16 flash memories. It supports the standard 6-byte Sector-Erase (30H), Block-Erase (50H), and Chip-Erase (10H) sequences, ensuring interoperability with generic flash programmers and bootloader frameworks.
What package type is used for the SST39LF400A-55-4C-B3KE-T?
The SST39LF400A-55-4C-B3KE-T uses a 48-lead TSOP (Thin Small Outline Package) with 12 mm × 20 mm body dimensions and standard pitch. This package is RoHS-compliant, surface-mountable, and matches JEDEC MO-141AC mechanical specifications - enabling drop-in replacement in existing TSOP-based layouts.
SST39LF400A-55-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39LF400A-55-4C-B3KE-T FAQ
1.How can I place an order for SST39LF400A-55-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF400A-55-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF400A-55-4C-B3KE-T reliable?
The price and inventory of SST39LF400A-55-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF400A-55-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39LF400A-55-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF400A-55-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF400A-55-4C-B3KE-T?
SST39LF400A-55-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF400A-55-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF400A-55-4C-B3KE-T?
For technical support, including SST39LF400A-55-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF400A-55-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39LF400A-55-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39LF400A-55-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF400A-55-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39LF400A-55-4C-B3KE-T?
All SST39LF400A-55-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF400A-55-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF400A-55-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39LF400A-55-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39LF400A-55-4C-B3KE-T Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

