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Microchip Technology SST39LF401C-55-4C-B3KE

Part No.:
SST39LF401C-55-4C-B3KE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39LF401C-55-4C-B3KE.pdf
Description:
IC FLASH 4MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,466

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Product details

Overview

SST39LF401C-55-4C-B3KE from Microchip is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded firmware and configuration storage in industrial controllers and communication modules. It operates at 3.0–3.6 V, delivers 55 ns read access time, supports hardware block protection on the bottom 8 KWord boot sector, and features erase-suspend/resume capability for real-time system responsiveness.

For engineers reviewing the SST39LF401C-55-4C-B3KE datasheet, SST39LF401C-55-4C-B3KE pinout, SST39LF401C-55-4C-B3KE application, or SST39LF401C-55-4C-B3KE equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block protection mapping, and validated alternative flash parts for legacy design refresh or supply continuity planning.

Technical Context

This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. It uses standard microprocessor bus timing with latched address/data and supports three software status detection methods: Data# Polling (DQ7), Toggle Bits (DQ6/DQ2), and open-drain RY/BY#.

The SST39LF401C-55-4C-B3KE conforms to JEDEC-standard x16 flash pinouts and command sets, includes CFI query support, and integrates hardware reset (RST#), write protect (WP#), and security ID (128-bit factory + 128-word user programmable) for secure firmware deployment.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density4 Mbit (256K × 16 organization); supports byte-wide or word-wide data transfers via DQ15–DQ0.
Read Access Time55 ns max; enables direct execution from flash (XIP) in systems with ≤18 MHz bus clocks.
Supply Voltage3.0–3.6 V only; not compatible with 2.7 V operation like SST39VF variants.
Endurance100,000 program/erase cycles typical; sufficient for field-upgradable firmware with infrequent updates.
Data RetentionGreater than 100 years at 25°C; ensures long-term reliability in unpowered storage applications.
Power Consumption5 mA active current (5 MHz), 3 µA standby/auto-low-power mode; reduces thermal load in always-on edge devices.
Erase ArchitectureUniform 2 KWord sectors + flexible blocks (seven 32K, one 16K, two 4K, one 8K); allows granular firmware partitioning.

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS compliant, top-side marking "B3KE".

Pin/Terminal Circuit Role Design Meaning
A0–A17Address InputsAMS = A17; A17–A11 select sector during Sector-Erase; A17–A15 select block during Block-Erase.
DQ0–DQ15Data I/O16-bit bidirectional bus; outputs valid data when CE# and OE# are low; tri-stated otherwise.
CE#Chip EnableActive-low chip select; device enters standby (3 µA) when high; required low for all write operations.
OE#Output EnableActive-low output gate; controls data bus drive; must be low with CE# for Read access.
WE#Write EnableActive-low control for Program/Erase; latches address/data on falling/rising edges per JEDEC timing.
WP#Write ProtectHardware lock for bottom 8 KWord boot block (00000H–01FFFH); grounded to prevent accidental erase/write.
RST#ResetHardware return to Read mode; terminates in-progress operations; requires TRP min pulse width.
RY/BY#Ready/Busy#Open-drain status indicator; pulled low during Program/Erase; requires external 10–100 kΩ pull-up.
VDDPower Supply3.0–3.6 V only; internal VPP generation eliminates need for external high-voltage programming supply.
VSSGroundTwo dedicated ground pins (pins A1 and H1 per WFBGA layout); critical for noise immunity in high-speed reads.

Key Features

Feature Design Value
Erase-Suspend/ResumeAllows real-time read access to non-suspended sectors during background erase, enabling interrupt-driven firmware updates.
Bottom Boot Block ProtectionHardware-enforced write/erase lock on lowest 8 KWord (00000H–01FFFH), preserving bootloader integrity without software overhead.
Security ID SpaceFactory-programmed 128-bit ID + 128-word user space; supports cryptographic key binding and anti-cloning in certified devices.
Auto Low Power ModeReduces active read current from 5 mA to 3 µA after valid access; eliminates need for explicit power-down sequencing in battery-backed systems.
SuperFlash® ReliabilityFixed erase/program times across full endurance life; eliminates software de-rating or timeout scaling required by conventional flash.

Applications

Industrial PLC Firmware Storage Telecom Line Card Configuration

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh temperature environments.

IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable 55 ns read access; bottom boot block holds immutable bootloader.

Use Value: Hardware WP# prevents corruption during brown-out events; 100-year retention ensures firmware integrity over equipment lifetime.

Use Scenario: Holding DSP configuration profiles and protocol stacks in carrier-grade DSLAM line cards requiring hot-swap compatibility.

IC Role / Device Role / Timing Role: JEDEC-compliant x16 interface enables direct attachment to TI C6000-series DSP EMIF buses.

Use Value: Erase-suspend allows dynamic profile switching without halting real-time signal processing; 3 µA standby minimizes card-level power budget.

Medical Imaging System Bootloader Automotive Telematics Module

Use Scenario: Securing boot firmware in FDA-class II imaging devices where regulatory traceability mandates immutable first-stage loader.

IC Role / Device Role / Timing Role: Factory-programmed Security ID binds bootloader to specific hardware serial; bottom boot block locked via WP#.

Use Value: Prevents unauthorized firmware replacement; 100,000-cycle endurance supports post-deployment calibration updates.

Use Scenario: Storing OTA update partitions and vehicle-specific calibration maps in LTE-connected telematics control units (TCUs).

IC Role / Device Role / Timing Role: Dual-partition flash layout (boot + app) leverages uniform 2 KWord sectors for atomic firmware rollbacks.

Use Value: Chip-erase completes in 40 ms typical, enabling fast recovery from corrupted OTA downloads without extended downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF401C-70-4C-B3KEWider 2.7–3.6 V supply range; 70 ns read access; same pinout and command set.Supports lower-voltage host systems (e.g., 2.7 V FPGA I/O banks); slower timing may limit XIP performance.Select when voltage margin or legacy 70 ns timing compliance is required; not drop-in for 55 ns-critical paths.
MX29LV400CTTI-70G3.0–3.6 V operation; 70 ns access; 48-pin TSOP package; lacks Security ID and erase-suspend.Cost-optimized replacement where bootloader protection suffices and firmware update concurrency is unnecessary.Choose for price-sensitive industrial designs without security or real-time update needs; verify TSOP footprint compatibility.

Compared with SST39LF401C-55-4C-B3KE, the SST39VF401C-70-4C-B3KE trades speed for broader voltage tolerance, while the MX29LV400CTTI-70G sacrifices advanced features (Security ID, erase-suspend) for cost and availability-making both viable alternatives depending on whether timing, voltage, or feature priority dominates the design.

Availability

SST39LF401C-55-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical imaging bootloaders, and automotive telematics modules requiring stable component supply across multi-year production cycles.

Supply support for SST39LF401C-55-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with a focus on embedded control and connectivity.

The SST39LF401C-55-4C-B3KE belongs to Microchip's Multi-Purpose Flash Plus (MPF+) product line, engineered for high-reliability firmware and configuration storage in industrial, medical, and communications equipment where data integrity and long-term availability are critical.

FAQ

What is the exact memory organization of the SST39LF401C-55-4C-B3KE?

The SST39LF401C-55-4C-B3KE is organized as 256K × 16 bits (4 Mbit total), with address lines A0–A17 supporting full array access. Its bottom boot block spans 00000H–01FFFH (8 KWord), and it uses JEDEC-standard x16 pinout and command protocols compatible with industry-standard flash controllers.

Does the SST39LF401C-55-4C-B3KE support 2.7 V operation?

No, the SST39LF401C-55-4C-B3KE requires a strict 3.0–3.6 V supply for both read and write operations. It is not rated for 2.7 V operation-this voltage range applies only to the SST39VF401C variant. Using below 3.0 V may cause unreliable program/erase or data corruption in the SST39LF401C-55-4C-B3KE.

How is hardware write protection implemented on the SST39LF401C-55-4C-B3KE?

Hardware write protection on the SST39LF401C-55-4C-B3KE is enabled by grounding the WP# pin, which locks the bottom 8 KWord boot block (00000H–01FFFH) against program and erase commands. If WP# is left floating, an internal pull-up keeps it high, leaving the boot block unprotected.

What package type does the SST39LF401C-55-4C-B3KE use?

The SST39LF401C-55-4C-B3KE uses a 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch), marked "B3KE" on the top surface. This ultra-compact package supports high-density PCB layouts and is distinct from the TSOP or TFBGA variants offered in the same family.

Can the SST39LF401C-55-4C-B3KE be used with standard JEDEC flash controllers?

Yes, the SST39LF401C-55-4C-B3KE fully complies with JEDEC standard pinouts and command sets for x16 flash memories. It supports common status detection methods (Data# Polling, Toggle Bits, RY/BY#) and requires no proprietary drivers-enabling plug-and-play integration with ARM, MIPS, or DSP-based memory controllers.

SST39LF401C-55-4C-B3KE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
55 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (6x8)

SST39LF401C-55-4C-B3KE FAQ

1.How can I place an order for SST39LF401C-55-4C-B3KE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39LF401C-55-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39LF401C-55-4C-B3KE reliable?

The price and inventory of SST39LF401C-55-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF401C-55-4C-B3KE is usually 5 days.

3.What payment methods are accepted for SST39LF401C-55-4C-B3KE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF401C-55-4C-B3KE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39LF401C-55-4C-B3KE?

SST39LF401C-55-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39LF401C-55-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39LF401C-55-4C-B3KE?

For technical support, including SST39LF401C-55-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF401C-55-4C-B3KE requirements.

6.How does Aetrix verify that SST39LF401C-55-4C-B3KE is sourced from the original manufacturer or authorized distributors?

All SST39LF401C-55-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF401C-55-4C-B3KE meets industry standards.

7.What is the process for return or replacement of SST39LF401C-55-4C-B3KE?

All SST39LF401C-55-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF401C-55-4C-B3KE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39LF401C-55-4C-B3KE part is unused and in its original packaging.

Return procedure for SST39LF401C-55-4C-B3KE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39LF401C-55-4C-B3KE Tags

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