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Microchip Technology SST39LF401C-55-4C-B3KE-T

Part No.:
SST39LF401C-55-4C-B3KE-T
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39LF401C-55-4C-B3KE-T.pdf
Description:
IC FLASH 4MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,099

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Product details

Overview

SST39LF401C-55-4C-B3KE-T from Microchip is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash Plus memory IC with SuperFlash® technology, designed for embedded firmware and configuration storage in industrial controllers and communication modules. It operates at 3.0–3.6 V, delivers 55 ns read access time, supports sector/block/chip erase, and includes hardware write protection via WP# pin.

For engineers reviewing the SST39LF401C-55-4C-B3KE-T datasheet, SST39LF401C-55-4C-B3KE-T pinout, SST39LF401C-55-4C-B3KE-T application, or SST39LF401C-55-4C-B3KE-T equivalent, this page provides verified package mapping (48-ball WFBGA), JEDEC-compliant x16 interface timing, boot-block architecture (bottom 8 KWord protected), and confirmed status detection methods (DQ6 toggle, DQ7 polling, RY/BY#).

Technical Context

This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. It uses standard microprocessor bus control (CE#, OE#, WE#) and latched address/data paths for compatibility with legacy 16-bit memory interfaces.

It supports three software-controlled erase modes (sector, block, chip), erase-suspend/resume for real-time data access during background erase, and CFI query mode for automatic system identification. Hardware reset (RST#) forces immediate return to read mode, and Auto Low Power mode reduces active read current from 5 mA to 3 µA after valid access.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4 Mbit (256K × 16 organization); supports 16-bit parallel data bus interface
Read Access Time 55 ns (max); enables direct replacement in 55 ns–70 ns legacy flash sockets without timing margin loss
Supply Voltage 3.0–3.6 V only; not compatible with 2.7 V operation like SST39VF variants
Endurance 100,000 program/erase cycles (typical); sufficient for field-upgradable firmware with infrequent updates
Data Retention >100 years; validated for long-life industrial deployments without refresh
Erase Architecture Uniform 2 KWord sectors + flexible blocks (seven 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord); bottom boot block (00000H–01FFFH) hardware-protected when WP# = low
Status Detection Three concurrent methods: RY/BY# open-drain output, DQ7 data# polling, DQ6 toggle bit - ensures robust host-side write completion verification

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), ball grid layout per Figure 4 and Table 1 of DS20005053B.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit address bus; AMS = A17; A11–A17 select sector during Sector-Erase; A15–A17 select block during Block-Erase
DQ0–DQ15 Data I/O 16-bit bidirectional data bus; tri-stated when CE# or OE# high; latched internally during write
CE# Chip Enable Active-low chip select; must be low to enable read/write operations; latches address/data on falling edge
OE# Output Enable Active-low output gate; controls data bus drivers; high impedance when high or CE# high
WE# Write Enable Active-low write control; latches data on rising edge; initiates internal program/erase after final pulse
WP# Write Protect Active-low hardware lock for bottom 8 KWord boot block (00000H–01FFFH); floating = internally pulled high = unprotected
RST# Reset Active-low hardware reset; terminates ongoing program/erase and returns device to Read mode within TRP
RY/BY# Ready/Busy# Open-drain status output; requires external 10 kΩ–100 kΩ pull-up; low = operation in progress, high = ready
VDD Power Supply 3.0–3.6 V supply; powers all internal logic and SuperFlash® programming circuitry
VSS Ground Reference ground for all I/O and core logic; two dedicated VSS balls in WFBGA package
NC No Connection Unbonded balls (e.g., A2, B1, C1, D1, E1, F1, G1, H1, J1, K1, L1, A6, B6, C6, D6, E6, F6, G6, H6, J6, K6, L6); must remain unconnected

Key Features

Feature Design Value
SuperFlash® Technology Split-gate cell with thick-oxide tunneling injector enables fixed 7 µs program and 18 ms erase times across full lifecycle - eliminates software de-rating
Bottom Boot Block Protection Hardware-enforced protection of lowest 8 KWord (00000H–01FFFH) via WP# pin - prevents accidental overwrite of bootloader code
Erase-Suspend/Resume Pause active sector/block erase to read any non-suspended location or program into unlocked sectors - critical for real-time systems
Security ID Space Factory-programmed 128-bit ID + 128-word user-programmable space, locked permanently after programming - supports device authentication and traceability
Auto Low Power Mode Reduces active read current from 5 mA to 3 µA automatically after valid access - cuts power in intermittently polled firmware storage

Applications

Industrial PLC Firmware Storage Telecom Baseband Configuration

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation environments with ambient temperatures up to 85°C.

IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to 16-bit CPU address space; accessed via standard memory read/write cycles with CE#/OE#/WE# handshaking.

Use Value: 55 ns access time meets tight scan-cycle timing budgets; bottom boot block protection ensures bootloader integrity during field firmware upgrades.

Use Scenario: Holding RF calibration tables and protocol stack configuration parameters in 4G/LTE baseband processors requiring frequent parameter updates during manufacturing test and field calibration.

IC Role / Device Role / Timing Role: Configuration memory with sector-erase granularity; used alongside DMA controllers for burst loading of calibration data into DSP memory.

Use Value: 18 ms uniform sector-erase enables deterministic update latency; CFI query mode allows automatic identification of flash density and command set during system boot.

Medical Imaging System Bootloader Automotive Infotainment Head Unit

Use Scenario: Secure storage of certified bootloader code in FDA-regulated diagnostic imaging equipment where firmware rollback and tampering must be physically prevented.

IC Role / Device Role / Timing Role: Trusted boot memory with hardware write protection; Security ID space stores cryptographic keys and device serial binding.

Use Value: WP#-enabled bottom boot block protection prevents unauthorized modification; >100-year data retention satisfies medical device lifetime requirements.

Use Scenario: Storing UI assets, map data partitions, and OTA update staging area in automotive head units operating across -40°C to +105°C temperature range.

IC Role / Device Role / Timing Role: Dual-purpose memory supporting both fast read (55 ns) for UI rendering and reliable erase/program for secure over-the-air updates.

Use Value: Erase-suspend capability allows simultaneous UI display and background firmware validation; RY/BY# pin enables precise timing coordination with MCU interrupt handlers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF401C-70-4C-B3KE-T Wider voltage range (2.7–3.6 V), slower 70 ns access time, same 256K×16 organization and WFBGA-48 package Compatible with 2.7 V systems (e.g., battery-backed designs); unsuitable where 55 ns timing is required Select only if system VDD can drop below 3.0 V or if timing margin allows 70 ns access
MX29LV400CBTI-70G 4 Mbit (256K×16), 70 ns access, 2.7–3.6 V, TSOP-48 package; lacks erase-suspend and Security ID features Lower-cost alternative for non-critical firmware storage; no hardware boot-block protection or suspend capability Use where cost outweighs advanced reliability features and board space permits TSOP instead of WFBGA

Compared with SST39VF401C-70-4C-B3KE-T, the SST39LF401C-55-4C-B3KE-T offers faster timing and tighter voltage compliance but sacrifices 2.7 V operation; versus MX29LV400CBTI-70G, it provides superior endurance management and security features at higher unit cost and smaller footprint.

Availability

SST39LF401C-55-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom baseband configuration, medical imaging bootloader, and automotive infotainment head unit applications requiring stable component supply and long-term lifecycle support.

Supply support for SST39LF401C-55-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with broad industrial and automotive qualification coverage.

The SST39LF401C-55-4C-B3KE-T belongs to Microchip's Multi-Purpose Flash Plus (MPF+) product line, engineered for high-reliability embedded firmware and configuration storage in space-constrained, thermally demanding applications.

FAQ

What is the exact memory organization and bus width of the SST39LF401C-55-4C-B3KE-T?

The SST39LF401C-55-4C-B3KE-T is organized as 256K × 16, delivering 4 Mbit total capacity across a 16-bit parallel data bus (DQ0–DQ15). It uses 18 address lines (A0–A17) and conforms to JEDEC-standard x16 flash pinouts and command sets, ensuring drop-in compatibility with legacy 16-bit memory interfaces.

Does the SST39LF401C-55-4C-B3KE-T support 2.7 V operation like some other SST39x devices?

No, the SST39LF401C-55-4C-B3KE-T is rated for 3.0–3.6 V only. Unlike the SST39VF401C variant (2.7–3.6 V), this part does not guarantee functionality below 3.0 V. Attempting operation at 2.7 V may result in failed program/erase cycles or read corruption, as confirmed by voltage specifications in DS20005053B Section 1.

How is hardware write protection implemented on the SST39LF401C-55-4C-B3KE-T?

The SST39LF401C-55-4C-B3KE-T implements bottom boot block protection: when WP# is driven low, the lowest 8 KWord (00000H–01FFFH) is locked against program and erase. If WP# is left floating, an internal pull-up holds it high, disabling protection. This matches the SST39LF401C designation (vs. SST39LF402C, which protects the top block).

What package type is used for the SST39LF401C-55-4C-B3KE-T, and is it RoHS compliant?

The SST39LF401C-55-4C-B3KE-T uses a 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch), as specified in DS20005053B Figure 4 and ordering code suffix "B3KE". All variants in the SST39LF401C/SST39LF402C family are RoHS compliant, with lead-free solderability and halogen-free materials per Microchip's environmental policy.

Can the SST39LF401C-55-4C-B3KE-T be used with standard microprocessor bus timing without additional glue logic?

Yes, the SST39LF401C-55-4C-B3KE-T uses standard CE#, OE#, and WE# control signals compatible with generic 16-bit microprocessor buses. Its latched address/data architecture, JEDEC-compliant timing (e.g., tAVQV = 55 ns), and built-in write timing generation eliminate need for external wait-state generators or timing adapters in most embedded designs.

SST39LF401C-55-4C-B3KE-T Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
55 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (6x8)

SST39LF401C-55-4C-B3KE-T FAQ

1.How can I place an order for SST39LF401C-55-4C-B3KE-T through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39LF401C-55-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39LF401C-55-4C-B3KE-T reliable?

The price and inventory of SST39LF401C-55-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF401C-55-4C-B3KE-T is usually 5 days.

3.What payment methods are accepted for SST39LF401C-55-4C-B3KE-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF401C-55-4C-B3KE-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39LF401C-55-4C-B3KE-T?

SST39LF401C-55-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39LF401C-55-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39LF401C-55-4C-B3KE-T?

For technical support, including SST39LF401C-55-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF401C-55-4C-B3KE-T requirements.

6.How does Aetrix verify that SST39LF401C-55-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?

All SST39LF401C-55-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF401C-55-4C-B3KE-T meets industry standards.

7.What is the process for return or replacement of SST39LF401C-55-4C-B3KE-T?

All SST39LF401C-55-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF401C-55-4C-B3KE-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39LF401C-55-4C-B3KE-T part is unused and in its original packaging.

Return procedure for SST39LF401C-55-4C-B3KE-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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