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Microchip Technology SST39LF401C-55-4C-MAQE-T
- Part No.:
- SST39LF401C-55-4C-MAQE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-WFBGA
- Datasheet:
-
SST39LF401C-55-4C-MAQE-T.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,420
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Product details
Overview
SST39LF401C-55-4C-MAQE-T from Microchip is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash Plus memory IC designed for embedded firmware and configuration storage in industrial controllers and legacy system upgrades. It operates at 3.0–3.6 V, delivers 55 ns read access time, supports hardware block protection on the bottom 8 KWord boot sector, and features Erase-Suspend/Resume for real-time interruptible flash operations.
For engineers reviewing the SST39LF401C-55-4C-MAQE-T datasheet, SST39LF401C-55-4C-MAQE-T pinout, SST39LF401C-55-4C-MAQE-T application, or SST39LF401C-55-4C-MAQE-T equivalent, this page provides verified package mapping (48-ball WFBGA, 4 mm × 6 mm), JEDEC-compliant x16 interface timing, boot-block protection behavior, and validated alternatives with documented sector/block architecture differences.
Technical Context
This device implements SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count-unlike conventional flash where timing degrades over endurance life. Its command set conforms to JEDEC-standard x16 flash pinouts and includes six-byte sequences for sector/block/chip erase, plus dedicated commands for Security ID programming and CFI query mode entry.
The SST39LF401C-55-4C-MAQE-T uses dual status detection: Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2), with RY/BY# as an open-drain ready/busy output requiring external 10 kΩ–100 kΩ pull-up. It supports Auto Low Power mode (3 µA standby), hardware write inhibit via WP#, and hardware reset via RST# with guaranteed TRP and TRHR timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16 organization), directly maps to 512 KB of 16-bit addressable space |
| Read Access Time | 55 ns - enables direct execution from flash (XIP) in systems with ≤18 MHz bus timing |
| Supply Voltage | 3.0–3.6 V - compatible with 3.3 V logic rails; excludes 2.7 V operation supported by VF-series variants |
| Endurance | 100,000 program/erase cycles - sufficient for field firmware updates over 10+ years in industrial control applications |
| Data Retention | >100 years - ensures long-term reliability without refresh in unpowered storage |
| Block Architecture | Bottom-boot configuration: protected 8 KWord block at 00000H–01FFFH - safeguards bootloader code against accidental overwrite |
| Package | 48-ball WFBGA (4 mm × 6 mm) - ultra-compact footprint for space-constrained PCBs with fine-pitch routing |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm), ball pitch 0.5 mm, top view with balls facing down per Figure 4. Pinout conforms to JEDEC-standard x16 flash interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus; AMS = A17 selects top/bottom boot blocks during erase; A0–A10 used in command sequences |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; latched internally during writes; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; must be low to enable read/write; controls address/data latch timing edges |
| OE# | Output Enable | Active-low output gate; determines data validity on DQ bus during read; high disables outputs |
| WE# | Write Enable | Active-low write strobe; falling/rising edge latches address/data per JEDEC command protocol |
| WP# | Write Protect | Hardware boot-block lock: grounded to protect bottom 8 KWord (00000H–01FFFH); floating = unprotected |
| RST# | Reset Input | Active-low hardware reset; terminates ongoing erase/program and forces return to read mode within TRP |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; pulled low during internal erase/program; requires external pull-up resistor |
| VDD | Power Supply | 3.0–3.6 V supply; powers core logic and SuperFlash® cell programming circuitry |
| VSS | Ground | Reference ground for all I/O and core functions; two dedicated VSS balls for noise reduction |
| NC | No Connection | Unbonded balls (e.g., A2, A1, NC positions) - must remain unconnected per design |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows real-time interruption of sector/block erase to read or program other non-suspended regions - critical for deterministic response in safety-critical firmware updates |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable segment - enables secure device authentication and traceability without external crypto IC |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid read access - cuts dynamic power by >99% during idle polling in battery-backed systems |
| Uniform Sector Erase | 2 KWord sectors (4 KB) across full array - enables precise firmware patching without disturbing adjacent application code |
| JEDEC Command Compatibility | Fully compliant with standard x16 flash command sets (e.g., 555H/2AAH unlock, 80H/50H/30H/10H erase) - ensures drop-in replacement in existing flash controller firmware |
Applications
| Industrial PLC Firmware Storage | Legacy Embedded System Bootloader |
|---|---|
Use Scenario: Storing firmware images and runtime configuration parameters in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into CPU address space; executes in-place (XIP) with 55 ns access enabling deterministic scan-cycle timing. Use Value: Bottom-boot protection prevents corruption of bootloader during field firmware updates; 100,000-cycle endurance supports 5+ years of scheduled maintenance cycles. |
Use Scenario: Replacing obsolete EPROMs in legacy medical devices and telecom infrastructure where board space and BOM continuity are constrained. IC Role / Device Role / Timing Role: Pin-compatible x16 flash replacement with identical JEDEC command interface and TSOP/WFBGA footprint options. Use Value: 48-ball WFBGA (4 mm × 6 mm) reduces PCB area by 60% vs. 48-lead TSOP; 3.3 V operation eliminates level-shifter requirements in modern 3.3 V designs. |
| Automotive Body Control Module (BCM) | Network Equipment Configuration Storage |
Use Scenario: Storing calibration data, feature-enable bits, and diagnostic logs in automotive BCMs requiring AEC-Q100 stress qualification. IC Role / Device Role / Timing Role: Configuration memory accessed via microcontroller's parallel bus; RY/BY# signal synchronizes host polling to avoid bus contention during erase. Use Value: >100-year data retention ensures calibration integrity over vehicle lifetime; hardware WP# eliminates need for software write-protection logic. |
Use Scenario: Holding FPGA bitstreams, switch/router configuration tables, and boot images in carrier-grade networking gear with hot-swap capability. IC Role / Device Role / Timing Role: Dual-status detection (DQ7 polling + RY/BY#) enables concurrent background erase while servicing packet processing interrupts. Use Value: Erase-suspend allows immediate response to configuration change requests without waiting for full chip erase; uniform 4 KB sectors simplify partial reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF401C-70-4C-EKE-T | 2.7–3.6 V supply range; 70 ns read access; packaged in 48-lead TSOP (12 mm × 20 mm) | Wider voltage tolerance suits mixed-voltage systems; slower access limits XIP in high-clock-rate CPUs | Select when board layout accommodates TSOP and system requires 2.7 V brown-out operation |
| MX29LV400CTTI-70G | 3.0–3.6 V; 70 ns access; top-boot configuration (protected 8 KWord at 3E000H–3FFFFH); 48-ball TFBGA (6 mm × 8 mm) | Top-boot protection differs from SST39LF401C's bottom-boot; larger TFBGA footprint increases PCB area | Select when top-boot architecture matches existing firmware partitioning and TFBGA routing is feasible |
Compared with SST39LF401C-55-4C-MAQE-T, the SST39VF401C variant trades speed and compactness for broader voltage support, while the MX29LV400CTTI offers comparable voltage but diverges in boot-block location and package size-requiring layout and firmware alignment checks before substitution.
Availability
SST39LF401C-55-4C-MAQE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy embedded system bootloader replacement, and automotive body control module configuration requiring stable component supply across extended product lifecycles.
Supply support for SST39LF401C-55-4C-MAQE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with emphasis on industrial, automotive, and aerospace reliability standards.
The SST39LF401C belongs to Microchip's Multi-Purpose Flash Plus (MPF+) family, engineered for high-reliability embedded firmware and configuration storage using SuperFlash® technology to deliver consistent performance across 100,000+ program/erase cycles.
FAQ
What is the boot-block configuration of SST39LF401C-55-4C-MAQE-T?
The SST39LF401C-55-4C-MAQE-T implements bottom-boot architecture, protecting the lowest 8 KWord (32 KB) block at address range 00000H–01FFFH via hardware WP# pin. This ensures bootloader code remains intact during firmware updates to higher memory regions. The SST39LF401C-55-4C-MAQE-T datasheet confirms this in Table 4 and Figure 2, distinguishing it from top-boot variants like SST39LF402C.
Does SST39LF401C-55-4C-MAQE-T support Erase-Suspend functionality?
Yes, the SST39LF401C-55-4C-MAQE-T supports Erase-Suspend and Erase-Resume commands (B0H and 30H respectively), allowing interruption of sector or block erase to read data or program other non-suspended regions. This capability is explicitly defined in Section "Erase-Suspend/Erase-Resume Commands" of the DS20005053B datasheet and confirmed in Table 3 status bit behavior.
What package type is used in SST39LF401C-55-4C-MAQE-T?
The SST39LF401C-55-4C-MAQE-T uses a 48-ball WFBGA package measuring 4 mm × 6 mm with 0.5 mm ball pitch, as specified in the "Packages Available" section and Figure 4 of the DS20005053B datasheet. This ultra-compact footprint is distinct from the TSOP and TFBGA options offered for other members of the SST39LF401C/402C family.
How does SST39LF401C-55-4C-MAQE-T indicate completion of a Program or Erase operation?
The SST39LF401C-55-4C-MAQE-T provides three concurrent status mechanisms: Data# Polling (DQ7 toggles until completion), Toggle Bits (DQ6 and DQ2 alternate during operation), and Ready/Busy# (RY/BY# open-drain output pulled low during active erase/program). All are fully documented in Section "Write Operation Status Detection" and Table 3 of the official datasheet.
Is SST39LF401C-55-4C-MAQE-T RoHS compliant?
Yes, the SST39LF401C-55-4C-MAQE-T is RoHS compliant, as stated in the "Features" section of the DS20005053B datasheet: "All devices are RoHS compliant." This applies to the WFBGA packaging and lead-free finish used in the SST39LF401C-55-4C-MAQE-T variant.
SST39LF401C-55-4C-MAQE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-WFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WFBGA (6x4)
SST39LF401C-55-4C-MAQE-T FAQ
1.How can I place an order for SST39LF401C-55-4C-MAQE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF401C-55-4C-MAQE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF401C-55-4C-MAQE-T reliable?
The price and inventory of SST39LF401C-55-4C-MAQE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF401C-55-4C-MAQE-T is usually 5 days.
3.What payment methods are accepted for SST39LF401C-55-4C-MAQE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF401C-55-4C-MAQE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF401C-55-4C-MAQE-T?
SST39LF401C-55-4C-MAQE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF401C-55-4C-MAQE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF401C-55-4C-MAQE-T?
For technical support, including SST39LF401C-55-4C-MAQE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF401C-55-4C-MAQE-T requirements.
6.How does Aetrix verify that SST39LF401C-55-4C-MAQE-T is sourced from the original manufacturer or authorized distributors?
All SST39LF401C-55-4C-MAQE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF401C-55-4C-MAQE-T meets industry standards.
7.What is the process for return or replacement of SST39LF401C-55-4C-MAQE-T?
All SST39LF401C-55-4C-MAQE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF401C-55-4C-MAQE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF401C-55-4C-MAQE-T part is unused and in its original packaging.
Return procedure for SST39LF401C-55-4C-MAQE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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