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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Microchip Technology SST39LF402C-55-4C-B3KE-T

Name: SST39LF402C-55-4C-B3KE-T
Brand: Microchip Technology
SKU: SST39LF402C-55-4C-B3KE-T
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SST39LF402C-55-4C-B3KE-T

Manufacturer:: Microchip Technology

Category:: Memory

Package:: 48-TFBGA

Datasheet:: SST39LF402C-55-4C-B3KE-T.pdf

Description:: IC FLASH 4MBIT PARALLEL 48TFBGA

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Product details

Overview

SST39LF402C-55-4C-B3KE-T from Microchip is a 4 Mbit (256K × 16) CMOS Multi-Purpose Flash Plus memory IC designed for embedded firmware and configuration storage in microcontroller-based systems. It operates at 3.0–3.6 V, delivers 55 ns read access time, supports hardware block protection on the top 8 KWord boot sector, and features erase-suspend/resume capability for real-time system responsiveness.

For engineers reviewing the SST39LF402C-55-4C-B3KE-T datasheet, SST39LF402C-55-4C-B3KE-T pinout, SST39LF402C-55-4C-B3KE-T application, or SST39LF402C-55-4C-B3KE-T equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, SuperFlash® reliability metrics (100,000 program/erase cycles, >100-year data retention), and validated alternative part guidance for industrial control, networking boot code, and automotive ECU firmware storage.

Technical Context

This device implements SuperFlash® split-gate cell technology with thick-oxide tunneling injector, enabling fixed erase/program timing independent of cycle count-eliminating software de-rating over lifetime. It uses standard JEDEC x16 flash command sets (CFI-compatible) and supports three software detection methods for write completion: Data# Polling (DQ7), Toggle Bits (DQ6/DQ2), and Ready/Busy# (open-drain RY/BY#).

Hardware protection includes dedicated WP# input for top-boot block lock, RST# for hard reset to read mode, and noise/glitch immunity (<5 ns pulse rejection). The 48-ball WFBGA (4 mm × 6 mm) package matches JEDEC-standard pinout for drop-in compatibility with other x16 flash devices in space-constrained designs.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	4 Mbit (256K × 16), providing 512 KB of nonvolatile storage for firmware images or configuration tables.
Read Access Time	55 ns - enables direct execution (XIP) from flash at up to ~18 MHz system bus frequency without wait states.
Supply Voltage	3.0–3.6 V - compatible with 3.3 V logic rails and eliminates need for separate VPP programming voltage.
Endurance	100,000 program/erase cycles - supports field firmware updates across product lifecycle without wear-out risk.
Data Retention	>100 years - ensures long-term integrity of stored boot code or calibration data in unpowered storage.
Power Consumption	5 mA active / 3 µA standby - reduces system-level power budget in always-on or low-duty-cycle applications.
Erase Architecture	Uniform 2 KWord sectors + flexible blocks (seven 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord) - enables granular update of application partitions without full chip erase.

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, JEDEC-standard x16 flash footprint.

Pin/Terminal	Circuit Role	Design Meaning
A0–A17	Address Inputs	18-bit address bus supporting full 256K-word addressing; AMS = A17 for sector/block selection during erase.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# high.
CE#	Chip Enable	Active-low chip select; device enters standby (3 µA) when high.
OE#	Output Enable	Active-low output gate; controls data bus visibility during read operations.
WE#	Write Enable	Active-low control for program/erase command latching; timing-critical for command sequence validity.
WP#	Write Protect	Active-low hardware lock for top 8 KWord boot block (3E000H–3FFFFH); prevents accidental firmware overwrite.
RST#	Reset	Active-low hardware reset; forces immediate return to read mode, terminating any in-progress operation.
RY/BY#	Ready/Busy#	Open-drain status indicator; requires external 10–100 kΩ pull-up; low = busy, high = ready.
VDD	Power Supply	3.0–3.6 V supply; powers all internal logic and SuperFlash® programming circuitry.
VSS	Ground	Reference ground for all I/O and core logic; two dedicated pins ensure low-noise operation.
NC	No Connection	Unbonded balls (A2, A1, A5, DQ10, DQ9, DQ1, A17, WP#, NC, DQ2, NC, DQ3, NC, DQ12, RST#, RY/BY#, NC, DQ13, A9, A10, A8, DQ4, DQ5, DQ14, A11, A13, A12, DQ11, DQ6, DQ15, A14, A15, A16, DQ7) - must be left floating or tied to VSS per layout guidelines.

Key Features

Feature	Design Value
Erase-Suspend/Resume	Allows interrupting block/sector erase to read or program other regions - critical for real-time OS task scheduling during firmware update.
Auto Low Power Mode	Reduces active read current from 5 mA to 3 µA after valid read access - cuts dynamic power by >99% during idle polling.
Security ID Space	128-bit factory-programmed ID + 128-word user-programmable segment - enables secure device authentication and anti-cloning in OEM systems.
SuperFlash® Technology	Fixed 7 µs word-program and 18 ms sector-erase times regardless of accumulated cycles - removes runtime degradation compensation from firmware.
JEDEC Pinout Compliance	Matches industry-standard x16 flash pin assignments - enables PCB reuse across multiple vendors' 4 Mbit flash devices.

Applications

Industrial PLC Firmware Storage	Networking Equipment Boot Code
Use Scenario: Storing ladder logic firmware and I/O configuration tables in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into MCU address space; accessed via parallel x16 bus during cold start and runtime updates. Use Value: Top-boot hardware protection prevents corruption of bootloader during field firmware upgrades; 100,000-cycle endurance supports decades of version revisions.	Use Scenario: Holding boot ROM and FPGA configuration bitstreams in enterprise switches and routers requiring fast, reliable startup. IC Role / Device Role / Timing Role: Primary boot memory executing XIP (execute-in-place) code directly from flash; 55 ns access enables sub-20 MHz bus timing without wait states. Use Value: Erase-suspend capability allows background firmware validation while maintaining packet forwarding - zero downtime during OTA updates.
Automotive ECU Calibration Data	Medical Device Configuration Storage
Use Scenario: Storing engine calibration maps and diagnostic trouble codes (DTCs) in engine control units compliant with AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Parameter memory accessed by MCU during runtime; write-protected via WP# during normal operation to prevent accidental overwrites. Use Value: >100-year data retention ensures calibration integrity over vehicle lifetime; 3.0–3.6 V operation matches automotive 3.3 V supply rails.	Use Scenario: Retaining FDA-mandated device settings, usage logs, and safety-critical configuration parameters in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure nonvolatile storage with factory-authenticated Security ID; accessed only during initialization or maintenance mode. Use Value: 128-bit locked factory ID prevents counterfeit modules; hardware block protection safeguards regulatory compliance data from tampering.

Industrial PLC Firmware Storage

Networking Equipment Boot Code

Use Scenario: Storing ladder logic firmware and I/O configuration tables in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Nonvolatile program memory mapped into MCU address space; accessed via parallel x16 bus during cold start and runtime updates.

Use Value: Top-boot hardware protection prevents corruption of bootloader during field firmware upgrades; 100,000-cycle endurance supports decades of version revisions.

Use Scenario: Holding boot ROM and FPGA configuration bitstreams in enterprise switches and routers requiring fast, reliable startup.

IC Role / Device Role / Timing Role: Primary boot memory executing XIP (execute-in-place) code directly from flash; 55 ns access enables sub-20 MHz bus timing without wait states.

Use Value: Erase-suspend capability allows background firmware validation while maintaining packet forwarding - zero downtime during OTA updates.

Automotive ECU Calibration Data

Medical Device Configuration Storage

Use Scenario: Storing engine calibration maps and diagnostic trouble codes (DTCs) in engine control units compliant with AEC-Q100 Grade 3.

IC Role / Device Role / Timing Role: Parameter memory accessed by MCU during runtime; write-protected via WP# during normal operation to prevent accidental overwrites.

Use Value: >100-year data retention ensures calibration integrity over vehicle lifetime; 3.0–3.6 V operation matches automotive 3.3 V supply rails.

Use Scenario: Retaining FDA-mandated device settings, usage logs, and safety-critical configuration parameters in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Secure nonvolatile storage with factory-authenticated Security ID; accessed only during initialization or maintenance mode.

Use Value: 128-bit locked factory ID prevents counterfeit modules; hardware block protection safeguards regulatory compliance data from tampering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SST39VF402C-70-4C-B3KE-T	Slower 70 ns read access; wider 2.7–3.6 V supply range; identical pinout, density, and feature set.	Preferred where lower cost or broader voltage margin outweighs speed requirement (e.g., legacy 25 MHz bus systems).	Select when system clock <14 MHz or when sharing BOM with SST39VF401C/402C variants.
MX29LV400CTTI-70G	70 ns access; 3.0–3.6 V; same 48-ball WFBGA package; lacks erase-suspend and Security ID features.	Suitable for basic boot code storage where advanced features are unused; lower unit cost but reduced flexibility.	Choose for cost-sensitive, non-updatable firmware applications lacking real-time update requirements.

Compared with SST39VF402C-70-4C-B3KE-T, the SST39LF402C-55-4C-B3KE-T delivers 22% faster read performance for XIP execution, while MX29LV400CTTI-70G offers lower acquisition cost but forfeits erase-suspend and secure ID capabilities essential for field-upgradable medical or automotive systems.

Availability

SST39LF402C-55-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, networking equipment boot code, and automotive ECU calibration data requiring stable component supply and long-term lifecycle support.

Supply support for SST39LF402C-55-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.

The SST39LF402C belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered for high-reliability embedded firmware and configuration storage in automotive, industrial, and networking applications where endurance, data retention, and real-time update capability are critical.

FAQ

What is the exact memory organization of the SST39LF402C-55-4C-B3KE-T?

The SST39LF402C-55-4C-B3KE-T is organized as 256K × 16, delivering 4 Mbit (512 KB) of nonvolatile storage. Its address space spans 00000H to 3FFFFH, with top-boot architecture protecting the upper 8 KWord (3E000H–3FFFFH) via hardware WP# control. This layout aligns with JEDEC-standard x16 flash mapping and supports direct microprocessor bus interfacing without address translation.

Does the SST39LF402C-55-4C-B3KE-T require an external VPP voltage for programming?

No, the SST39LF402C-55-4C-B3KE-T does not require an external VPP voltage. It performs all program and erase operations using only the 3.0–3.6 V VDD supply, thanks to on-chip charge pump circuitry. This simplifies power design, eliminates VPP routing complexity, and enhances system reliability compared to older flash technologies requiring dual-supply operation.

How does hardware block protection work on the SST39LF402C-55-4C-B3KE-T?

Hardware block protection on the SST39LF402C-55-4C-B3KE-T is implemented via the WP# pin. When WP# is driven low, the top 8 KWord boot block (3E000H–3FFFFH) is locked against program and erase operations. If WP# is left floating, an internal pull-up holds it high, disabling protection. This mechanism prevents accidental corruption of bootloader code during field firmware updates or system resets.

What status detection methods are supported by the SST39LF402C-55-4C-B3KE-T during write operations?

The SST39LF402C-55-4C-B3KE-T supports three concurrent status detection methods: Data# Polling (DQ7 toggles until completion), Toggle Bits (DQ6 and DQ2 alternate during operation), and Ready/Busy# (RY/BY# open-drain signal pulled low during activity). These allow flexible host-side timing control - polling for minimal pin count, RY/BY# for interrupt-driven operation, or combined use for redundancy in safety-critical systems.

Is the SST39LF402C-55-4C-B3KE-T compatible with standard JEDEC x16 flash command sets?

Yes, the SST39LF402C-55-4C-B3KE-T fully complies with JEDEC Standard JESD21-C for x16 flash memories. It supports standard command sequences for word-program, sector/block/chip-erase, erase-suspend/resume, CFI query, and product identification. This ensures interoperability with existing flash controllers, BIOS/UEFI firmware stacks, and programming tools designed for JEDEC-compliant parallel flash devices.

SST39LF402C-55-4C-B3KE-T Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: SST39 MPF™

Package/Case:: 48-TFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH

Memory Size:: 4Mbit

Memory Organization:: 256K x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 10µs

Access Time:: 55 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TFBGA (6x8)

SST39LF402C-55-4C-B3KE-T FAQ

1.How can I place an order for SST39LF402C-55-4C-B3KE-T through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39LF402C-55-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39LF402C-55-4C-B3KE-T reliable?

The price and inventory of SST39LF402C-55-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF402C-55-4C-B3KE-T is usually 5 days.

3.What payment methods are accepted for SST39LF402C-55-4C-B3KE-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF402C-55-4C-B3KE-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39LF402C-55-4C-B3KE-T?

SST39LF402C-55-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39LF402C-55-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39LF402C-55-4C-B3KE-T?

For technical support, including SST39LF402C-55-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF402C-55-4C-B3KE-T requirements.

6.How does Aetrix verify that SST39LF402C-55-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?

All SST39LF402C-55-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF402C-55-4C-B3KE-T meets industry standards.

7.What is the process for return or replacement of SST39LF402C-55-4C-B3KE-T?

All SST39LF402C-55-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF402C-55-4C-B3KE-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39LF402C-55-4C-B3KE-T part is unused and in its original packaging.

Return procedure for SST39LF402C-55-4C-B3KE-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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