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Microchip Technology SST39LF801C-55-4C-B3KE-T
- Part No.:
- SST39LF801C-55-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39LF801C-55-4C-B3KE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,695
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Product details
Overview
SST39LF801C-55-4C-B3KE-T from Microchip Technology is a 8 Mbit (512K × 16) low-voltage CMOS Multi-Purpose Flash Plus memory IC with 55 ns read access time, 3.0–3.6 V operating voltage, and bottom-boot block architecture. It features hardware write protection (WP#), Ready/Busy# status pin, and JEDEC-standard x16 parallel interface - deployed in industrial control firmware storage and embedded boot code retention.
For engineers reviewing the SST39LF801C-55-4C-B3KE-T datasheet, SST39LF801C-55-4C-B3KE-T pinout, SST39LF801C-55-4C-B3KE-T application, or SST39LF801C-55-4C-B3KE-T equivalent, key selection criteria include boot-block configuration (bottom 8 KWord), 100,000-cycle endurance, 3 µA standby current, SuperFlash® erase/program timing consistency, and TSOP-48 package compatibility with legacy x16 memory sockets.
Technical Context
This device implements SST's proprietary SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count - eliminating software de-rating required by conventional flash. Its command-set architecture supports JEDEC-standard software data protection (SDP) via six-byte sequences for sector/block/chip erase and three-byte sequences for word-program.
The SST39LF801C-55-4C-B3KE-T integrates hardware block protection for the bottom 8 KWord (00000H–01FFFH), RST# reset input, and dual status detection (DQ7 Data# Polling and DQ6 Toggle Bit) alongside open-drain RY/BY# output - all synchronized to WE#/CE# edge-triggered latching per JEDEC x16 timing conventions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), directly maps to 16-bit microprocessor data bus without glue logic |
| Read Access Time | 55 ns - enables direct interfacing with 16 MHz bus systems without wait states |
| Supply Voltage | 3.0–3.6 V - compatible with 3.3 V system rails; excludes 2.7 V operation supported by VF-series variants |
| Endurance | 100,000 program/erase cycles - validated for firmware update-intensive applications like field-upgradable PLCs |
| Data Retention | >100 years - ensures long-term reliability in unpowered storage of calibration or configuration data |
| Standby Current | 3 µA typical - supports ultra-low-power sleep modes in battery-backed embedded controllers |
| Boot Block | Bottom 8 KWord (00000H–01FFFH) - protects primary bootloader code from accidental overwrite during application updates |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), standard JEDEC MO-142AC footprint, compatible with automated SMT placement and reflow profiles for lead-free assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | Latched on falling edge of CE# or WE#; A18–A11 select sector during Sector-Erase, A18–A15 select block during Block-Erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; tri-stated when CE# or OE# high; latched internally during Write cycles |
| CE# | Chip Enable | Active-low chip select; must be low to enable Read/Write operations; controls address/data latching timing |
| OE# | Output Enable | Active-low output gate; determines data validity on DQ bus during Read; high = high-impedance state |
| WE# | Write Enable | Active-low control for Program/Erase command sequencing; rising edge initiates internal operation |
| WP# | Hardware Write Protect | Grounding disables Program/Erase on bottom 8 KWord boot block; floating = internally pulled high = unprotected |
| RST# | Hardware Reset | Active-low signal forcing immediate return to Read mode; terminates in-progress Erase/Program safely |
| RY/BY# | Ready/Busy# Output | Open-drain status indicator; requires external 10–100 kΩ pull-up; low = active operation, high = ready |
| VDD | Power Supply | 3.0–3.6 V supply; powers core logic and SuperFlash® array; decoupling capacitor required per JEDEC guidelines |
| VSS | Ground | Signal and power reference plane; two dedicated pins ensure low-impedance return path for high-speed switching |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Fixed 18 ms sector/block erase and 7 µs word-program times across full lifecycle - eliminates dynamic timing margining in firmware |
| Bottom Boot Block Protection | Hardware-enforced write lock on 00000H–01FFFH region - prevents corruption of bootloader during application firmware updates |
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during erase - enables background firmware validation while updating other regions |
| Security ID Space | Factory-programmed 128-bit ID + 128-word user-programmable space - supports secure device authentication and traceability in production |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access - cuts power in intermittently polled configuration storage |
| JEDEC Standard Compliance | Pinout, command set, and timing fully aligned with JESD21-C - guarantees drop-in replacement for other x16 parallel flash devices |
Applications
| Industrial PLC Firmware Storage | Medical Device Bootloader Retention |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh factory environments with wide temperature swings. IC Role / Device Role / Timing Role: Nonvolatile program memory providing 55 ns read access to support deterministic scan-cycle execution in real-time control loops. Use Value: Bottom-boot architecture isolates bootloader from field updates; 100-year data retention ensures firmware integrity over equipment lifetime without battery backup. |
Use Scenario: Holding certified bootloader code and calibration constants in Class II medical imaging equipment requiring regulatory-compliant firmware immutability. IC Role / Device Role / Timing Role: Secure boot memory with hardware WP# and Security ID - validates firmware authenticity before execution and prevents unauthorized modification. Use Value: Factory-programmed 128-bit ID enables unique device identification for audit trails; bottom-boot protection meets IEC 62304 software safety requirements. |
| Automotive Infotainment Configuration | Telecom Base Station Parameter Storage |
Use Scenario: Storing UI language packs, display settings, and vehicle-specific configuration profiles in automotive head units exposed to thermal cycling and vibration. IC Role / Device Role / Timing Role: Parallel x16 interface memory supporting fast read access for responsive HMI rendering; operates reliably across –40°C to +85°C. Use Value: 3 µA standby current extends battery runtime during ignition-off periods; SuperFlash® endurance withstands frequent OTA update cycles over 15-year vehicle life. |
Use Scenario: Retaining RF calibration tables, antenna tuning parameters, and network protocol stacks in 4G/5G base station remote radio units deployed outdoors. IC Role / Device Role / Timing Role: High-reliability configuration memory with RY/BY# status signaling - enables precise synchronization of parameter reloads during maintenance windows. Use Value: Ready/Busy# pin allows host processor to schedule background tasks during 40 ms chip-erase; JEDEC compliance simplifies qualification across multi-vendor BOMs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF801C-70-4C-B3KE-T | 70 ns read access; 2.7–3.6 V supply range; same 512K×16 density and bottom-boot layout | Higher voltage tolerance enables use in mixed 2.7/3.3 V systems; slower access limits use in >14 MHz bus designs | Select when wider supply range is needed and 70 ns timing satisfies system timing budget |
| MX29LV800CTTC-70G | 70 ns access; 3.0–3.6 V; top-boot configuration (00000H–01FFFH unprotected); different command set | Top-boot architecture reverses protected region - unsuitable for existing bottom-boot bootloader designs without firmware revision | Consider only for new designs where top-boot layout aligns with system architecture and MXIC's command set is integrated |
Compared with SST39VF801C-70-4C-B3KE-T, the SST39LF801C-55-4C-B3KE-T delivers faster 55 ns access at the cost of narrower 3.0–3.6 V operation; versus MX29LV800CTTC-70G, it maintains identical boot-block orientation and JEDEC command compatibility - reducing redesign risk in legacy systems.
Availability
SST39LF801C-55-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader retention, and automotive infotainment configuration requiring stable component supply across extended product lifecycles.
Supply support for SST39LF801C-55-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016, integrating its SuperFlash® nonvolatile memory IP into a broad portfolio of microcontrollers, analog, and memory solutions.
The SST39LF801C-55-4C-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for embedded systems requiring reliable, low-power, pin-compatible parallel NOR flash with enhanced boot security and field-upgrade capability.
FAQ
What is the boot block configuration of the SST39LF801C-55-4C-B3KE-T?
The SST39LF801C-55-4C-B3KE-T implements bottom-boot block protection, securing the lowest 8 KWord (00000H–01FFFH) from inadvertent erase or program when WP# is grounded. This matches the SST39LF801C designation per DS25041A Table 4 and ensures bootloader integrity in systems where firmware updates target higher memory regions.
Does the SST39LF801C-55-4C-B3KE-T support both hardware and software write protection?
Yes, the SST39LF801C-55-4C-B3KE-T supports dual-layer protection: hardware block protection via WP# pin for the bottom 8 KWord, and JEDEC-standard software data protection (SDP) requiring verified six-byte command sequences for erase and three-byte sequences for program - both enabled by default at shipment.
What package type is used for the SST39LF801C-55-4C-B3KE-T?
The SST39LF801C-55-4C-B3KE-T is packaged in a 48-lead TSOP (12 mm × 20 mm, MO-142AC), as confirmed by Figure 2 and Table 1 in DS25041A. This standard footprint ensures mechanical and thermal compatibility with existing x16 memory socket layouts and automated assembly processes.
How does the SST39LF801C-55-4C-B3KE-T indicate completion of an erase or program operation?
The SST39LF801C-55-4C-B3KE-T provides three concurrent status mechanisms: toggling DQ6 (Toggle Bit), complemented DQ7 (Data# Polling), and open-drain RY/BY# output. All are valid after the rising edge of the sixth WE# pulse for erase or fourth WE# pulse for program, enabling flexible host-side timing verification.
Is the SST39LF801C-55-4C-B3KE-T RoHS compliant and lead-free?
Yes, the SST39LF801C-55-4C-B3KE-T is RoHS compliant, as explicitly stated in the datasheet preamble and packaging section of DS25041A. It meets EU Directive 2011/65/EU requirements and is qualified for lead-free reflow soldering per JEDEC J-STD-020.
SST39LF801C-55-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39LF801C-55-4C-B3KE-T FAQ
1.How can I place an order for SST39LF801C-55-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF801C-55-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF801C-55-4C-B3KE-T reliable?
The price and inventory of SST39LF801C-55-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF801C-55-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39LF801C-55-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF801C-55-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF801C-55-4C-B3KE-T?
SST39LF801C-55-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF801C-55-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF801C-55-4C-B3KE-T?
For technical support, including SST39LF801C-55-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF801C-55-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39LF801C-55-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39LF801C-55-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF801C-55-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39LF801C-55-4C-B3KE-T?
All SST39LF801C-55-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF801C-55-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF801C-55-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39LF801C-55-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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