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Microchip Technology SST39LF801C-55-4C-MAQE
- Part No.:
- SST39LF801C-55-4C-MAQE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-WFBGA
- Datasheet:
-
SST39LF801C-55-4C-MAQE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48WFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,139
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Product details
Overview
SST39LF801C-55-4C-MAQE from Microchip Technology is a 8 Mbit (512K × 16) low-voltage CMOS Multi-Purpose Flash Plus memory IC with 55 ns read access time, 3.0–3.6 V operating voltage, and bottom-boot block architecture. It delivers 100,000 program/erase cycles, >100 years data retention, and supports sector/block/chip erase for embedded firmware storage in industrial controllers and legacy system upgrades.
For engineers reviewing the SST39LF801C-55-4C-MAQE datasheet, SST39LF801C-55-4C-MAQE pinout, SST39LF801C-55-4C-MAQE application, or SST39LF801C-55-4C-MAQE equivalent, this page provides verified package mapping (48-ball WFBGA), JEDEC-compliant x16 interface timing, hardware write protection via WP#, RY/BY# status signaling, and SuperFlash®-enabled energy-efficient erase/program operations.
Technical Context
The SST39LF801C-55-4C-MAQE implements SST's proprietary SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed 7 µs word-program and 18 ms sector-erase times independent of endurance wear. Its JEDEC-standard x16 parallel interface uses latched address/data with CE#/OE#/WE# control logic and supports Auto Low Power mode (3 µA standby).
It features bottom-boot block protection (00000H–01FFFH), hardware reset (RST#), Ready/Busy# open-drain output requiring external pull-up, and dual status detection via DQ6 toggle bit and DQ7 Data# Polling - all compliant with Common Flash Memory Interface (CFI) and Software Data Protection (SDP) command sets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16 organization), directly replaces legacy 512K×16 NOR flash in pin-compatible designs |
| Read Access Time | 55 ns max - enables direct connection to 16-bit microcontrollers running at ≤18 MHz without wait states |
| Supply Voltage | 3.0–3.6 V - compatible with 3.3 V system rails; excludes 2.7 V operation found in VF-series variants |
| Endurance | 100,000 program/erase cycles - guarantees field reliability for firmware update cycles over 10+ years |
| Data Retention | >100 years - ensures nonvolatile storage integrity across product lifecycle without refresh |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (1×8K, 2×4K, 1×16K, 15×32K) - supports granular firmware partitioning |
| Write Protection | Hardware WP# pin protects bottom 8 KWord boot block (00000H–01FFFH) - prevents accidental bootloader corruption |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | A0–A17 select 512K words; A18 used only during CFI/ID/Security ID commands - no external A18 routing needed for standard read/write |
| DQ0–DQ15 | Data I/O (x16 bus) | Bi-directional CMOS-compatible bus; outputs tri-stated when CE# or OE# high; latched internally during write |
| CE# | Chip Enable | Active-low device selection - must be low for any operation; high = standby (3 µA) |
| OE# | Output Enable | Active-low read gating - controls DQ output drivers independently of CE# for multiplexed bus sharing |
| WE# | Write Enable | Active-low control for write cycles; latches address/data on falling/rising edges per JEDEC timing |
| WP# | Write Protect | Active-low hardware lock for bottom boot block (00000H–01FFFH); floating = internal pull-up = unprotected |
| RST# | Reset Input | Active-low hard reset - terminates ongoing erase/program and forces return to read mode within TRP |
| RY/BY# | Ready/Busy# Output | Open-drain status indicator - requires 10–100 kΩ pull-up; low = active erase/program, high = ready |
| VDD | Power Supply | 3.0–3.6 V core supply - decoupling capacitor required near ball; no internal VPP generation needed |
| VSS | Ground | Two dedicated ground balls (A1, H6) - mandatory for noise immunity in high-speed read operations |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide injector enables fixed 7 µs program/18 ms erase - eliminates de-rating over lifetime |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access - cuts power in burst-read embedded applications |
| Triple Write Detection | Simultaneous support for RY/BY#, DQ6 toggle, and DQ7 polling - allows flexible host firmware status polling strategy |
| Bottom Boot Block Protection | Hardware-locked 8 KWord region (00000H–01FFFH) - safeguards bootloader without software overhead |
| Security ID Space | Factory-programmed 128-bit ID + 128-word user space - enables secure device authentication and traceability |
| CFI Compliance | Full JEDEC CFI query table support (addresses 10H–2AH) - enables auto-detection and driver compatibility |
Applications
| Industrial PLC Firmware Storage | Legacy Embedded System Upgrade |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in DIN-rail mounted programmable logic controllers with 16-bit bus interfaces. IC Role / Device Role / Timing Role: Nonvolatile code storage with hardware boot-block protection and 55 ns read access to meet real-time scan cycle deadlines. Use Value: Bottom-boot architecture prevents accidental overwrite of startup routines during field updates; 100K-cycle endurance supports 5+ years of scheduled firmware revisions. |
Use Scenario: Replacing obsolete 512K×16 flash in medical diagnostic equipment requiring long-term component availability and RoHS compliance. IC Role / Device Role / Timing Role: Drop-in replacement for legacy parallel NOR flash with identical x16 JEDEC pinout and command set. Use Value: 3.0–3.6 V operation matches existing 3.3 V power design; WFBGA package enables compact PCB redesign without layer count increase. |
| Automotive Body Control Module | Point-of-Sale Terminal Configuration |
|
Use Scenario: Storing calibration tables and feature-enable bits in automotive BCMs operating across -40°C to +85°C ambient. IC Role / Device Role / Timing Role: High-reliability configuration memory with >100-year data retention and hardware write lock for safety-critical parameters. Use Value: WP#-enabled bottom-block protection ensures factory-calibrated values survive dealership reprogramming events. |
Use Scenario: Holding localized language packs, tax rate tables, and peripheral driver configurations in retail POS terminals deployed globally. IC Role / Device Role / Timing Role: Field-upgradable parameter storage supporting sector-erase granularity to minimize update time and wear. Use Value: Uniform 2 KWord sectors allow updating single language pack without erasing full 8 Mbit array - reduces downtime during store rollouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF801C-70-4C-MAQE | 70 ns read access; 2.7–3.6 V supply - wider voltage range but slower timing | Acceptable where 16-bit bus clock ≤14 MHz; unsuitable for 55 ns-critical timing paths | Select only if system margin allows 15 ns longer access; verify VDD stability down to 2.7 V |
| MX29LV800CTTC-70G | 70 ns access; 3.0–3.6 V; top-boot architecture; different command set and CFI layout | Requires firmware driver modification; boot block at 7E000H–7FFFFH instead of 00000H–01FFFH | Use only with full driver validation; not drop-in due to boot block location and erase command differences |
Compared with SST39LF801C-55-4C-MAQE, the VF801C variant trades speed for broader voltage tolerance, while the MX29LV800CTTC demands board-level and firmware changes - making SST39LF801C-55-4C-MAQE optimal for 3.3 V systems needing guaranteed 55 ns performance and bottom-boot security.
Availability
SST39LF801C-55-4C-MAQE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy embedded system upgrades, automotive body control modules, and point-of-sale terminal configuration requiring stable component supply and long-term lifecycle support.
Supply support for SST39LF801C-55-4C-MAQE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and integrates its SuperFlash® IP into high-reliability nonvolatile memory solutions for industrial, automotive, and aerospace markets.
The SST39LF801C-55-4C-MAQE belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered for cost-sensitive, long-lifecycle embedded systems requiring robust firmware storage with hardware-based data protection and JEDEC interoperability.
FAQ
What is the exact memory organization and density of the SST39LF801C-55-4C-MAQE?
The SST39LF801C-55-4C-MAQE is organized as 512K × 16, delivering 8 Mbit total capacity. Each word is 16 bits wide, addressing 524,288 unique locations. This x16 configuration matches standard 16-bit microcontroller buses and is distinct from x8 or x32 variants. The SST39LF801C-55-4C-MAQE uses bottom-boot block architecture, with protected memory spanning addresses 00000H–01FFFH.
Does the SST39LF801C-55-4C-MAQE require an external VPP voltage for programming?
No, the SST39LF801C-55-4C-MAQE does not require external VPP. It generates all necessary high-voltage programming signals internally using its on-chip charge pump. Operation is fully supported within the 3.0–3.6 V VDD range, eliminating need for auxiliary power supplies or level shifters. This simplifies design and improves reliability compared to older flash technologies requiring 12 V VPP.
How does hardware write protection work on the SST39LF801C-55-4C-MAQE?
Hardware write protection on the SST39LF801C-55-4C-MAQE is controlled by the WP# pin. When WP# is driven low, the bottom 8 KWord boot block (00000H–01FFFH) is locked against program and erase operations. If WP# is left unconnected, an internal pull-up holds it high, disabling protection. This mechanism operates independently of software commands and remains active even during power transitions.
What package type is used for the SST39LF801C-55-4C-MAQE, and what are its key mechanical features?
The SST39LF801C-55-4C-MAQE uses a 48-ball WFBGA (Wafer-Level Fine-Pitch Ball Grid Array) package, designated MAQE in Microchip's ordering nomenclature. It measures 4 mm × 6 mm with 0.5 mm ball pitch and includes a non-functional thermal pad on the bottom. This package offers superior signal integrity and board space savings versus TSOP, while maintaining JEDEC-standard x16 pinout compatibility.
Can the SST39LF801C-55-4C-MAQE be used in systems requiring Common Flash Interface (CFI) support?
Yes, the SST39LF801C-55-4C-MAQE fully supports CFI per JEDEC JESD68. Entering CFI Query mode via the 3-byte command sequence (555H/AAH → 2AAH/55H → 555H/98H) exposes standardized tables at addresses 10H–2AH, including vendor ID, device geometry, and timing parameters. This enables automatic driver initialization in Linux MTD and U-Boot environments without hardcoded timing assumptions.
SST39LF801C-55-4C-MAQE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-WFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WFBGA (6x4)
SST39LF801C-55-4C-MAQE FAQ
1.How can I place an order for SST39LF801C-55-4C-MAQE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF801C-55-4C-MAQE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF801C-55-4C-MAQE reliable?
The price and inventory of SST39LF801C-55-4C-MAQE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF801C-55-4C-MAQE is usually 5 days.
3.What payment methods are accepted for SST39LF801C-55-4C-MAQE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF801C-55-4C-MAQE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF801C-55-4C-MAQE?
SST39LF801C-55-4C-MAQE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF801C-55-4C-MAQE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF801C-55-4C-MAQE?
For technical support, including SST39LF801C-55-4C-MAQE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF801C-55-4C-MAQE requirements.
6.How does Aetrix verify that SST39LF801C-55-4C-MAQE is sourced from the original manufacturer or authorized distributors?
All SST39LF801C-55-4C-MAQE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF801C-55-4C-MAQE meets industry standards.
7.What is the process for return or replacement of SST39LF801C-55-4C-MAQE?
All SST39LF801C-55-4C-MAQE units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF801C-55-4C-MAQE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF801C-55-4C-MAQE part is unused and in its original packaging.
Return procedure for SST39LF801C-55-4C-MAQE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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