My Inquiry
My Account
Microchip Technology SST39LF802C-55-4C-EKE
- Part No.:
- SST39LF802C-55-4C-EKE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39LF802C-55-4C-EKE.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,202
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39LF802C-55-4C-EKE from Microchip Technology is a 8 Mbit (512K × 16) low-voltage CMOS Multi-Purpose Flash Plus memory IC with 55 ns read access time, 3.0–3.6 V operating voltage, and hardware top-block protection. It features uniform 2 KWord sector erase, flexible block architecture (including one 8 KWord top boot block), and SuperFlash® technology enabling 100,000 program/erase cycles and >100 years data retention. Used in embedded firmware storage for industrial controllers requiring reliable in-field updates.
For engineers reviewing the SST39LF802C-55-4C-EKE datasheet, SST39LF802C-55-4C-EKE pinout, SST39LF802C-55-4C-EKE application, or SST39LF802C-55-4C-EKE equivalent, key selection considerations include boot-block configuration (top vs. bottom), 16-bit bus interface timing, RY/BY# status signaling, and compatibility with JEDEC-standard x16 flash command sets in space-constrained industrial designs.
Technical Context
This device implements SST's proprietary SuperFlash® split-gate cell architecture with thick-oxide tunneling injector, delivering fixed erase/program times independent of cycle count-unlike conventional flash technologies where timing degrades over endurance life. Its JEDEC-compliant x16 interface supports standard microprocessor bus protocols with latched address/data and asynchronous command execution via CE#/OE#/WE# control.
The SST39LF802C-55-4C-EKE integrates hardware write protection (WP#) for the top 8 KWord boot block (7E000H–7FFFFH), RST# for hardware reset to read mode, and RY/BY# open-drain status output. It supports three software detection methods for write completion: Data# Polling (DQ7), Toggle Bits (DQ6/DQ2), and Ready/Busy# signaling-enabling robust system-level timing management without polling overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 16 (8 Mbit total); enables direct connection to 16-bit microcontroller data buses without glue logic. |
| Read Access Time | 55 ns (max); meets real-time boot code fetch requirements for ARM Cortex-M3/M4 and similar MCUs. |
| Supply Voltage | 3.0–3.6 V; compatible with standard 3.3 V system rails and eliminates need for separate VPP programming voltage. |
| Endurance | 100,000 program/erase cycles (typical); supports frequent firmware field updates in industrial gateways. |
| Data Retention | >100 years (typical); ensures long-term reliability in unattended infrastructure equipment. |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (1×8K, 2×4K, 1×16K, 15×32K); allows granular firmware partitioning and recovery. |
| Boot Block Protection | Top 8 KWord (7E000H–7FFFFH); safeguards bootloader region against accidental overwrite during application updates. |
Pinout & Package
Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, surface-mountable with standard reflow profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus; A18–A11 select sector during Sector-Erase; A18–A15 select block during Block-Erase. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; outputs valid data during Read when OE# and CE# are low; tri-stated otherwise. |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high; required low for all write operations. |
| OE# | Output Enable | Active-low output gate; controls data bus drive; must be low with CE# for valid Read access. |
| WE# | Write Enable | Active-low control for Program/Erase command latching; rising edge initiates internal operation. |
| WP# | Write Protect | Active-low hardware lock for top 8 KWord boot block; grounded to prevent inadvertent erase/program. |
| RST# | Hardware Reset | Active-low reset input; forces immediate return to Read mode, terminating any in-progress operation. |
| RY/BY# | Ready/Busy# | Open-drain status output; pulled low during Program/Erase; requires external 10–100 kΩ pull-up. |
| VDD | Power Supply | +3.0–3.6 V supply; powers core logic and SuperFlash® array; no external VPP needed. |
| VSS | Ground | Reference ground for all signals; two dedicated pins ensure low-noise operation. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with thick-oxide tunneling injector delivers fixed 7 µs Word-Program and 18 ms Sector-Erase times across full endurance life. |
| Erase-Suspend/Resume | Allows temporary halt of Sector/Block-Erase to read or program other regions-critical for real-time firmware update handlers. |
| Security ID Space | Factory-programmed 128-bit ID + user-programmable 128-word segment, locked after programming to prevent tampering. |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid Read access-ideal for battery-backed or energy-sensitive systems. |
| JEDEC Standard Compliance | Fully compatible with industry-standard x16 flash pinouts and command sets, enabling drop-in replacement in legacy designs. |
Applications
| Industrial PLC Firmware Storage | Medical Device Bootloader Memory |
|---|---|
|
Use Scenario: Storing and updating firmware images in programmable logic controllers deployed in factory automation environments with ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Nonvolatile code storage with top-boot block protection ensuring bootloader integrity during remote firmware upgrades over Modbus TCP. Use Value: 55 ns read access enables sub-100 ns instruction fetch latency; 100,000-cycle endurance supports quarterly security patch deployments over 10+ year product lifecycle. |
Use Scenario: Holding certified bootloader and diagnostic firmware in Class II medical imaging subsystems requiring traceable, immutable startup code. IC Role / Device Role / Timing Role: Secure, write-protected boot memory with hardware RST# and WP# ensuring deterministic recovery after power interruption. Use Value: Top 8 KWord hardware protection prevents corruption of FDA-approved bootloader; >100-year data retention satisfies regulatory archival requirements. |
| Telecom Edge Router Configuration | Automotive ADAS Camera Module |
|
Use Scenario: Storing runtime configuration tables and protocol stacks in carrier-grade small-cell base stations operating in extended temperature ranges. IC Role / Device Role / Timing Role: High-reliability configuration store supporting hot-swap firmware updates without service interruption. Use Value: Erase-suspend capability allows concurrent read of active config while background erasing obsolete parameter sectors-minimizing downtime. |
Use Scenario: Embedded firmware storage in automotive surround-view camera modules requiring AEC-Q100 Grade 3 qualification (−40°C to +105°C). IC Role / Device Role / Timing Role: Compact, low-power flash memory interfacing directly to TI TDA3x SoC via 16-bit parallel bus. Use Value: 48-ball WFBGA variant (pin-compatible with this TSOP) enables PCB footprint reuse; 3.0–3.6 V range aligns with vehicle 3.3 V rail tolerances. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4C-EKE | 70 ns read access; 2.7–3.6 V supply; identical pinout and command set. | Higher voltage tolerance suits mixed 2.7 V/3.3 V systems but slower timing limits high-speed MCU interfaces. | Select when wider supply range is required and 55 ns timing is not critical for boot latency. |
| MX29LV800CTTC-70G | 70 ns access; 2.7–3.6 V; 512K × 16; top-boot configuration; different command set and CFI structure. | Lacks Erase-Suspend and Security ID; requires firmware adaptation for command translation. | Choose for cost-sensitive volume production where SuperFlash® features are non-essential and legacy MX29 support exists. |
Compared with SST39LF802C-55-4C-EKE, the SST39VF802C-70-4C-EKE trades speed for broader voltage flexibility, while the MX29LV800CTTC-70G offers lower cost at the expense of advanced reliability features and secure identity functions.
Availability
SST39LF802C-55-4C-EKE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader memory, telecom edge router configuration, and automotive ADAS camera modules requiring stable component supply across multi-year production cycles.
Supply support for SST39LF802C-55-4C-EKE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global leader in microcontrollers, analog, FPGA, and memory solutions, acquired Silicon Storage Technology (SST) in 2010 to expand its nonvolatile memory portfolio.
The SST39LF802C-55-4C-EKE belongs to the Multi-Purpose Flash Plus (MPF+) family, designed specifically for embedded systems requiring fast, reliable, and secure firmware/code storage with minimal board space and power consumption.
FAQ
What is the boot block configuration of the SST39LF802C-55-4C-EKE?
The SST39LF802C-55-4C-EKE implements top-boot block protection, covering the highest 8 KWord address range (7E000H–7FFFFH). This configuration safeguards the bootloader region from accidental erase or program operations when WP# is grounded. Unlike the SST39LF801C variant, which protects the bottom 8 KWord, the SST39LF802C-55-4C-EKE is optimized for systems where startup code resides at the top of the memory map.
Does the SST39LF802C-55-4C-EKE require an external VPP voltage for programming?
No, the SST39LF802C-55-4C-EKE does not require an external VPP voltage. It uses internal charge pump circuitry to generate the necessary high voltage for erase and program operations from the standard 3.0–3.6 V VDD supply. This simplifies system design by eliminating the need for additional voltage rails or regulators, and is confirmed in the DS25041A datasheet section "Automatic Write Timing – Internal VPP Generation".
How is write completion detected on the SST39LF802C-55-4C-EKE?
The SST39LF802C-55-4C-EKE provides three independent methods: Data# Polling (DQ7 toggles until operation completes), Toggle Bits (DQ6 toggles during Program/Erase), and Ready/Busy# (RY/BY# pin goes high when ready). All methods are valid simultaneously; RY/BY# requires an external pull-up resistor. These mechanisms allow flexible host software implementation without fixed delay loops, as detailed in the "Write Operation Status Detection" section of DS25041A.
Is the SST39LF802C-55-4C-EKE pin-compatible with other devices in the SST39x802C family?
Yes, the SST39LF802C-55-4C-EKE shares identical pinout, command set, and electrical characteristics with SST39VF802C-70-4C-EKE and SST39LF802C-70-4C-EKE in the same 48-lead TSOP package. Differences are limited to access time (55 ns vs. 70 ns) and supply voltage range (3.0–3.6 V vs. 2.7–3.6 V), making them functionally interchangeable in designs where timing and voltage margins permit.
What packaging options are available for the SST39LF802C-55-4C-EKE?
The SST39LF802C-55-4C-EKE is offered in three RoHS-compliant packages: 48-lead TSOP (12 mm × 20 mm), 48-ball TFBGA (6 mm × 8 mm), and 48-ball WFBGA (4 mm × 6 mm). The "-EKE" suffix specifically denotes the 48-lead TSOP variant. All packages share identical pin assignments and functionality, enabling footprint scalability from prototyping (TSOP) to high-density production (WFBGA).
SST39LF802C-55-4C-EKE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39LF802C-55-4C-EKE FAQ
1.How can I place an order for SST39LF802C-55-4C-EKE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF802C-55-4C-EKE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF802C-55-4C-EKE reliable?
The price and inventory of SST39LF802C-55-4C-EKE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF802C-55-4C-EKE is usually 5 days.
3.What payment methods are accepted for SST39LF802C-55-4C-EKE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF802C-55-4C-EKE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF802C-55-4C-EKE?
SST39LF802C-55-4C-EKE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF802C-55-4C-EKE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF802C-55-4C-EKE?
For technical support, including SST39LF802C-55-4C-EKE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF802C-55-4C-EKE requirements.
6.How does Aetrix verify that SST39LF802C-55-4C-EKE is sourced from the original manufacturer or authorized distributors?
All SST39LF802C-55-4C-EKE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF802C-55-4C-EKE meets industry standards.
7.What is the process for return or replacement of SST39LF802C-55-4C-EKE?
All SST39LF802C-55-4C-EKE units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF802C-55-4C-EKE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF802C-55-4C-EKE part is unused and in its original packaging.
Return procedure for SST39LF802C-55-4C-EKE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39LF802C-55-4C-EKE Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
