My Inquiry
My Account
Microchip Technology SST39LF802C-55-4C-EKE-T
- Part No.:
- SST39LF802C-55-4C-EKE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
SST39LF802C-55-4C-EKE-T.pdf
- Description:
- IC FLASH 8MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,648
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39LF802C-55-4C-EKE-T from Microchip Technology is a 8 Mbit (512K × 16) low-voltage CMOS Multi-Purpose Flash Plus memory IC, designed for embedded firmware and configuration storage in industrial controllers and communication modules. It operates from 3.0–3.6 V, delivers 55 ns read access time, supports hardware block protection on the top 8 KWord boot sector, and features Erase-Suspend/Resume capability for real-time system responsiveness.
For engineers reviewing the SST39LF802C-55-4C-EKE-T datasheet, SST39LF802C-55-4C-EKE-T pinout, SST39LF802C-55-4C-EKE-T application, or SST39LF802C-55-4C-EKE-T equivalent, this page provides verified technical context, JEDEC-compliant x16 interface details, boot-block protection mapping, SuperFlash® endurance metrics, and validated alternative flash parts for legacy design refresh or supply continuity planning.
Technical Context
This device implements SST's proprietary SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. It conforms to JEDEC-standard x16 flash pinouts and command sets, supporting standard microprocessor bus interfacing without glue logic.
It integrates dual status detection-Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2)-plus open-drain RY/BY# output for hardware-ready signaling. The 48-ball WFBGA (4 mm × 6 mm) package matches JEDEC MO-240AC, and the device includes factory-programmed 128-bit Security ID plus 128-word user-programmable ID space.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16), providing 1 MB of nonvolatile storage for firmware images or parameter tables. |
| Read Access Time | 55 ns typical - enables direct execution from flash (XIP) at up to ~18 MHz system clock without wait states. |
| Supply Voltage Range | 3.0–3.6 V - compatible with 3.3 V logic systems and eliminates need for separate VPP programming voltage. |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in industrial deployments. |
| Data Retention | Greater than 100 years - ensures long-term reliability in unpowered storage applications like metering or medical logs. |
| Block Protection | Top 8 KWord hardware protection (7E000H–7FFFFH) - safeguards boot code against accidental overwrite during field upgrades. |
| Package | 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch) - optimized for high-density PCB layouts in space-constrained edge devices. |
Pinout & Package
Package: 48-ball WFBGA (JEDEC MO-240AC, 4 mm × 6 mm, 0.5 mm ball pitch), RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; AMS = A18 for sector/block selection. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# is high. |
| CE# | Chip Enable | Active-low chip select; device enters standby (3 µA) when high, enabling multi-chip memory expansion. |
| OE# | Output Enable | Active-low output gate; controls data bus drive without affecting internal state or power mode. |
| WE# | Write Enable | Controls timing of command latching and initiates internal Program/Erase operations on rising edge. |
| WP# | Write Protect | Hardware lock for top boot block; grounded to prevent Erase/Program on 7E000H–7FFFFH addresses. |
| RST# | Reset Input | Hardware abort of in-progress operations; forces return to Read mode within TRP (min 100 ns). |
| RY/BY# | Ready/Busy Output | Open-drain status signal requiring external 10–100 kΩ pull-up; low = active Program/Erase. |
| VDD | Power Supply | 3.0–3.6 V core supply; internally regulates charge pump for erase/program without external VPP. |
| VSS | Ground | Primary ground reference for all I/O and core logic; two dedicated VSS balls for noise immunity. |
| NC | No Connect | Unbonded balls (A2, A1, A0, NC positions per Figure 4); must be left floating or tied to VSS per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell architecture delivers fixed 7 µs program and 18 ms erase times across full lifecycle - eliminates software de-rating. |
| Erase-Suspend/Resume | Allows interrupting sector/block erase to read or program other regions - essential for real-time OS task scheduling. |
| Security ID Space | Factory-locked 128-bit ID + 128-word user-programmable ID - enables secure device authentication and traceability. |
| Auto Low Power Mode | Reduces active read current from 5 mA to 3 µA after valid access - cuts power by >99% during idle polling intervals. |
| JEDEC Compliance | Fully compatible with standard x16 flash command sets and pinouts - simplifies migration from legacy parallel NOR devices. |
Applications
| Industrial PLC Firmware Storage | Telecom Baseband Configuration |
|---|---|
Use Scenario: Storing boot code and field-upgradable firmware in programmable logic controllers operating in harsh environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile x16 parallel NOR flash serving as primary boot memory with hardware write protection on top boot sector. Use Value: 100,000-cycle endurance and >100-year data retention ensure firmware integrity over 15+ year product lifecycles without battery backup. |
Use Scenario: Holding radio calibration tables, protocol stacks, and DSP configuration parameters in 4G/LTE base station radios. IC Role / Device Role / Timing Role: High-speed configuration memory interfaced directly to ARM Cortex-A9 application processor via 16-bit bus. Use Value: 55 ns read access enables zero-wait-state XIP execution, reducing boot latency by 35% versus 70 ns alternatives. |
| Medical Diagnostic Imaging Bootloader | Automotive ADAS Camera Module |
Use Scenario: Securing bootloader and safety-critical initialization routines in FDA-cleared MRI and CT scanner control units. IC Role / Device Role / Timing Role: Trusted firmware storage with factory-programmed Security ID and user-lockable ID space for regulatory audit trails. Use Value: Hardware WP# protection prevents unauthorized modification of boot code during service, satisfying IEC 62304 Class C requirements. |
Use Scenario: Storing camera sensor initialization profiles and lens correction maps in automotive surround-view systems. IC Role / Device Role / Timing Role: Low-power configuration memory supporting rapid cold-boot (<500 ms) while meeting AEC-Q100 Grade 2 temperature specs. Use Value: Auto Low Power mode reduces standby current to 3 µA - extends module sleep-mode battery life by 12× versus standard flash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF802C-70-4C-EKE | Higher 70 ns read access time; 2.7–3.6 V operation; same 48-ball WFBGA package and pinout. | Lower performance margin for XIP; suitable where 55 ns timing is not required. | Select when cost sensitivity outweighs speed requirement and 2.7 V minimum supply is needed. |
| MX29LV800CTTC-70G | 70 ns access; 3.0–3.6 V; 48-TSOP package (not pin-compatible); lacks Erase-Suspend and Security ID. | Requires PCB redesign; no hardware suspend/resume or secure ID features. | Choose only if TSOP footprint is mandatory and advanced flash features are unnecessary. |
Compared with SST39LF802C-55-4C-EKE-T, the SST39VF802C-70-4C-EKE offers broader voltage tolerance but sacrifices 15 ns read speed, while the MX29LV800CTTC-70G requires board-level changes and omits critical reliability features like Erase-Suspend and Security ID - making the original part optimal for new designs demanding speed, security, and footprint continuity.
Availability
SST39LF802C-55-4C-EKE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom baseband configuration, medical diagnostic imaging bootloaders, and automotive ADAS camera modules requiring stable component supply across extended product lifecycles.
Supply support for SST39LF802C-55-4C-EKE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2016, integrating its SuperFlash® NOR flash portfolio into a broad MCU, analog, and memory solutions ecosystem.
The SST39LF802C-55-4C-EKE-T belongs to the Multi-Purpose Flash Plus (MPF+) family, engineered specifically for reliable, low-voltage firmware and configuration storage in industrial, medical, and communications equipment where long-term data integrity and real-time update capability are critical.
FAQ
What is the exact memory organization and density of the SST39LF802C-55-4C-EKE-T?
The SST39LF802C-55-4C-EKE-T is organized as 512K × 16, delivering 8 Mbit (1 megabyte) of nonvolatile storage. Its address space spans 00000H to 7FFFFH, with top-boot architecture protecting the uppermost 8 KWord (7E000H–7FFFFH) via hardware WP# control. This structure is explicitly confirmed in DS25041A Section "Product Description" and Table 4.
Does the SST39LF802C-55-4C-EKE-T support Erase-Suspend and Erase-Resume functionality?
Yes, the SST39LF802C-55-4C-EKE-T fully supports Erase-Suspend and Erase-Resume commands (B0H and 30H respectively), allowing interruption of sector or block erase to read or program other memory regions. This capability is documented in DS25041A Section "Erase-Suspend/Erase-Resume Commands" and enables deterministic real-time system behavior during firmware updates.
What package type and footprint does the SST39LF802C-55-4C-EKE-T use?
The SST39LF802C-55-4C-EKE-T uses a 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch), designated MO-240AC in JEDEC standards. Pin assignments match Figure 4 and Table 1 of DS25041A, with specific ball layout including dedicated VSS, VDD, and NC positions - distinct from TSOP or TFBGA variants in the same family.
How does hardware write protection work on the SST39LF802C-55-4C-EKE-T?
Hardware write protection on the SST39LF802C-55-4C-EKE-T is implemented via the WP# pin, which protects the top 8 KWord boot block (7E000H–7FFFFH). When WP# is driven low, Program and Erase operations to that region are blocked. If left floating, an internal pull-up holds WP# high, disabling protection - behavior confirmed in DS25041A Section "Hardware Block Protection" and Table 4.
Is the SST39LF802C-55-4C-EKE-T RoHS compliant and qualified for industrial temperature range?
Yes, the SST39LF802C-55-4C-EKE-T is RoHS compliant (stated on page 1 and 4 of DS25041A) and rated for industrial temperature operation (–40°C to +85°C), as specified in the "Ordering Information" section of the datasheet and supported by qualification testing per AEC-Q100 stress conditions for related SST39LF parts.
SST39LF802C-55-4C-EKE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 55 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
SST39LF802C-55-4C-EKE-T FAQ
1.How can I place an order for SST39LF802C-55-4C-EKE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39LF802C-55-4C-EKE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39LF802C-55-4C-EKE-T reliable?
The price and inventory of SST39LF802C-55-4C-EKE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF802C-55-4C-EKE-T is usually 5 days.
3.What payment methods are accepted for SST39LF802C-55-4C-EKE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF802C-55-4C-EKE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39LF802C-55-4C-EKE-T?
SST39LF802C-55-4C-EKE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39LF802C-55-4C-EKE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39LF802C-55-4C-EKE-T?
For technical support, including SST39LF802C-55-4C-EKE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF802C-55-4C-EKE-T requirements.
6.How does Aetrix verify that SST39LF802C-55-4C-EKE-T is sourced from the original manufacturer or authorized distributors?
All SST39LF802C-55-4C-EKE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF802C-55-4C-EKE-T meets industry standards.
7.What is the process for return or replacement of SST39LF802C-55-4C-EKE-T?
All SST39LF802C-55-4C-EKE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF802C-55-4C-EKE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39LF802C-55-4C-EKE-T part is unused and in its original packaging.
Return procedure for SST39LF802C-55-4C-EKE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39LF802C-55-4C-EKE-T Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
