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Microchip Technology SST39LF802C-55-4C-MAQE-T

Part No.:
SST39LF802C-55-4C-MAQE-T
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-WFBGA
Datasheet:
AetrixSST39LF802C-55-4C-MAQE-T.pdf
Description:
IC FLASH 8MBIT PARALLEL 48WFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,037

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Product details

Overview

SST39LF802C-55-4C-MAQE-T from Microchip Technology is a 8 Mbit (512K × 16) low-voltage CMOS Multi-Purpose Flash Plus memory IC with 55 ns read access time, 3.0–3.6 V single-supply operation, and hardware top-block protection. It features uniform 2 KWord sector erase, flexible block architecture (including one 8 KWord top boot block), and SuperFlash® technology enabling 100,000 program/erase cycles with >100 years data retention - deployed in embedded firmware storage for industrial controllers and network edge devices.

For engineers reviewing the SST39LF802C-55-4C-MAQE-T datasheet, SST39LF802C-55-4C-MAQE-T pinout, SST39LF802C-55-4C-MAQE-T application, or SST39LF802C-55-4C-MAQE-T equivalent, key selection considerations include its 48-ball WFBGA (4 mm × 6 mm) package, JEDEC-standard x16 parallel interface, RY/BY# status signaling, WP#-enabled top-boot block protection, and compatibility with standard microprocessor bus timing.

Technical Context

This device implements a split-gate SuperFlash® cell architecture with thick-oxide tunneling injector, delivering fixed erase/program times independent of cycle count - eliminating software de-rating required by conventional flash. Its command-set follows JEDEC-standard x16 flash protocols, supporting Software Data Protection (SDP) via six-byte sequences for sector/block/chip erase and three-byte sequences for word-program.

It integrates dual status detection: Data# Polling (DQ7) and Toggle Bits (DQ6/DQ2), plus open-drain RY/BY# output requiring external 10 kΩ–100 kΩ pull-up. The 48-ball WFBGA package uses AMS = A18 addressing, supports Auto Low Power mode (3 µA standby), and latches addresses on CE#/WE# falling edges with data latched on rising edges.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density8 Mbit (512K × 16 organization), directly maps to 1 MB address space with x16 data bus
Read Access Time55 ns - enables direct connection to 16-bit microcontrollers running at ≤18 MHz without wait states
Supply Voltage3.0–3.6 V - compatible with 3.3 V logic systems; no separate VPP required (internal generation)
Endurance100,000 program/erase cycles - supports field firmware updates over full product lifecycle
Data Retention>100 years - ensures long-term reliability in unpowered storage applications
Erase ArchitectureUniform 2 KWord sectors + flexible blocks (one 8 KWord top boot, fifteen 32 KWord, etc.) - enables granular firmware partitioning
Write ProtectionHardware top-block protection (7E000H–7FFFFH, 8 KWord) via WP# pin - prevents accidental overwrite of boot code

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm, ball pitch 0.5 mm), RoHS-compliant, bottom-side thermal pad not electrically connected.

Pin/Terminal Circuit Role Design Meaning
A0–A18Address InputsA0–A17 select 512K words; A18 (AMS) used for sector/block address decoding during erase commands
DQ0–DQ15Data I/O (x16)Bidirectional CMOS-compatible bus; tri-stated when CE# or OE# high; latched internally during write
CE#Chip EnableActive-low chip select - device enters standby (3 µA) when high; required low for all operations
OE#Output EnableActive-low output gate - controls DQ bus drive; high disables outputs (high-Z)
WE#Write EnableActive-low control for write cycles; latching edge defines command/data capture timing
WP#Write ProtectActive-low hardware lock for top 8 KWord boot block (7E000H–7FFFFH); floating = internal pull-up = unprotected
RST#ResetActive-low hardware reset - terminates ongoing erase/program and forces return to read mode
RY/BY#Ready/Busy#Open-drain status output - low = active erase/program; requires external pull-up; shared-bus ready signaling
VDDPower Supply3.0–3.6 V supply; powers core and I/O; internal charge pump generates programming voltage
VSSGroundReference for all signals and internal circuitry; two dedicated balls for low-inductance return path

Key Features

Feature Design Value
SuperFlash® TechnologySplit-gate cell with thick-oxide injector enables fixed 18 ms sector/block erase time across full endurance life - no software timing margin expansion needed
Erase-Suspend/ResumeAllows temporary halt of sector/block erase to read other locations or program non-suspended blocks - critical for real-time firmware update interrupt handling
Security ID SpaceFactory-programmed 128-bit ID + 128-word user-programmable space - supports device authentication and secure firmware binding
Auto Low Power ModeAutomatically transitions from 5 mA active read to 3 µA after valid read access - reduces average power in polling-based status detection
JEDEC x16 Standard CompliancePinout, command set, and timing fully align with JEDEC publication 100 - ensures drop-in replacement capability within legacy x16 flash designs

Applications

Industrial PLC Firmware Storage Network Router Boot Memory

Use Scenario: Storing boot loader and FPGA configuration bitstreams in programmable logic controllers operating in wide-temperature industrial environments.

IC Role / Device Role / Timing Role: Nonvolatile x16 parallel memory providing fast 55 ns read access to initialize CPU and peripherals at power-on.

Use Value: Top-block hardware protection (WP#) prevents corruption of critical boot code during field firmware updates via serial interface.

Use Scenario: Holding bootloader and OS kernel images in enterprise-grade Ethernet routers requiring secure, field-upgradable storage.

IC Role / Device Role / Timing Role: JEDEC-compliant flash memory interfaced directly to MIPS/ARM bus with RY/BY# handshake for deterministic erase timing.

Use Value: Erase-suspend capability allows background firmware validation while maintaining packet forwarding - zero service interruption during upgrade.

Medical Device Configuration Storage Automotive Infotainment Module

Use Scenario: Retaining calibration tables, user preferences, and regulatory compliance logs in Class II medical instruments with 10+ year service life.

IC Role / Device Role / Timing Role: High-reliability flash storing mission-critical parameters; accessed via microcontroller GPIO-banged or dedicated memory controller.

Use Value: >100-year data retention and 100,000-cycle endurance ensure integrity across full device lifetime without refresh cycles.

Use Scenario: Hosting HMI graphics assets and audio codec firmware in automotive head units subject to AEC-Q100 stress screening.

IC Role / Device Role / Timing Role: Low-power (3 µA standby) WFBGA flash integrated into space-constrained infotainment PCBs with thermal constraints.

Use Value: 4 mm × 6 mm WFBGA footprint minimizes board area vs. TSOP; 3.0–3.6 V operation matches automotive 3.3 V rail stability requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
SST39VF802C-70-4C-MAQE-T70 ns read access; 2.7–3.6 V supply; same 48-ball WFBGA package and pinoutHigher voltage range enables use with 2.7 V battery-backed systems; slower access limits max bus clockSelect when system operates below 3.0 V or requires wider voltage tolerance - not suitable for 55 ns timing-critical paths
MX29LV800CTTC-70G70 ns access; 3.0–3.6 V; 48-TSOP package; different command set (no CFI Query mode)Larger 12 mm × 20 mm TSOP footprint; lacks Erase-Suspend and Security ID featuresChoose for cost-sensitive, space-tolerant designs where firmware update concurrency and device authentication are not required

Compared with SST39LF802C-55-4C-MAQE-T, the SST39VF802C variant offers broader voltage support but sacrifices speed, while the MX29LV800C provides legacy compatibility at the cost of advanced features and package size - making the SST39LF802C-55-4C-MAQE-T optimal for compact, high-speed, secure firmware storage.

Availability

SST39LF802C-55-4C-MAQE-T is available at Aetrix Electronics and suitable for industrial PLCs, network edge routers, medical diagnostic equipment, and automotive infotainment modules requiring stable component supply across extended production lifecycles.

Supply support for SST39LF802C-55-4C-MAQE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and now develops, manufactures, and supports the SST SuperFlash® family of NOR flash memories.

The SST39LF802C belongs to the Multi-Purpose Flash Plus (MPF+) product line, engineered for embedded systems requiring reliable, low-power, and secure firmware and configuration storage with minimal board footprint.

FAQ

What is the exact memory organization and density of the SST39LF802C-55-4C-MAQE-T?

The SST39LF802C-55-4C-MAQE-T is organized as 512K × 16, delivering 8 Mbit (1,048,576 bytes) of nonvolatile storage. Each address selects a 16-bit word, resulting in a linear 512K-word address space spanning 00000H to 7FFFFH. This x16 configuration enables efficient data transfer with 16-bit microcontrollers and DSPs without byte-lane multiplexing.

Does the SST39LF802C-55-4C-MAQE-T support hardware write protection, and how is it configured?

Yes, the SST39LF802C-55-4C-MAQE-T implements hardware top-block protection via the WP# pin. When WP# is driven low, the top 8 KWord block (7E000H–7FFFFH) is locked against program and erase operations. If WP# is left floating, an internal pull-up holds it high, disabling protection. This mechanism safeguards boot code without requiring software intervention or fuse programming.

What package type and dimensions does the SST39LF802C-55-4C-MAQE-T use?

The SST39LF802C-55-4C-MAQE-T is packaged in a 48-ball WFBGA (Wafer-Level Fine-Pitch Ball Grid Array) measuring 4 mm × 6 mm with 0.5 mm ball pitch. It features a bottom thermal pad that is not electrically connected. This compact, low-profile package supports high-density PCB layouts typical in networking and automotive modules.

How does the SST39LF802C-55-4C-MAQE-T indicate completion of erase or program operations?

The SST39LF802C-55-4C-MAQE-T provides three concurrent status mechanisms: (1) RY/BY# open-drain output (low = busy), (2) Data# Polling on DQ7 (complement → true data transition), and (3) Toggle Bit on DQ6 (toggling → steady state). All are valid after the sixth WE# pulse for erase and fourth WE# pulse for program - enabling flexible, robust host-side timing control.

Is the SST39LF802C-55-4C-MAQE-T compatible with JEDEC-standard x16 flash interfaces?

Yes, the SST39LF802C-55-4C-MAQE-T conforms fully to JEDEC Standard JESD21-C for x16 parallel NOR flash pinouts, command sets, and timing. It supports standard read, word-program, sector/block/chip erase, and software ID/CFI query modes - ensuring interoperability with existing x16 flash controllers and BIOS/firmware stacks without modification.

SST39LF802C-55-4C-MAQE-T Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-WFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
8Mbit
Memory Organization:
512K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
55 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-WFBGA (6x4)

SST39LF802C-55-4C-MAQE-T FAQ

1.How can I place an order for SST39LF802C-55-4C-MAQE-T through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39LF802C-55-4C-MAQE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39LF802C-55-4C-MAQE-T reliable?

The price and inventory of SST39LF802C-55-4C-MAQE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39LF802C-55-4C-MAQE-T is usually 5 days.

3.What payment methods are accepted for SST39LF802C-55-4C-MAQE-T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39LF802C-55-4C-MAQE-T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39LF802C-55-4C-MAQE-T?

SST39LF802C-55-4C-MAQE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39LF802C-55-4C-MAQE-T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39LF802C-55-4C-MAQE-T?

For technical support, including SST39LF802C-55-4C-MAQE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39LF802C-55-4C-MAQE-T requirements.

6.How does Aetrix verify that SST39LF802C-55-4C-MAQE-T is sourced from the original manufacturer or authorized distributors?

All SST39LF802C-55-4C-MAQE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39LF802C-55-4C-MAQE-T meets industry standards.

7.What is the process for return or replacement of SST39LF802C-55-4C-MAQE-T?

All SST39LF802C-55-4C-MAQE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39LF802C-55-4C-MAQE-T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39LF802C-55-4C-MAQE-T part is unused and in its original packaging.

Return procedure for SST39LF802C-55-4C-MAQE-T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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