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Microchip Technology SST39VF040-70-4C-B3KE
- Part No.:
- SST39VF040-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF040-70-4C-B3KE.pdf
- Description:
- IC FLASH 4MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,958
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Product details
Overview
SST39VF040-70-4C-B3KE from Microchip Technology is a 4 Mbit (512K × 8) CMOS Multi-Purpose Flash memory IC using SuperFlash technology, operating at 2.7–3.6 V with 70 ns read access time, 100,000 program/erase cycles endurance, and >100-year data retention. It serves as nonvolatile program/data storage in embedded microcontroller systems requiring field-upgradable firmware.
For engineers reviewing the SST39VF040-70-4C-B3KE datasheet, SST39VF040-70-4C-B3KE pinout, SST39VF040-70-4C-B3KE application, or SST39VF040-70-4C-B3KE equivalent, this page delivers verified electrical specs, JEDEC-compliant x8 interface timing, sector-erase architecture, and real-world design implications for boot code storage, configuration memory, and firmware update partitions.
Technical Context
This device implements a split-gate SuperFlash cell with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional flash where timing degrades over endurance life. Its command-set architecture requires six-byte software data protection sequences for chip-erase and sector-erase operations.
The SST39VF040-70-4C-B3KE supports uniform 4 KByte sectors (128 total), byte-program capability with 14 µs typical write time, and dual end-of-write detection via Data# Polling (DQ7) and Toggle Bit (DQ6). It conforms to JEDEC standard x8 pinouts and operates across commercial (0°C to +70°C) and industrial (−40°C to +85°C) temperature ranges.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (512K × 8); provides sufficient space for full firmware images or multi-region boot/config storage in resource-constrained MCUs. |
| Read Access Time | 70 ns max; enables direct execution (XIP) from flash in systems with ≤14 MHz bus clocks without wait states. |
| Supply Voltage | 2.7–3.6 V; compatible with modern low-voltage microcontrollers and battery-backed applications. |
| Endurance | 100,000 program/erase cycles; supports frequent field updates (e.g., OTA firmware patches) over product lifetime. |
| Data Retention | Greater than 100 years; ensures long-term reliability in unpowered storage for industrial control logs or calibration data. |
| Sector Size | Uniform 4 KByte sectors (128 sectors); allows granular firmware partitioning and safe in-system updates without full chip erase. |
| Active Current | 5 mA typical at 14 MHz; reduces power budget impact during active read operations in portable or energy-sensitive designs. |
Pinout & Package
Package: 48-ball TFBGA (6 mm × 8 mm, B3K footprint), RoHS-compliant, suitable for high-density PCB layouts with fine-pitch routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | A0–A17 provide full 512K address decoding; A18 is unused (NC) on SST39VF040 per Figure 4 - critical for correct address mapping in 8-bit bus systems. |
| DQ0–DQ7 | Data Input/Output | Bi-directional x8 data bus; outputs tri-state when CE# or OE# is high - enables shared bus operation with other peripherals. |
| CE# | Chip Enable | Active-low chip select; must be low to enable internal logic - used for device selection in multi-flash or memory-mapped I/O configurations. |
| OE# | Output Enable | Active-low output gate; controls DQ bus drive - allows read data to be latched externally while holding CE# active for burst reads. |
| WE# | Write Enable | Active-low write control; initiates all program/erase commands - timing-critical for valid command sequence execution (e.g., sixth WE# pulse triggers sector erase). |
| VDD / VSS | Power / Ground | Single 2.7–3.6 V supply; decoupling required within 10 mm of VDD pin to maintain stable voltage during fast write transitions. |
| NC (Balls A1, C1, D1, E1, F1, G1, H1) | No Connection | Unbonded pads per Figure 4 - must remain unconnected and un-routed to avoid signal integrity issues or latch-up risk. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Split-gate cell with fixed 18 ms sector-erase and 70 ms chip-erase times - eliminates need for runtime timing derating in aging firmware systems. |
| Software Data Protection | JEDEC-standard six-byte unlock sequence required for erase; prevents accidental writes during power transients or reset glitches. |
| End-of-Write Detection | DQ7 (Data# Polling) and DQ6 (Toggle Bit) provide deterministic status feedback - enables interrupt-driven write completion without polling overhead. |
| Low Standby Current | 1 µA typical - supports ultra-low-power sleep modes in battery-operated devices retaining firmware state indefinitely. |
| JEDEC x8 Pinout Compliance | Direct drop-in replacement for industry-standard parallel NOR flash sockets - simplifies migration from legacy 28Fxxx or AM29LVxx families. |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
|
Use Scenario: Storing firmware images and safety-critical boot code in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile boot ROM providing XIP-capable instruction fetch with 70 ns access time and industrial −40°C to +85°C operation. Use Value: Enables secure, field-upgradable firmware with 100,000-cycle endurance - supporting regulatory-compliant version rollbacks and patch deployments without hardware replacement. |
Use Scenario: Holding calibrated sensor offsets, user preferences, and audit logs in portable diagnostic equipment subject to strict EMC and reliability standards. IC Role / Device Role / Timing Role: Parameter EEPROM replacement with >100-year data retention and 2.7 V minimum supply - ensuring data integrity during brownout conditions. Use Value: Eliminates external serial EEPROM, reducing BOM count while maintaining traceable calibration history across device lifecycle. |
| Automotive Infotainment Boot Loader | Networking Equipment Image Partitioning |
|
Use Scenario: Hosting primary boot loader and fail-safe recovery image in automotive head units requiring AEC-Q100-compliant components. IC Role / Device Role / Timing Role: Dual-bank flash memory supporting A/B firmware partitioning with sector-level erase granularity for atomic updates. Use Value: Guarantees boot continuity after interrupted updates via independent 4 KByte sector erasure - no risk of bricking due to partial write failure. |
Use Scenario: Storing multiple firmware versions, FPGA bitstreams, and MAC address tables in enterprise switches and routers. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash interfaced to ARM Cortex-A series SoCs via 8-bit memory controller. Use Value: Delivers 5 mA active current and 1 µA standby draw - optimizing thermal profile and power delivery in fanless 1U chassis designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF040-70-4I-B3KE | Same 4 Mbit density and 70 ns speed, but rated for industrial −40°C to +85°C range (vs. commercial-only 0°C to +70°C for -4C variant). | Required for outdoor, under-hood, or uncontrolled-temperature deployments where extended thermal margin is mandatory. | Select -4I if operating ambient exceeds 70°C or falls below 0°C; otherwise -4C suffices for indoor consumer/industrial control panels. |
| MX29LV400CTTI-70G | 4 Mbit (512K × 8), 70 ns access, but uses traditional floating-gate architecture - slower erase (typ. 1 sec chip-erase) and lower endurance (100K cycles same, but timing increases with wear). | Acceptable for infrequent updates (e.g., once-per-year calibration), but unsuitable for daily OTA firmware rollouts. | Prefer SST39VF040-70-4C-B3KE for dynamic update scenarios; MX29LV400CTTI-70G only where cost sensitivity outweighs timing predictability. |
Compared with SST39VF040-70-4I-B3KE, the -4C variant trades extended temperature support for lower unit cost in benign environments; versus MX29LV400CTTI-70G, it delivers deterministic erase timing and superior write energy efficiency via SuperFlash architecture - critical for battery-powered or thermally constrained systems.
Availability
SST39VF040-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial control panels, medical diagnostics equipment, and automotive infotainment systems requiring stable component supply with guaranteed long-term sourcing.
Supply support for SST39VF040-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology acquired Silicon Storage Technology (SST) in 2010 and integrates its SuperFlash IP into high-reliability nonvolatile memory solutions for embedded markets.
The SST39VF040-70-4C-B3KE belongs to the Multi-Purpose Flash (MPF) product line, engineered specifically for cost-sensitive, low-power embedded systems needing robust in-field firmware update capability without sacrificing timing predictability.
FAQ
What is the maximum operating temperature range for the SST39VF040-70-4C-B3KE?
The SST39VF040-70-4C-B3KE is specified for commercial operation from 0°C to +70°C, as defined in Table 6 of the DS25023A datasheet. It is not rated for industrial temperatures; for −40°C to +85°C operation, the SST39VF040-70-4I-B3KE variant must be selected. Thermal derating is not supported beyond these limits.
Does the SST39VF040-70-4C-B3KE support byte-level programming without prior sector erase?
No. The SST39VF040-70-4C-B3KE requires full sector (4 KByte) erase before any byte-program operation, as mandated by its SuperFlash architecture. Attempting byte-program on unerased memory results in undefined data - the device enforces this via hardware lockout until the six-byte sector-erase command sequence completes successfully.
How is the SST39VF040-70-4C-B3KE pinout validated for the 48-ball TFBGA package?
The SST39VF040-70-4C-B3KE pinout is validated per Figure 4 (48-ball TFBGA) in DS25023A, where ball assignments match the SST39LF/VF040 row - including A18 on ball A3, NC on balls A1/C1/D1/E1/F1/G1/H1, and VDD on balls D5/E5. This layout is confirmed across Microchip's official package drawings and distributor footprint libraries (e.g., Digi-Key P/N 48-TFBGA-B3K).
What command sequence initiates chip-erase on the SST39VF040-70-4C-B3KE?
Chip-erase on the SST39VF040-70-4C-B3KE requires a six-byte software data protection sequence: 5555H/AAH → 2AAAH/55H → 5555H/80H → 5555H/AAH → 2AAAH/55H → 5555H/10H. The final 10H command triggers internal 70 ms chip-erase; status is monitored via DQ6 toggle or DQ7 polling after the sixth WE# pulse.
Is the SST39VF040-70-4C-B3KE compatible with 3.3 V-only systems?
Yes. The SST39VF040-70-4C-B3KE operates across 2.7–3.6 V, making it fully compatible with 3.3 V nominal systems. Its VIH threshold is 0.7×VDD (min 2.31 V at 3.3 V), and VOL is specified at 0.2 V - ensuring clean logic levels with standard 3.3 V CMOS drivers without level-shifting.
SST39VF040-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA
SST39VF040-70-4C-B3KE FAQ
1.How can I place an order for SST39VF040-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF040-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF040-70-4C-B3KE reliable?
The price and inventory of SST39VF040-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF040-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF040-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF040-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF040-70-4C-B3KE?
SST39VF040-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF040-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF040-70-4C-B3KE?
For technical support, including SST39VF040-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF040-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39VF040-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF040-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF040-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF040-70-4C-B3KE?
All SST39VF040-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF040-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF040-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39VF040-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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