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Microchip Technology SST39VF1601-70-4C-B3KE

Part No.:
SST39VF1601-70-4C-B3KE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39VF1601-70-4C-B3KE.pdf
Description:
IC FLASH 16MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,185

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Product details

Overview

SST39VF1601-70-4C-B3KE from Microchip Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus memory IC with 70 ns read access time, single 2.7–3.6 V supply operation, and bottom 32 KWord hardware block protection. It supports sector-erase (2 KWord), block-erase (32 KWord), chip-erase, and erase-suspend/resume functions, and is used in embedded firmware storage for industrial controllers and legacy communication modules requiring nonvolatile code retention.

For engineers reviewing the SST39VF1601-70-4C-B3KE datasheet, SST39VF1601-70-4C-B3KE pinout, SST39VF1601-70-4C-B3KE application, or SST39VF1601-70-4C-B3KE equivalent, key selection considerations include JEDEC-standard x16 asynchronous interface compatibility, TSOP-48 package footprint, 100,000-cycle endurance, 100-year data retention, and hardware write-protection via WP# for boot-block integrity.

Technical Context

The SST39VF1601-70-4C-B3KE implements SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. Its command-set architecture conforms to JEDEC standard flash pinouts and supports software data protection (SDP) with three-byte unlock sequences for program and six-byte sequences for erase operations.

It features dual status detection (DQ7 Data# Polling and DQ6/DQ2 Toggle Bits) for end-of-write verification, Auto Low Power mode reducing active read current from 9 mA to 3 µA after valid access, and CFI Query support for runtime device characterization. The RST# pin provides hardware reset to Read mode with guaranteed recovery timing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 Mbit (1M × 16 organization), directly maps to 2 MB addressable space
Read Access Time70 ns - determines maximum bus clock rate for zero-wait-state reads in 8051/ARM7-based systems
Supply Voltage2.7–3.6 V - compatible with 3.3 V logic rails without level-shifting
Endurance100,000 program/erase cycles - supports field firmware updates over 10+ years in industrial logging applications
Data Retention>100 years - ensures firmware integrity across product lifecycle without refresh
Erase Granularity2 KWord sectors / 32 KWord blocks - enables fine-grained firmware patching and robust bootloader partitioning
Write ProtectionHardware bottom 32 KWord block protection via WP# - prevents accidental overwrite of boot code region (000000H–007FFFH)

Pinout & Package

Package: 48-lead TSOP (12 mm × 20 mm), RoHS-compliant, standard JEDEC MO-142AC footprint.

Pin/TerminalCircuit RoleDesign Meaning
A0–A19Address InputsA0–A18 used for 1M×16 addressing; A19 selects top/bottom boot block per JEDEC standard
DQ0–DQ15Data I/Ox16 bidirectional bus with internal latching; tri-stated when CE# or OE# high
CE#Chip EnableActive-low chip select; device enters standby (3 µA) when high
OE#Output EnableActive-low output gate; controls data bus visibility during read cycles
WE#Write EnableActive-low control for program/erase command latching and internal timing initiation
WP#Write ProtectActive-low hardware lock for bottom 32 KWord boot block (000000H–007FFFH)
RST#ResetActive-low hardware abort of ongoing erase/program; forces return to Read mode within TRP
VDD, VSSPower/GroundSingle 2.7–3.6 V supply; decoupling required per JEDEC layout guidelines

Key Features

FeatureDesign Value
Erase-Suspend/ResumeAllows real-time read access during erase, enabling system responsiveness in interrupt-driven firmware update routines
Security ID256-bit factory + user programmable ID space (128 + 128 bits), locked post-programming to prevent tampering
Auto Low Power ModeReduces active read current from 9 mA to 3 µA after valid access-critical for battery-backed controller sleep modes
SuperFlash ReliabilityFixed 7 µs word-program and 18 ms sector/block-erase times regardless of accumulated cycles-eliminates software de-rating
JEDEC CFI SupportEnables runtime identification of geometry, timing, and command set-simplifies BSP portability across flash vendors

Applications

Industrial PLC Firmware StorageLegacy Telecom Baseband Code Memory

Use Scenario: Storing ladder logic firmware and configuration parameters in DIN-rail mounted programmable logic controllers operating at -40°C to +85°C.

IC Role / Device Role / Timing Role: Nonvolatile x16 parallel boot memory mapped at reset vector; accessed via 70 ns read cycle for deterministic startup.

Use Value: Bottom-block hardware protection (WP#) prevents corruption of critical boot code during brown-out or ESD events.

Use Scenario: Holding DSP microcode and protocol stacks in TDM-based voice gateway equipment with long service life requirements.

IC Role / Device Role / Timing Role: Asynchronous code execution memory interfaced to SH-3 or MIPS32 processors; supports in-field firmware patches via sector-erase.

Use Value: 100,000-cycle endurance and >100-year data retention ensure 15+ year field deployment without memory degradation.

Medical Diagnostic Instrument BootloaderAutomotive Body Control Module (BCM) Configuration

Use Scenario: Secure storage of bootloader and calibration tables in FDA-cleared ultrasound imaging systems requiring traceable firmware revision control.

IC Role / Device Role / Timing Role: Dual-role memory: boot code execution + secure parameter storage; leverages Security ID for device authentication.

Use Value: Erase-suspend capability allows real-time diagnostic data logging during background firmware validation.

Use Scenario: Retaining vehicle-specific configuration data (e.g., door module settings, lighting profiles) across ignition cycles in 12 V automotive environments.

IC Role / Device Role / Timing Role: Low-voltage (2.7 V min) flash memory interfaced to 8-bit MCU; WP# tied low to protect factory-configured EEPROM shadow region.

Use Value: Auto Low Power mode reduces quiescent current to 3 µA-meets ISO 16750-2 sleep current requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SST39VF1601C-70-4C-B3KEPin-compatible successor with enhanced ESD rating (4 kV HBM) and updated reliability screening; same 70 ns timing and TSOP-48 packageRecommended for new designs per Microchip notice; identical boot-block protection and command setSelect when designing new products requiring full manufacturer support and extended lifecycle availability
MX29LV160ETTI-70G16 Mbit x16 flash with 70 ns access, but uses different command set (Spansion/AMD-style), no CFI support, and top-boot block protection onlyRequires firmware driver modification; incompatible WP# protection region (top vs. bottom 32 KWord)Consider only for drop-in replacement in existing Spansion-based designs where bottom-block protection is not required

Compared with SST39VF1601-70-4C-B3KE, the SST39VF1601C-70-4C-B3KE offers identical functionality with improved manufacturability and long-term supply assurance, while the MX29LV160ETTI-70G demands hardware and software revalidation due to command-set and protection architecture differences.

Availability

SST39VF1601-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial control, legacy telecom infrastructure, and medical diagnostics requiring stable component supply and long-term obsolescence management.

Supply support for SST39VF1601-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company delivering smart, connected, and secure embedded control solutions, acquired Silicon Storage Technology (SST) in 2010.

The SST39VF1601-70-4C-B3KE belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for cost-sensitive, high-reliability embedded systems requiring robust firmware storage with hardware-level boot protection and JEDEC interoperability.

FAQ

What is the memory organization and density of the SST39VF1601-70-4C-B3KE?

The SST39VF1601-70-4C-B3KE is organized as 1M × 16, providing 16 Mbit (2 MB) of nonvolatile storage. This x16 parallel interface supports direct connection to 16-bit microcontrollers and DSPs without data multiplexing. Its density and addressing scheme (A0–A18) are fully defined in the SST39VF1601-70-4C-B3KE datasheet Table 9, confirming 512 uniform 4 KB sectors and 32 uniform 64 KB blocks.

Does the SST39VF1601-70-4C-B3KE support hardware write protection, and how is it configured?

Yes, the SST39VF1601-70-4C-B3KE implements bottom 32 KWord hardware block protection via the WP# pin. When WP# is driven low, program and erase operations are disabled for addresses 000000H–007FFFH-the boot block region. This protection is active regardless of software commands and remains effective during power transitions, making it essential for safeguarding bootloader code in the SST39VF1601-70-4C-B3KE.

What are the supported erase methods for the SST39VF1601-70-4C-B3KE, and what are their typical durations?

The SST39VF1601-70-4C-B3KE supports sector-erase (2 KWord), block-erase (32 KWord), and chip-erase. Typical durations are 18 ms for sector/block-erase and 40 ms for chip-erase, all internally timed and independent of cycle count due to SuperFlash technology. These values are measured under standard conditions (VDD = 3.0 V, TA = 25°C) and confirmed in the SST39VF1601-70-4C-B3KE datasheet Section 1.

How does the SST39VF1601-70-4C-B3KE indicate completion of a program or erase operation?

The SST39VF1601-70-4C-B3KE provides two hardware-supported status detection methods: Data# Polling on DQ7 (complement-to-data during operation, true data upon completion) and Toggle Bit on DQ6 (toggles between 0/1 during operation, stops toggling when complete). Both are valid after the rising edge of the fourth (program) or sixth (erase) WE# pulse, as specified in the SST39VF1601-70-4C-B3KE timing diagrams.

Is the SST39VF1601-70-4C-B3KE still recommended for new designs, and what is the suggested alternative?

No, the SST39VF1601-70-4C-B3KE is marked "Not Recommended for New Designs" per Microchip DS25028A (08/11). The officially recommended replacement is SST39VF1601C-70-4C-B3KE, which maintains pin, package, and functional compatibility while offering enhanced ESD performance and updated manufacturing process control for sustained availability.

SST39VF1601-70-4C-B3KE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (6x8)

SST39VF1601-70-4C-B3KE FAQ

1.How can I place an order for SST39VF1601-70-4C-B3KE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF1601-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF1601-70-4C-B3KE reliable?

The price and inventory of SST39VF1601-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1601-70-4C-B3KE is usually 5 days.

3.What payment methods are accepted for SST39VF1601-70-4C-B3KE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1601-70-4C-B3KE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF1601-70-4C-B3KE?

SST39VF1601-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF1601-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF1601-70-4C-B3KE?

For technical support, including SST39VF1601-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1601-70-4C-B3KE requirements.

6.How does Aetrix verify that SST39VF1601-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?

All SST39VF1601-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1601-70-4C-B3KE meets industry standards.

7.What is the process for return or replacement of SST39VF1601-70-4C-B3KE?

All SST39VF1601-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1601-70-4C-B3KE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF1601-70-4C-B3KE part is unused and in its original packaging.

Return procedure for SST39VF1601-70-4C-B3KE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SST39VF1601-70-4C-B3KE Tags

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