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Microchip Technology SST39VF1601C-70-4C-B3KE
- Part No.:
- SST39VF1601C-70-4C-B3KE
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF1601C-70-4C-B3KE.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:753
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Product details
Overview
SST39VF1601C-70-4C-B3KE from Microchip Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC with 70 ns read access time, single 2.7–3.6 V supply operation, and bottom-boot block protection. It supports sector/block/chip erase, hardware write protection via WP#, and erase-suspend/resume for real-time firmware updates in embedded controllers.
For engineers reviewing the SST39VF1601C-70-4C-B3KE datasheet, SST39VF1601C-70-4C-B3KE pinout, SST39VF1601C-70-4C-B3KE application, or SST39VF1601C-70-4C-B3KE equivalent, key selection criteria include boot-block architecture (bottom 8 KWord protected), JEDEC-compliant x16 interface timing, SuperFlash® endurance (100,000 cycles), and RY/BY# status signaling for system-level write coordination.
Technical Context
The SST39VF1601C-70-4C-B3KE implements SST's proprietary SuperFlash® technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. Its functional block diagram integrates Y/X decoders, I/O buffers with latched data, and control logic supporting standard microprocessor bus protocols.
It conforms to JEDEC-standard x16 flash pinouts and command sets, uses toggle-bit (DQ6/DQ2) and data-polling (DQ7) for end-of-write detection, and includes hardware reset (RST#), ready/busy (RY/BY#), and security ID (128-bit factory + 128-word user) features - all operating within 2.7–3.6 V supply range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1M × 16 organization) |
| Read Access Time | 70 ns - determines minimum bus cycle duration for reliable read operations |
| Supply Voltage | 2.7–3.6 V - enables direct interfacing with 3.3 V logic systems without level shifters |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
| Data Retention | >100 years - ensures nonvolatile storage integrity in unpowered industrial environments |
| Erase Architecture | Uniform 2 KWord sectors + flexible blocks (eight 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord) - enables granular firmware partitioning |
| Boot Block Protection | Bottom 8 KWord (00000H–01FFFH) - safeguards bootloader code against accidental overwrite |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 16-bit address bus (A0–A15) plus 4 MSB (A16–A19) for sector/block selection during erase |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with internal latching; tri-stated when CE# or OE# high |
| CE# | Chip Enable | Active-low chip select; device enters standby when high, consuming only 3 µA |
| OE# | Output Enable | Active-low output gate; controls data bus visibility during read cycles |
| WE# | Write Enable | Active-low control for program/erase command sequencing and data latching |
| WP# | Write Protect | Active-low hardware lock for bottom boot block (00000H–01FFFH); floating = unprotected |
| RST# | Hardware Reset | Active-low signal forcing immediate return to read mode; terminates in-progress operations |
| RY/BY# | Ready/Busy# | Open-drain status output indicating active program/erase; requires external 10–100 kΩ pull-up |
| VDD | Power Supply | 2.7–3.6 V core and I/O supply; no separate VCCIO required |
| VSS | Ground | Common reference for all signals and power domains |
| NC | No Connection | Unbonded pins (e.g., A19 on TSOP variant); must be left unconnected |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash® Technology | Fixed 7 µs word-program and 18 ms sector/block erase times - eliminates software de-rating across lifecycle |
| Erase-Suspend/Resume | Allows real-time read access to non-suspended sectors during background erase - critical for fail-safe OTA updates |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid access - cuts dynamic power in burst-read applications |
| Security ID Space | Factory-programmed 128-bit ID + 128-word user space with lock-out - enables secure device authentication and firmware binding |
| JEDEC Compliance | Fully compatible with industry-standard x16 flash command sets and pinouts - simplifies migration from legacy NOR devices |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Bootloader |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with periodic field upgrades. IC Role / Device Role / Timing Role: Nonvolatile program memory holding boot code and application firmware; accessed via parallel x16 bus during cold start and update cycles. Use Value: Bottom-boot protection prevents corruption of startup routines during partial reflash; 100,000-cycle endurance supports >10 years of scheduled maintenance updates. | Use Scenario: Hosting secure bootloader and safety-critical initialization code in automotive head units requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary boot memory mapped at reset vector; verified via Security ID before executing signed firmware images. Use Value: Factory-programmed 128-bit ID enables cryptographic binding to OEM keys; 70 ns access meets tight boot timing budgets in multi-core SoC systems. |
| Medical Device Configuration Memory | Networking Equipment Feature Licensing |
Use Scenario: Retaining calibration parameters, user preferences, and regulatory configuration profiles in portable diagnostic equipment. IC Role / Device Role / Timing Role: Parameter storage accessed during power-on self-test and runtime configuration reads/writes. Use Value: >100-year data retention guarantees parameter integrity across device shelf life; hardware WP# prevents accidental overwrite during service mode. | Use Scenario: Enabling/disabling premium features (e.g., VLAN support, QoS tiers) in enterprise switches via encrypted license keys. IC Role / Device Role / Timing Role: Secure feature database storing encrypted license tokens; accessed via dedicated security controller interface. Use Value: User-programmable 128-word Security ID space stores revocable license metadata; erase-suspend allows concurrent feature activation and background diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF1602C-70-4C-B3KE | Top-boot block protection (FE000H–FFFFFH) instead of bottom-boot; identical timing, voltage, and command set | Used where bootloader resides in highest memory region, not lowest - incompatible for systems requiring bottom-boot layout | Select only if board design allocates boot code to top 8 KWord; pinout and interface are identical |
| MX29LV160DBTI-70G | 16 Mbit x16, 70 ns, 2.7–3.6 V, but uses different command sequences and lacks Security ID; endurance rated at 100,000 cycles | Requires firmware driver modification due to non-JEDEC-compatible erase commands; no hardware-assisted security features | Choose when cost sensitivity outweighs need for erase-suspend or secure ID; verify full command compatibility before integration |
Compared with SST39VF1602C-70-4C-B3KE, the SST39VF1601C-70-4C-B3KE provides bottom-boot protection essential for legacy bootloader layouts, while MX29LV160DBTI-70G offers functional equivalence without security or suspend capabilities - making SST39VF1601C-70-4C-B3KE optimal for safety-critical or field-upgradable designs requiring guaranteed boot integrity.
Availability
SST39VF1601C-70-4C-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment bootloader deployment, and medical device configuration memory requiring stable component supply across extended production lifecycles.
Supply support for SST39VF1601C-70-4C-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and memory solutions, with emphasis on reliability, low-power design, and long-term product availability.
The SST39VF1601C-70-4C-B3KE belongs to Microchip's SST SuperFlash® MPF+ family, engineered for embedded systems requiring robust, field-upgradable nonvolatile storage with deterministic timing and hardware-based data protection.
FAQ
What is the boot block configuration of the SST39VF1601C-70-4C-B3KE?
The SST39VF1601C-70-4C-B3KE implements bottom-boot block protection, securing the lowest 8 KWord (00000H–01FFFH) from inadvertent erase or program operations when the WP# pin is asserted low. This architecture ensures bootloader code remains intact during firmware updates to higher memory regions, and differs from the top-boot SST39VF1602C variant.
Does the SST39VF1601C-70-4C-B3KE support erase-suspend functionality?
Yes, the SST39VF1601C-70-4C-B3KE supports erase-suspend/resume via the B0H command, allowing host systems to temporarily halt an ongoing sector or block erase to read or program other memory locations. This capability is essential for real-time systems where uninterrupted access to critical data during background erase is required.
What package type is used for the SST39VF1601C-70-4C-B3KE?
The SST39VF1601C-70-4C-B3KE is packaged in a 48-ball WFBGA (4 mm × 6 mm) with ball pitch of 0.5 mm. This ultra-compact, RoHS-compliant package supports high-density PCB layouts and thermal performance requirements typical of space-constrained embedded applications.
How does the SST39VF1601C-70-4C-B3KE indicate completion of a program or erase operation?
The SST39VF1601C-70-4C-B3KE provides three concurrent status mechanisms: Ready/Busy# (RY/BY#) open-drain output, Data# Polling (DQ7 toggling complement), and Toggle Bits (DQ6 and DQ2). These allow flexible host-side synchronization without fixed timeout delays, improving system efficiency during write-intensive operations.
Is the SST39VF1601C-70-4C-B3KE compatible with JEDEC-standard x16 flash interfaces?
Yes, the SST39VF1601C-70-4C-B3KE fully complies with JEDEC-standard pinouts and command sets for x16 parallel flash memory. It supports standard microprocessor bus protocols including CE#/OE#/WE# control, latched address/data, and common flash interface (CFI) query - enabling drop-in replacement in existing NOR flash designs.
SST39VF1601C-70-4C-B3KE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF1601C-70-4C-B3KE FAQ
1.How can I place an order for SST39VF1601C-70-4C-B3KE through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1601C-70-4C-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1601C-70-4C-B3KE reliable?
The price and inventory of SST39VF1601C-70-4C-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1601C-70-4C-B3KE is usually 5 days.
3.What payment methods are accepted for SST39VF1601C-70-4C-B3KE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1601C-70-4C-B3KE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1601C-70-4C-B3KE?
SST39VF1601C-70-4C-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1601C-70-4C-B3KE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1601C-70-4C-B3KE?
For technical support, including SST39VF1601C-70-4C-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1601C-70-4C-B3KE requirements.
6.How does Aetrix verify that SST39VF1601C-70-4C-B3KE is sourced from the original manufacturer or authorized distributors?
All SST39VF1601C-70-4C-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1601C-70-4C-B3KE meets industry standards.
7.What is the process for return or replacement of SST39VF1601C-70-4C-B3KE?
All SST39VF1601C-70-4C-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1601C-70-4C-B3KE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1601C-70-4C-B3KE part is unused and in its original packaging.
Return procedure for SST39VF1601C-70-4C-B3KE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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