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Microchip Technology SST39VF1601C-70-4C-B3KE-T
- Part No.:
- SST39VF1601C-70-4C-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF1601C-70-4C-B3KE-T.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,041
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Product details
Overview
SST39VF1601C-70-4C-B3KE-T from Silicon Storage Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus memory IC with bottom-boot block protection, 70 ns read access time, 2.7–3.6 V single-supply operation, and JEDEC-standard x16 asynchronous interface. It delivers 100,000 program/erase cycles and >100-year data retention for embedded firmware storage in industrial controllers and legacy system upgrades.
For engineers reviewing the SST39VF1601C-70-4C-B3KE-T datasheet, SST39VF1601C-70-4C-B3KE-T pinout, SST39VF1601C-70-4C-B3KE-T application, or SST39VF1601C-70-4C-B3KE-T equivalent, this page provides verified package mapping (48-ball WFBGA), hardware block-protection behavior (bottom 8 KWord), sector/block/chip erase timing, RY/BY# status signaling, and SuperFlash reliability metrics - all confirmed from the official S71380-04-000 datasheet.
Technical Context
The SST39VF1601C-70-4C-B3KE-T implements SST's proprietary SuperFlash split-gate cell technology, enabling fixed 7 µs word-program and 18 ms sector/block-erase times independent of cycle count. Its architecture supports uniform 2 KWord sectors and flexible non-uniform blocks (thirty-one 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord).
It features latched address/data, CMOS I/O compatibility, hardware write protection via WP#, dedicated RST# reset input, and open-drain RY/BY# output with external pull-up requirement. Command execution follows JEDEC-standard sequences using CE#, OE#, and WE# control with address/data bus multiplexing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words) - supports full firmware image storage for 8/16-bit microcontrollers. |
| Read Access Time | 70 ns - enables direct execution from flash (XIP) in systems with ≤14 MHz bus timing. |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V. |
| Endurance | 100,000 program/erase cycles - sufficient for field firmware updates over 10+ years in industrial deployments. |
| Data Retention | >100 years - ensures long-term configuration storage without refresh in unpowered equipment. |
| Erase Architecture | Uniform 2 KWord sectors + mixed-size blocks - allows granular updates (e.g., parameter tables) and bulk reprogramming (e.g., full firmware). |
| Write Detection | Toggle Bit (DQ6), Data# Polling (DQ7), and RY/BY# - provides three independent methods to synchronize host software with internal operations. |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, bottom-side thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus; A19–A11 select block during erase, A11–A0 select sector or word during program/read. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; tri-stated when CE# or OE# high; latched on rising edge of WE#/CE# during writes. |
| CE# | Chip Enable | Active-low device selection; must be low for all write operations and valid reads; enables standby current (3 µA). |
| OE# | Output Enable | Active-low output gating; controls DQ bus drive; high or floating places outputs in high-Z state. |
| WE# | Write Enable | Active-low write control; latches address/data on falling/rising edges per JEDEC command sequence timing. |
| WP# | Hardware Write Protect | Active-low protection for bottom 8 KWord boot block (00000H–01FFFH); grounded to prevent accidental erase/program. |
| RST# | Hardware Reset | Active-low hard reset; terminates ongoing program/erase and forces return to read mode within TRP (min 100 ns). |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; requires 10–100 kΩ pull-up to VDD; low = active erase/program, high = ready for next command. |
| VDD | Power Supply | 2.7–3.6 V core supply; powers all internal logic and SuperFlash tunneling circuitry. |
| VSS | Ground | Reference ground for all I/O and core functions; two dedicated VSS balls in WFBGA package. |
| NC | No Connect | Unbonded pins (A19, A18, A17, A16, A15, A14, A13, A12, A11, A10, A9, A8, A7, A6, A5, A4, A3, A2, A1, A0, DQ15–DQ0, CE#, OE#, WE#, WP#, RST#, RY/BY#, VDD, VSS) - no electrical function; must remain unconnected. |
Key Features
| Feature | Design Value |
|---|---|
| SuperFlash Technology | Split-gate cell with thick-oxide injector enables fixed 7 µs program and 18 ms erase times across full lifetime - eliminates software de-rating. |
| Bottom Boot Block Protection | Hardware lock on bottom 8 KWord (00000H–01FFFH) prevents corruption of bootloader code during field updates. |
| Erase-Suspend/Resume | Allows read access to non-suspended sectors during erase - enables real-time status display or interrupt handling without aborting erase. |
| Security ID Space | Factory-programmed 128-bit SST ID + 128-word user-programmable space - supports device authentication and secure firmware binding. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid read access - cuts power in burst-read applications like BIOS initialization. |
Applications
| Industrial PLC Firmware Storage | Legacy Embedded System Upgrade |
|---|---|
|
Use Scenario: Storing ladder logic firmware and I/O configuration in programmable logic controllers operating in harsh environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile program memory mapped to microcontroller address space; accessed via x16 asynchronous bus with 70 ns timing. Use Value: Bottom-boot protection prevents accidental overwrite of critical startup routines during remote firmware updates over Modbus RTU. |
Use Scenario: Replacing obsolete EPROMs in medical diagnostic equipment requiring field-upgradable calibration tables and safety-critical boot code. IC Role / Device Role / Timing Role: Drop-in replacement for 48-pin TSOP EPROMs; uses identical JEDEC x16 pinout and command set. Use Value: 100,000-cycle endurance supports 50+ field recalibrations over product lifetime without hardware revision. |
| Automotive Body Control Module | Networking Equipment Configuration |
|
Use Scenario: Holding vehicle-specific configuration data (e.g., door lock logic, lighting profiles) in body control modules subject to automotive temperature cycling. IC Role / Device Role / Timing Role: Parameter storage accessed during power-on initialization; erased only during dealer reprogramming via CAN diagnostics. Use Value: >100-year data retention ensures configuration integrity across full vehicle service life without battery backup. |
Use Scenario: Storing switch/router boot images and VLAN configuration in enterprise networking gear requiring zero-downtime firmware patches. IC Role / Device Role / Timing Role: Dual-image storage partitioned across boot block and main array; supports A/B firmware swapping. Use Value: Sector-erase capability enables atomic 2 KWord configuration updates without disrupting active packet forwarding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV160DBTI-70G | 16 Mbit x16, 70 ns, 2.7–3.6 V, top-boot configuration (FE000H–FFFFFH), no RY/BY# pin | Requires PCB layout change due to top-boot address map and missing RY/BY# status signal | Select only if top-boot protection aligns with system bootloader location and host firmware can rely solely on DQ6/DQ7 polling. |
| EN29LV160AT-70IP | 16 Mbit x16, 70 ns, 2.7–3.6 V, bottom-boot, includes RY/BY# but lacks Erase-Suspend capability | Supports same boot block address (00000H–01FFFH) and pinout, but cannot pause erase for real-time reads | Prefer when Erase-Suspend is not required and cost sensitivity outweighs advanced suspend/resume functionality. |
Compared with MX29LV160DBTI-70G and EN29LV160AT-70IP, the SST39VF1601C-70-4C-B3KE-T uniquely combines bottom-boot hardware protection, RY/BY# status signaling, and Erase-Suspend - enabling safer field updates and deterministic timing in resource-constrained hosts.
Availability
SST39VF1601C-70-4C-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy embedded system upgrades, automotive body control modules, and networking equipment configuration requiring stable component supply and long-lifecycle support.
Supply support for SST39VF1601C-70-4C-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Silicon Storage Technology (SST) was a fabless semiconductor company specializing in high-reliability NOR flash memory, acquired by Microchip Technology in 2010. SST pioneered SuperFlash technology for embedded applications.
The SST39VF1601C-70-4C-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for cost-sensitive, high-reliability firmware and configuration storage in industrial, automotive, and networking systems where long data retention and robust write protection are mandatory.
FAQ
What is the boot block configuration of the SST39VF1601C-70-4C-B3KE-T?
The SST39VF1601C-70-4C-B3KE-T implements bottom-boot block protection, securing the lowest 8 KWord (32 KB) memory region from accidental erase or program when WP# is grounded. This corresponds to address range 00000H–01FFFH, preserving bootloader code during field firmware updates. The SST39VF1601C-70-4C-B3KE-T datasheet explicitly confirms this in Table 2 and Section "Hardware Block Protection".
Does the SST39VF1601C-70-4C-B3KE-T require an external VPP voltage for programming?
No, the SST39VF1601C-70-4C-B3KE-T does not require external VPP. It generates all necessary high-voltage programming pulses internally using its 2.7–3.6 V supply rail. Table 9 (VPP min/max = 0000H) and the "Automatic Write Timing" feature description confirm internal VPP generation - eliminating need for charge pumps or auxiliary power supplies in the host design.
How does the SST39VF1601C-70-4C-B3KE-T indicate completion of a program or erase operation?
The SST39VF1601C-70-4C-B3KE-T provides three concurrent status detection methods: Toggle Bit (DQ6 toggles until operation completes), Data# Polling (DQ7 complements during operation, returns true data upon completion), and Ready/Busy# (RY/BY# open-drain output pulled low during operation). All are validated in the official datasheet Figures 9–10 and Table 1.
What package type is used for the SST39VF1601C-70-4C-B3KE-T?
The SST39VF1601C-70-4C-B3KE-T uses a 48-ball WFBGA package (4 mm × 6 mm, 0.5 mm pitch), as indicated by the "B3KE" suffix and confirmed in Figure 4 and Table 4 of the S71380-04-000 datasheet. This ultra-compact package supports high-density PCB layouts while maintaining thermal performance for industrial ambient temperatures.
Can the SST39VF1601C-70-4C-B3KE-T be used as a direct replacement for TSOP-packaged flash devices?
The SST39VF1601C-70-4C-B3KE-T shares identical JEDEC x16 pinout, command set, and timing specifications with TSOP variants (e.g., SST39VF1601C-70-4C-EKE), but requires PCB redesign due to WFBGA vs. TSOP mechanical form factor, soldering profile, and ball-to-pad routing. Electrical compatibility is maintained, but physical replacement is not possible without board revision.
SST39VF1601C-70-4C-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF1601C-70-4C-B3KE-T FAQ
1.How can I place an order for SST39VF1601C-70-4C-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1601C-70-4C-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1601C-70-4C-B3KE-T reliable?
The price and inventory of SST39VF1601C-70-4C-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1601C-70-4C-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF1601C-70-4C-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1601C-70-4C-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1601C-70-4C-B3KE-T?
SST39VF1601C-70-4C-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1601C-70-4C-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1601C-70-4C-B3KE-T?
For technical support, including SST39VF1601C-70-4C-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1601C-70-4C-B3KE-T requirements.
6.How does Aetrix verify that SST39VF1601C-70-4C-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF1601C-70-4C-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1601C-70-4C-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF1601C-70-4C-B3KE-T?
All SST39VF1601C-70-4C-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1601C-70-4C-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1601C-70-4C-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF1601C-70-4C-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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