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Microchip Technology SST39VF1601C-70-4I-B3KE

Part No.:
SST39VF1601C-70-4I-B3KE
Manufacturer:
Microchip Technology
Category:
Memory
Package:
48-TFBGA
Datasheet:
AetrixSST39VF1601C-70-4I-B3KE.pdf
Description:
IC FLASH 16MBIT PARALLEL 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:484

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Product details

Overview

SST39VF1601C-70-4I-B3KE from Microchip Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus (MPF+) memory IC with 70 ns read access time, single 2.7–3.6 V supply operation, and bottom-boot block protection. It delivers 100,000 program/erase cycles endurance and >100-year data retention, supporting embedded firmware storage in industrial controllers and legacy BIOS modules.

For engineers reviewing the SST39VF1601C-70-4I-B3KE datasheet, SST39VF1601C-70-4I-B3KE pinout, SST39VF1601C-70-4I-B3KE application, or SST39VF1601C-70-4I-B3KE equivalent, key selection criteria include boot-block architecture (bottom 8 KWord), JEDEC-compliant x16 interface timing, RY/BY# status signaling, and hardware write-protection via WP# pin - all critical for secure, field-upgradable firmware designs.

Technical Context

The SST39VF1601C-70-4I-B3KE implements SST's proprietary SuperFlash technology with split-gate cells and thick-oxide tunneling injectors, enabling fixed erase/program times independent of cycle count. Its command-set architecture supports JEDEC-standard software data protection (SDP) with three-byte unlock sequences for word-program and six-byte sequences for sector/block/chip-erase operations.

It features dual status detection: Data# Polling (DQ7) and Toggle Bit (DQ6/DQ2), plus open-drain RY/BY# output requiring external 10 kΩ–100 kΩ pull-up. The device includes hardware reset (RST#), latched address/data paths, and a 256-word Security ID space (128-bit factory + 128-word user programmable).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization1M × 16 (16 Mbit); supports x16 parallel bus interface with A0–A19 addressing
Read Access Time70 ns; enables direct execution from flash (XIP) in microcontroller systems without wait states at moderate clock speeds
Supply Voltage2.7–3.6 V; compatible with 3.3 V logic domains and tolerant of brown-out conditions down to 2.7 V
Endurance & Retention100,000 cycles / >100 years; validated for long-life industrial firmware updates and configuration storage
Erase ArchitectureUniform 2 KWord sectors + flexible blocks (one 8K, two 4K, one 16K, thirty-one 32K); allows granular firmware patching
Write ProtectionHardware bottom-boot block (00000H–01FFFH); prevents accidental overwrite of bootloader code when WP# = low
Power Consumption9 mA active (5 MHz), 3 µA standby/auto-low-power; reduces system-level power budget in always-on edge devices

Pinout & Package

Package: 48-ball WFBGA (4 mm × 6 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).

Pin/TerminalCircuit RoleDesign Meaning
A0–A19Address InputsAMS = A19; during sector-erase, A11–A19 select sector; during block-erase, A15–A19 select block
DQ0–DQ15Data I/OBi-directional x16 data bus; outputs tri-stated when CE# or OE# high; internally latched on write
CE#Chip EnableActive-low chip select; must be low to enable read/write; controls address latch timing on falling edge
OE#Output EnableActive-low output gate; used with CE# to initiate read; high disables output drivers
WE#Write EnableActive-low write control; latches data on rising edge; initiates internal program/erase after sixth pulse
WP#Write ProtectActive-low hardware lock for bottom 8 KWord boot block (00000H–01FFFH); floating = internally pulled high
RST#ResetActive-low hardware reset; forces return to read mode; terminates in-progress erase/program
RY/BY#Ready/Busy#Open-drain status output; low = busy (erase/program in progress); requires external pull-up resistor
VDDPower Supply2.7–3.6 V core and I/O supply; decoupling required per JEDEC guidelines
VSSGroundPrimary ground reference; two dedicated VSS pins in WFBGA package
NCNo ConnectionUnbonded pads (e.g., ball A19, C1, E1, G1 in WFBGA); must remain unconnected

Key Features

FeatureDesign Value
Erase-Suspend/ResumeAllows temporary halt of sector/block erase to read or program other locations - essential for real-time firmware update without full device stall
Auto Low Power ModeReduces active read current from 9 mA to 3 µA after valid read access - cuts dynamic power by >99% during idle polling intervals
Security ID Space256-word (128-bit factory + 128-word user) tamper-resistant identity storage - supports secure boot authentication and device binding
Common Flash Interface (CFI)Standardized query mode (98H command) provides runtime discoverability of geometry, timing, and command set - simplifies BSP portability across flash vendors
JEDEC Pinout & Command ComplianceFull x16 memory pin compatibility and command mapping per JEDEC Standard JESD21-C - ensures drop-in replacement in legacy designs

Applications

Industrial PLC Firmware StorageLegacy PC BIOS/UEFI Module

Use Scenario: Storing and updating ladder logic firmware in DIN-rail mounted programmable logic controllers operating in harsh temperature environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Nonvolatile program memory with bottom-boot protection ensuring bootloader integrity during field firmware upgrades over RS-485 or CAN.

Use Value: 100,000-cycle endurance and >100-year retention guarantee firmware reliability over 15+ year product lifecycles without recalibration or replacement.

Use Scenario: Holding BIOS initialization code and hardware configuration tables in legacy desktop/server motherboards using LPC or FWH interfaces.

IC Role / Device Role / Timing Role: x16 parallel flash memory mapped into CPU address space; 70 ns access enables zero-wait-state execution during POST.

Use Value: Bottom-boot block (00000H–01FFFH) isolates reset vector and boot ROM from accidental overwrite during BIOS update utilities.

Medical Device Configuration MemoryAutomotive Body Control Module (BCM)

Use Scenario: Storing calibrated sensor offsets, calibration coefficients, and regulatory compliance settings in FDA-cleared diagnostic imaging equipment.

IC Role / Device Role / Timing Role: Secure, field-updatable configuration store with hardware WP# lock and Security ID for audit-trail binding to device serial number.

Use Value: User-programmable 128-word Security ID enables cryptographic binding of calibration data to hardware identity - meeting IEC 62304 traceability requirements.

Use Scenario: Hosting lighting control logic and door-lock actuation firmware in automotive BCMs requiring AEC-Q100 Grade 3 qualification.

IC Role / Device Role / Timing Role: Boot memory with RST#-driven recovery and RY/BY# status signaling for fail-safe firmware validation during cold start.

Use Value: Erase-suspend capability permits concurrent diagnostics (reading DTCs) while background firmware patching occurs - improving serviceability uptime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SST39VF1602C-70-4I-B3KETop-boot block (FE000H–FFFFFH) instead of bottom-boot; identical timing, voltage, and command setUsed where bootloader resides at top of address space (e.g., newer x86 BIOS layouts)Select based on boot block location alignment with host processor reset vector mapping
MX29LV160DTTI-70G16 Mbit x16, 70 ns, but uses different command sequences and lacks Security ID; no erase-suspendLower-cost alternative where secure identity and background erase are not requiredValid for cost-sensitive consumer electronics where firmware update frequency and security are minimal

Compared with SST39VF1602C-70-4I-B3KE and MX29LV160DTTI-70G, the SST39VF1601C-70-4I-B3KE uniquely combines bottom-boot protection, erase-suspend, and factory/user Security ID - making it optimal for safety-critical firmware storage where bootloader integrity and device identity binding are mandatory.

Availability

SST39VF1601C-70-4I-B3KE is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy PC BIOS modules, and medical device configuration memory requiring stable component supply across extended production lifecycles.

Supply support for SST39VF1601C-70-4I-B3KE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global provider of microcontrollers, analog components, and memory solutions, with leadership in embedded control and secure connectivity.

The SST39VF160xC family was designed specifically for reliable, low-voltage, field-upgradable firmware and configuration storage in industrial, medical, and computing systems demanding long-term data integrity.

FAQ

What boot block architecture does the SST39VF1601C-70-4I-B3KE implement?

The SST39VF1601C-70-4I-B3KE implements bottom-boot block protection covering address range 00000H–01FFFH (8 KWords). This architecture safeguards the reset vector and initial boot code from accidental erasure or programming when WP# is asserted low. Unlike the SST39VF1602C variant, which protects the top 8 KWord block, the SST39VF1601C-70-4I-B3KE is optimized for systems where the bootloader resides at the lowest physical address.

How does the SST39VF1601C-70-4I-B3KE indicate completion of an erase or program operation?

The SST39VF1601C-70-4I-B3KE provides three concurrent status mechanisms: Data# Polling (DQ7 toggles complement until completion), Toggle Bit (DQ6 alternates between 1 and 0 during operation), and Ready/Busy# (RY/BY# open-drain output pulled low during activity). All three are valid after the rising edge of the sixth WE# pulse for erase operations and fourth WE# pulse for program operations - enabling robust, interrupt-driven firmware update routines.

Does the SST39VF1601C-70-4I-B3KE support simultaneous read and erase operations?

Yes, the SST39VF1601C-70-4I-B3KE supports Erase-Suspend/Erase-Resume functionality. Issuing the B0H command halts an ongoing sector or block erase, allowing reads from any non-suspended location or word-programming into unprotected sectors. DQ2 toggling indicates erase-suspended status. This capability enables real-time diagnostics and partial firmware updates without full device interruption - a key advantage over basic NOR flash devices.

What is the purpose of the Security ID feature in the SST39VF1601C-70-4I-B3KE?

The SST39VF1601C-70-4I-B3KE includes a 256-word Security ID space: 128 bits factory-programmed by SST and 128 words user-programmable. This space supports secure device binding, cryptographic key storage, and calibration data anchoring. Once locked via the User Security ID Program Lock-Out command, the user segment becomes immutable - satisfying traceability and anti-counterfeiting requirements in regulated industries like medical and aerospace.

Is the SST39VF1601C-70-4I-B3KE pin-compatible with standard JEDEC x16 flash memories?

Yes, the SST39VF1601C-70-4I-B3KE conforms fully to JEDEC Standard JESD21-C for x16 flash pinouts and command sets. Its 48-ball WFBGA footprint matches industry-standard 48-ball packages, and its command protocol (including unlock sequences, sector/block addresses, and status reporting) aligns with JEDEC specifications - enabling drop-in replacement in existing designs that comply with this standard.

SST39VF1601C-70-4I-B3KE Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
SST39 MPF™
Package/Case:
48-TFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH
Memory Size:
16Mbit
Memory Organization:
1M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10µs
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (6x8)

SST39VF1601C-70-4I-B3KE FAQ

1.How can I place an order for SST39VF1601C-70-4I-B3KE through Aetrix?

Please submit a Request for Quotation (RFQ) for SST39VF1601C-70-4I-B3KE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SST39VF1601C-70-4I-B3KE reliable?

The price and inventory of SST39VF1601C-70-4I-B3KE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1601C-70-4I-B3KE is usually 5 days.

3.What payment methods are accepted for SST39VF1601C-70-4I-B3KE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1601C-70-4I-B3KE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SST39VF1601C-70-4I-B3KE?

SST39VF1601C-70-4I-B3KE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SST39VF1601C-70-4I-B3KE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SST39VF1601C-70-4I-B3KE?

For technical support, including SST39VF1601C-70-4I-B3KE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1601C-70-4I-B3KE requirements.

6.How does Aetrix verify that SST39VF1601C-70-4I-B3KE is sourced from the original manufacturer or authorized distributors?

All SST39VF1601C-70-4I-B3KE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1601C-70-4I-B3KE meets industry standards.

7.What is the process for return or replacement of SST39VF1601C-70-4I-B3KE?

All SST39VF1601C-70-4I-B3KE units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1601C-70-4I-B3KE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SST39VF1601C-70-4I-B3KE part is unused and in its original packaging.

Return procedure for SST39VF1601C-70-4I-B3KE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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