My Inquiry
My Account
Microchip Technology SST39VF1601C-70-4I-B3KE-T
- Part No.:
- SST39VF1601C-70-4I-B3KE-T
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
SST39VF1601C-70-4I-B3KE-T.pdf
- Description:
- IC FLASH 16MBIT PARALLEL 48TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:9,512
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SST39VF1601C-70-4I-B3KE-T from Silicon Storage Technology is a 16 Mbit (1M × 16) CMOS Multi-Purpose Flash Plus memory IC with bottom-boot block protection, 70 ns read access time, 2.7–3.6 V single-supply operation, and JEDEC-standard x16 asynchronous interface. It delivers 100,000 program/erase cycles and >100 years data retention for embedded firmware storage in industrial controllers and legacy system BIOS.
For engineers reviewing the SST39VF1601C-70-4I-B3KE-T datasheet, SST39VF1601C-70-4I-B3KE-T pinout, SST39VF1601C-70-4I-B3KE-T application, or SST39VF1601C-70-4I-B3KE-T equivalent, this page provides verified package mapping (48-ball WFBGA), hardware block-protection behavior (bottom 8 KWord), erase-suspend capability, RY/BY# status signaling, and sector/block/chip-erase timing values confirmed in the official S71380-04-000 datasheet.
Technical Context
The SST39VF1601C-70-4I-B3KE-T implements SuperFlash split-gate technology with thick-oxide tunneling injector, enabling fixed erase/program times independent of cycle count-unlike conventional flash where timing degrades over endurance life. Its command set follows JEDEC-standard pinouts and software protocols including CFI Query, Security ID, and Software Data Protection.
It supports three erase granularities: uniform 2 KWord sectors, flexible blocks (thirty-one 32 KWord, one 16 KWord, two 4 KWord, one 8 KWord), and full-chip erase-all initiated via six-byte command sequences. Hardware write protection is implemented via WP# pin tied low to lock the bottom 8 KWord boot block (00000H–01FFFH), while RST# enables hardware reset to read mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (1,048,576 × 16-bit words): sufficient for full BIOS/firmware images in space-constrained embedded systems. |
| Read Access Time | 70 ns: enables direct execution from flash (XIP) in microcontroller-based systems without wait states at moderate clock speeds. |
| Supply Voltage | 2.7–3.6 V: compatible with 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V during program/erase. |
| Endurance | 100,000 program/erase cycles: supports field-updatable firmware with multi-year service life under typical update frequency. |
| Data Retention | >100 years: ensures nonvolatile storage integrity across product lifecycle without refresh or backup power. |
| Erase Times | Sector/Block: 18 ms typ., Chip: 40 ms typ.-predictable timing simplifies real-time OS task scheduling during firmware updates. |
| Power Consumption | Active: 9 mA typ. @ 5 MHz; Standby/Auto Low Power: 3 µA typ.-reduces quiescent current in always-on control modules. |
Pinout & Package
Package: 48-ball WFBGA (4 mm × 6 mm), RoHS-compliant, bottom-side thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus; A19–A11 select block during Block-Erase, A11–A0 select sector during Sector-Erase. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; tri-stated when CE# or OE# high; latched on rising edge of WE#/CE# during writes. |
| CE# | Chip Enable | Active-low device selection; asserts internal logic only when low-critical for multi-device memory decoding. |
| OE# | Output Enable | Active-low output gating; controls DQ bus drive without affecting internal state-enables shared-bus arbitration. |
| WE# | Write Enable | Controls write timing; falling edge latches address, rising edge latches data-synchronizes command sequence execution. |
| WP# | Write Protect | Hardware lock for bottom 8 KWord boot block (00000H–01FFFH); grounded = protected, floating = unprotected (internal pull-up). |
| RST# | Reset | Hardware abort of in-progress erase/program; forces return to Read mode within TRP (min. 100 ns pulse width required). |
| RY/BY# | Ready/Busy# | Open-drain status indicator; pulled low during erase/program-supports wired-OR monitoring across multiple flash devices. |
| VDD | Power Supply | 2.7–3.6 V core supply; powers all internal logic and charge pumps-no external VPP required due to on-chip generation. |
| VSS | Ground | Reference for all I/O and internal circuitry; requires low-impedance connection to minimize noise coupling during high-speed reads. |
| NC | No Connection | Unbonded pins (e.g., ball E1, H1 in WFBGA layout)-must remain unconnected per datasheet Figure 4. |
Key Features
| Feature | Design Value |
|---|---|
| Erase-Suspend/Resume | Allows read access to non-suspended sectors during active erase-enables real-time diagnostics or UI responsiveness during firmware update. |
| Auto Low Power Mode | Reduces active read current from 9 mA to 3 µA after valid read access-eliminates need for external power-gating logic in battery-backed systems. |
| Security ID Space | 128-bit factory-programmed ID + 128-word user-programmable segment-supports secure boot authentication and device-specific configuration binding. |
| Hardware Block Protection | Bottom 8 KWord (00000H–01FFFH) locked when WP# = low-prevents accidental corruption of boot code during field firmware upgrades. |
| End-of-Write Detection | Triple-method status: Toggle Bit (DQ6), Data# Polling (DQ7), and RY/BY#-provides software/hardware flexibility for timeout-free write completion polling. |
Applications
| Industrial PLC Firmware Storage | Legacy PC BIOS Memory |
|---|---|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C). IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable 70 ns read access and hardware boot-block protection against overwrite during remote updates. Use Value: Ensures deterministic boot sequence integrity and eliminates need for external EEPROM backup in mission-critical automation systems. |
Use Scenario: Replacing obsolete 28Fxxx-series flash in desktop motherboard BIOS chips requiring JEDEC x16 compatibility and 3.3 V operation. IC Role / Device Role / Timing Role: Boot ROM replacement with bottom-boot architecture matching legacy BIOS memory map (00000H–01FFFH protected region). Use Value: Enables drop-in replacement without PCB redesign-same 48-ball WFBGA footprint and identical command set as predecessor parts. |
| Medical Device Configuration Memory | Telecom Line Card Boot Image |
Use Scenario: Storing calibration tables and safety-critical configuration parameters in FDA-cleared diagnostic equipment with long product lifecycles. IC Role / Device Role / Timing Role: High-reliability nonvolatile storage leveraging >100-year data retention and 100,000-cycle endurance for infrequent but critical parameter updates. Use Value: Eliminates recalibration drift risk and satisfies IEC 62304 traceability requirements through guaranteed data integrity over device lifetime. |
Use Scenario: Hosting boot firmware for carrier-grade DSLAM line cards requiring fast field-upgradable images with zero downtime during maintenance windows. IC Role / Device Role / Timing Role: Dual-bank capable flash supporting background erase-suspend operations-allows live traffic handling while updating secondary image bank. Use Value: Reduces mean time to repair (MTTR) by enabling concurrent read/write operations without service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29LV160DBTI-70G | 16 Mbit x16, 70 ns, bottom-boot, 2.7–3.6 V-but uses different command set (non-JEDEC standard) and lacks Erase-Suspend. | Requires firmware driver rewrite; no suspend/resume capability limits real-time system responsiveness during updates. | Select only if existing codebase already supports Macronix command protocol and suspend functionality is unnecessary. |
| EN29LV160AT-70TP | 16 Mbit x16, 70 ns, top-boot (FE000H–FFFFFH), same voltage range-but no Security ID feature and 50,000-cycle endurance rating. | Top-boot architecture incompatible with SST39VF1601C's bottom-boot memory map; lower endurance reduces field update margin. | Acceptable only for cost-sensitive designs where boot block location is flexible and update frequency is low. |
Compared with MX29LV160DBTI-70G and EN29LV160AT-70TP, the SST39VF1601C-70-4I-B3KE-T offers JEDEC-standard command compatibility, hardware-supported erase-suspend, and higher endurance-making it preferable for systems requiring firmware update robustness and cross-vendor design portability.
Availability
SST39VF1601C-70-4I-B3KE-T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy PC BIOS replacement, medical device configuration memory, and telecom line card boot image applications requiring stable component supply across extended production lifecycles.
Supply support for SST39VF1601C-70-4I-B3KE-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Silicon Storage Technology (SST) was a fabless semiconductor company specializing in high-reliability flash memory solutions, acquired by Microchip Technology in 2010. Its SuperFlash technology emphasized manufacturability and endurance.
The SST39VF1601C-70-4I-B3KE-T belongs to the Multi-Purpose Flash Plus (MPF+) product line, designed specifically for embedded systems requiring robust, low-voltage, pin-compatible flash replacements with enhanced data retention and simplified firmware update workflows.
FAQ
What is the boot block configuration of the SST39VF1601C-70-4I-B3KE-T?
The SST39VF1601C-70-4I-B3KE-T implements bottom-boot architecture, protecting the lowest 8 KWord (00000H–01FFFH) as the hardware-locked boot block when WP# is grounded. This matches legacy BIOS memory maps and prevents accidental overwrite of startup code during firmware updates. The SST39VF1601C-70-4I-B3KE-T datasheet Table 2 and Figure 5 confirm this configuration is exclusive to the "1C" variant-distinct from the top-boot SST39VF1602C.
Does the SST39VF1601C-70-4I-B3KE-T require an external VPP voltage for programming?
No, the SST39VF1601C-70-4I-B3KE-T generates internal VPP for erase and program operations using its on-chip charge pump, eliminating the need for external high-voltage supplies. This is confirmed in the "Automatic Write Timing" section of the datasheet and Table 9 (VPP min/max = 0000H), making the SST39VF1601C-70-4I-B3KE-T compatible with standard 3.3 V-only system designs.
How does the Auto Low Power mode function in the SST39VF1601C-70-4I-B3KE-T?
The SST39VF1601C-70-4I-B3KE-T enters Auto Low Power mode automatically after a valid read cycle completes, reducing active current from 9 mA to 3 µA. It exits instantly on any address or control signal transition-no access time penalty. This behavior is documented in the "Device Operation" section and applies only after the first address transition post-power-up, not when CE# is held low continuously.
Can the SST39VF1601C-70-4I-B3KE-T be used in systems requiring JEDEC-standard command sets?
Yes, the SST39VF1601C-70-4I-B3KE-T fully conforms to JEDEC Standard JESD21-C for flash EEPROM pinouts and command sets, including CFI Query, Software ID Entry, and standard Program/Erase sequences. This interoperability is explicitly stated in the "PRODUCT DESCRIPTION" and verified in Table 7 command tables-ensuring compatibility with generic flash drivers.
What is the purpose of the RY/BY# pin on the SST39VF1601C-70-4I-B3KE-T?
The RY/BY# pin on the SST39VF1601C-70-4I-B3KE-T is an open-drain ready/busy indicator that pulls low during active erase or program operations and floats high (with external pull-up) when idle. It enables hardware-driven polling without CPU overhead and supports wired-OR connection of multiple flash devices-critical for multi-chip memory subsystems in telecom and industrial systems.
SST39VF1601C-70-4I-B3KE-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SST39 MPF™
- Package/Case:
- 48-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10µs
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TFBGA (6x8)
SST39VF1601C-70-4I-B3KE-T FAQ
1.How can I place an order for SST39VF1601C-70-4I-B3KE-T through Aetrix?
Please submit a Request for Quotation (RFQ) for SST39VF1601C-70-4I-B3KE-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SST39VF1601C-70-4I-B3KE-T reliable?
The price and inventory of SST39VF1601C-70-4I-B3KE-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SST39VF1601C-70-4I-B3KE-T is usually 5 days.
3.What payment methods are accepted for SST39VF1601C-70-4I-B3KE-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SST39VF1601C-70-4I-B3KE-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SST39VF1601C-70-4I-B3KE-T?
SST39VF1601C-70-4I-B3KE-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SST39VF1601C-70-4I-B3KE-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SST39VF1601C-70-4I-B3KE-T?
For technical support, including SST39VF1601C-70-4I-B3KE-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SST39VF1601C-70-4I-B3KE-T requirements.
6.How does Aetrix verify that SST39VF1601C-70-4I-B3KE-T is sourced from the original manufacturer or authorized distributors?
All SST39VF1601C-70-4I-B3KE-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SST39VF1601C-70-4I-B3KE-T meets industry standards.
7.What is the process for return or replacement of SST39VF1601C-70-4I-B3KE-T?
All SST39VF1601C-70-4I-B3KE-T units undergo pre-shipment inspection (PSI). If there is an issue with SST39VF1601C-70-4I-B3KE-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SST39VF1601C-70-4I-B3KE-T part is unused and in its original packaging.
Return procedure for SST39VF1601C-70-4I-B3KE-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SST39VF1601C-70-4I-B3KE-T Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
